185:
156:
20:
45:
113:
198:
218:
241:
TO-204 is intended to replace previous definitions of flange-mounted packages with a 10.92 mm (0.430 in) pin spacing. The different outlines are now defined as variants of TO-204: TO-3 is renamed to TO-204-AA, TO-41 to TO-204-AB. A new package with a reduced maximum height of 7.62 mm
171:
The TO-3 package consists of a diamond-shaped base plate with diagonals of 40.13 mm (1.580 in) and 27.17 mm (1.070 in). The plate has two mounting holes on the long diagonal, with the centers spaced 30.15 mm (1.187 in) apart. The cap attached to one side of the plate
167:
The semiconductor die component is mounted on a raised platform on a metal plate, with the metal can welded on top of it; providing high heat conductivity and durability. The metal case is connected to the internal device and the leads are connected to the die with bonding wires.
139:
The case is used with high-power and high-current devices, on the order of a few tens of amperes current and up to a hundred watts of heat dissipation. The case surfaces are metal for good heat conductivity and durability. The metal-to-metal and metal-to-glass joints provide
242:(0.300 in) is added as TO-204-AC. Two additional variants specify pins thicker than the original 1.02 mm (0.040 in) to allow higher currents: 1.27 mm (0.050 in) for TO-204-AD and 1.52 mm (0.060 in) for TO-204-AE.
233:). Otherwise the TO-41 package has the same dimensions as the TO-3 package. Some variants of the TO-41 package have a third pin with a soldering pad connected to the case (e.g. AD133, AUY21). This 3-pin package was standardized by IEC as C14B/B28.
172:
brings the total height to up to 11.43 mm (0.450 in). Two pins on the other side of the plate are isolated from the package by individual glass-metal seals. The metal case forms the third connection (in the case of a
147:
Compared with equivalent plastic packages, the TO-3 is more costly. The spacing and dimensions of the case leads make it unsuitable for higher frequency (radio frequency) devices.
100:
power transistor 2N176 – the first power transistor to be put into quantity production. The lead spacing was originally intended to allow plugging the device into a then-common
209:
TO-3 package variants for integrated circuits can have more than two leads. The height of the cap and the thickness of the leads differs between variants of the TO-3 package.
1038:
1135:
597:
740:
124:
is used to improve heat transfer between the device case and the heat sink. Since the device case is one of the electrical connections, an
1530:
300:
1311:
1305:
1299:
1287:
1275:
1269:
1257:
1161:
1104:
631:
225:
The two pins of the TO-41 package end in soldering pads with holes in them to make it easier to solder wires to the pins for
1442:
1128:
96:. who was director of research of the Motorola Semiconductor Division. The first use of this design was for the germanium
937:
691:
1369:
961:
1556:
It is relatively common to find packages that contain other components than their designated ones, such as diodes or
1499:
1379:
889:
865:
120:
The metal package can be attached to a heat sink, making it suitable for devices dissipating several watts of heat.
1364:
1577:
1121:
427:
1070:
666:
1173:
1525:
778:
128:
may be required to electrically isolate the component from the heatsink. Insulating washers may be made of
66:
1408:
226:
173:
24:
1413:
1374:
1359:
1344:
1089:
610:
551:
MJ2955, PNP power transistor (not to be confused with a 2N2955 which is a small signal PNP transistor )
747:
97:
1540:
1204:
88:, normally via a thermally conductive but electrically insulating washer. The design originated at
1545:
1384:
1354:
1328:
1108:
125:
1535:
1504:
1144:
641:
230:
160:
58:
1520:
1403:
1349:
1196:
985:
133:
77:
stands for "Transistor
Outline" and relates to a series of technical drawings produced by
8:
1462:
1185:
807:
1489:
1479:
70:
838:
635:
1557:
1418:
1066:
366:
913:
503:
121:
93:
1494:
1447:
1437:
184:
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1010:
716:
155:
1571:
576:
plastic case used for power semiconductors with similar ratings to TO-3 cases
141:
785:
44:
1113:
480:
These standards have separate drawings for the package case and the base.
411:
386:
101:
19:
221:
AD133 transistor in a TO-41 package. The third pin connected to the case
62:
1484:
914:"EIAJ ED-7500A Standards for the Dimensions of Semiconductor Devices"
637:
FROM POSSUM HOLLER TO SINGAPORE The
Autobiography of VIRGIL E. BOTTOM
89:
85:
988:[GOST 18472—88 Semiconductor devices - basic dimensions]
112:
1293:
1281:
1263:
1251:
1179:
1167:
806:"Index by Device Type of Registered Transistor Outlines (TO)".
573:
545:
202:
36:
28:
1065:(4 ed.). Kluwer Technische Boeken B.V. 1991. p. 55.
197:
1245:
1239:
1233:
1227:
1153:
1093:
1039:"TGL 26713/11: Gehäuse für Halbleiterbauelemente - Bauform L"
605:
567:
554:
525:
344:
278:
78:
32:
1098:
1044:(in German). Leipzig: Verlag für Standardisierung. June 1988
986:"ГОСТ 18472—88 ПРИБОРЫ ПОЛУПРОВОДНИКОВЫЕ - Основные размеры"
84:
The TO-3 case has a flat surface which can be attached to a
1221:
1215:
531:
416:
391:
340:
129:
116:
Typical TO-3 mounting profile, with insulator from chassis
320:
217:
16:
Metal can semiconductor package for power semiconductors
144:
that protect the semiconductor from liquids and gases.
516:
866:"NPN Transistor for Powerful AF Output Stages 2N3055"
1013:[Semiconductor devices - basic dimensions]
494:
The maximum height is 8.63 mm (0.340 in).
837:
836:"Flange Mounted Header Family 0.430 Pin Spacing".
683:
1569:
1017:(in Russian). Rosstandart. 2017. pp. 50–52
1011:"ПРИБОРЫ ПОЛУПРОВОДНИКОВЫЕ - Основные размеры"
521:Common voltage regulator integrated circuits:
1129:
640:. Self published. p. 177. Archived from
625:
623:
229:(as opposed to soldering a TO-3 package on a
1033:
1031:
992:(in Russian). Rosstandart. 1988. p. 42
717:"Mounting Considerations for TO-3 Packages"
592:
590:
1531:List of integrated circuit packaging types
1143:
1136:
1122:
962:"Mullard Technical Handbook Book 1 Part 1"
620:
57:is a designation for a standardized metal
938:"Semiconductor and Photoelectric Devices"
689:
61:used for power semiconductors, including
1028:
847:. JEDEC. November 1982. pp. 174–177
714:
587:
216:
196:
183:
154:
111:
42:
18:
1188:(SOD-123 / SOD-323 / SOD-523 / SOD-923)
954:
831:
829:
490:
488:
486:
107:
1570:
1063:Kluwers Internationale Transistor Gids
629:
1117:
773:
771:
769:
767:
476:
474:
472:
245:
890:"Silicon NPN Power Transistor BU546"
826:
664:
483:
201:Power amplifier integrated circuit (
517:Common components in a TO-3 package
92:around 1955 from a group headed by
13:
764:
598:"JEDEC TO-3 package specification"
570:, smaller package of similar shape
469:
176:this is typically the collector).
14:
1589:
1083:
205:UL1403) in a TO-3 package variant
692:"Transistor Museum Oral History"
630:Bottom, Virgil (November 1992).
1055:
1003:
978:
930:
906:
882:
858:
497:
428:Kombinat Mikroelektronik Erfurt
150:
43:
1170:(DO-7 / DO-26 / DO-35 / DO-41)
799:
733:
708:
658:
27:packages, from left to right:
1:
580:
188:Dimensions TO-3 package in mm
179:
132:or other materials with good
67:silicon controlled rectifiers
1560:in transistor packages, etc.
1526:Integrated circuit packaging
967:. Mullard. 1974. p. 516
943:. Mullard. 1968. p. 539
7:
696:www.semiconductormuseum.com
671:www.semiconductormuseum.com
561:
227:point-to-point construction
192:
174:bipolar junction transistor
10:
1594:
1554:
1513:
1461:
1430:
1393:
1337:
1321:
1195:
1151:
690:Greenburg, Ralph (2008).
507:
426:
405:
399:
396:
258:
255:
252:
236:
1541:Surface-mount technology
840:JEDEC Publication No. 95
809:JEDEC Publication No. 95
632:"XIII Phoenix 1953–1958"
537:LM340, voltage regulator
212:
49:3D model of TO-3 package
1546:Through-hole technology
746:. JEDEC. Archived from
722:. Burr-Brown. p. 3
253:Standards organization
1578:Semiconductor packages
1176:(MELF / SOD-80 / LL34)
1145:Semiconductor packages
1109:National Semiconductor
557:, NPN power transistor
548:, NPN power transistor
222:
206:
189:
164:
117:
50:
40:
1536:Printed circuit board
815:. JEDEC. October 2010
231:printed circuit board
220:
200:
187:
161:Darlington transistor
158:
115:
59:semiconductor package
48:
22:
1521:Electronic packaging
541:Common transistors:
159:Inside of an MJ1000
134:thermal conductivity
108:Typical applications
94:Dr. Virgil E. Bottom
665:Ward, Jack (2007).
534:, voltage regulator
528:, voltage regulator
71:integrated circuits
23:Size comparison of
1558:voltage regulators
246:National standards
223:
207:
190:
165:
118:
51:
41:
1565:
1564:
1314:(Super-247) (SMT)
1308:(Super-220) (SMT)
1182:(SMA / SMB / SMC)
1105:Hermetic packages
616:on June 18, 2017.
465:
464:
367:British Standards
1585:
1138:
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1114:
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779:"Semiconductors"
775:
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730:
728:
727:
721:
712:
706:
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680:
678:
677:
667:"Motorola 2N176"
662:
656:
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646:
627:
618:
617:
615:
609:. Archived from
602:
594:
510:
509:
501:
495:
492:
481:
478:
259:Designation for
250:
249:
122:Thermal compound
53:In electronics,
47:
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1191:
1147:
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1101:from EESemi.com
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163:in TO-3 package
153:
110:
17:
12:
11:
5:
1591:
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1580:
1563:
1562:
1555:
1552:
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1514:Related topics
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1380:TSSOP / HTSSOP
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1092:standard from
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1084:External links
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142:hermetic seals
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98:alloy-junction
25:BJT transistor
15:
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3:
2:
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1304:
1302:(D3PAK) (SMT)
1301:
1298:
1296:(D2PAK) (SMT)
1295:
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1290:(I2PAK) (SMT)
1289:
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919:. JEITA. 1996
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787:
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753:on 2016-04-10
749:
742:
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697:
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686:
672:
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647:on 2016-03-15
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449:TGL 26713/11
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34:
30:
26:
21:
1505:WL-CSP / WLP
1375:TSOP / HTSOP
1284:(DPAK) (SMT)
1278:(IPAK) (SMT)
1272:(TH / Panel)
1266:(TH / Panel)
1260:(TH / Panel)
1254:(TH / Panel)
1242:(TH / Panel)
1212:(TH / Panel)
1209:
1099:TO-3 package
1062:
1057:
1046:. Retrieved
1019:. Retrieved
1005:
994:. Retrieved
980:
969:. Retrieved
956:
945:. Retrieved
932:
921:. Retrieved
908:
897:. Retrieved
895:. Telefunken
884:
873:. Retrieved
860:
849:. Retrieved
839:
817:. Retrieved
808:
801:
790:. Retrieved
786:Pro Electron
755:. Retrieved
748:the original
735:
724:. Retrieved
710:
699:. Retrieved
695:
685:
674:. Retrieved
670:
660:
649:. Retrieved
642:the original
636:
611:the original
604:
540:
520:
499:
379:SO-5B/SB2-2
374:SO-5A/SB2-2
240:
224:
208:
170:
166:
151:Construction
146:
138:
119:
83:
74:
54:
52:
1423:QUIP / QUIL
412:Rosstandart
387:Gosstandart
358:TC-3A/TB-3
102:tube socket
63:transistors
1431:Grid array
1370:SOP / SSOP
1322:Single row
1205:SOT / TSOT
1072:9020125192
1048:2021-06-15
1021:2021-06-17
996:2021-06-17
971:2021-06-14
947:2021-06-14
923:2021-06-14
899:2021-08-20
875:2021-08-20
851:2021-07-13
819:2021-07-13
792:2021-06-17
757:2021-06-21
726:2021-06-30
701:2021-07-14
676:2022-08-22
651:2022-08-22
581:References
432:TGL 11811
352:TC-3/TB-3
325:DIN 41872
305:IEC 60191
295:TO-204-AD
292:TO-204-AC
289:TO-204-AB
286:TO-204-AA
180:Dimensions
1485:Flip Chip
1404:QIP / QIL
1365:SO / SOIC
1355:Flat Pack
1350:DIP / DIL
1329:SIP / SIL
1197:3...5-pin
871:. Siemens
394:18472—88
349:ED-7500A
313:C14B/B18
308:C14A/B18
256:Standard
126:insulator
1572:Category
1394:Quad row
1338:Dual row
562:See also
419:R 57439
371:BS 3934
193:Variants
90:Motorola
86:heatsink
1164:(DO-27)
1152:Single
741:"TO-41"
504:Russian
69:, and,
1312:TO-274
1306:TO-273
1300:TO-268
1294:TO-263
1288:TO-262
1282:TO-252
1276:TO-251
1270:TO-247
1264:TO-220
1258:TO-202
1252:TO-126
1180:DO-214
1174:DO-213
1168:DO-204
1162:DO-201
1069:
788:. 1978
574:TO-220
546:2N3055
532:LM78xx
422:KT-9C
406:KT-9B
283:JEP95
267:TO-41
237:TO-204
39:, TO-3
37:TO-126
29:SOT-23
1463:Wafer
1246:TO-92
1240:TO-66
1234:TO-39
1228:TO-18
1154:diode
1107:from
1094:JEDEC
1042:(PDF)
1015:(PDF)
990:(PDF)
965:(PDF)
941:(PDF)
917:(PDF)
893:(PDF)
869:(PDF)
845:(PDF)
813:(PDF)
782:(PDF)
751:(PDF)
744:(PDF)
720:(PDF)
645:(DOC)
614:(PDF)
606:JEDEC
601:(PDF)
568:TO-66
555:KD503
526:LM317
458:L2A1
452:L2A2
397:KT-9
345:JEITA
279:JEDEC
264:TO-3
213:TO-41
79:JEDEC
33:TO-92
1500:UICC
1443:eWLB
1409:PLCC
1360:MSOP
1248:(TH)
1236:(TH)
1230:(TH)
1224:(TH)
1222:TO-8
1218:(TH)
1216:TO-5
1210:TO-3
1090:TO-3
1067:ISBN
508:КТ-9
441:Eea
435:Eeb
417:GOST
392:GOST
341:EIAJ
333:3B2
328:3A2
203:CEMI
130:mica
55:TO-3
1490:PoP
1480:CSP
1476:COG
1473:COF
1470:COB
1453:PGA
1448:LGA
1438:BGA
1419:QFP
1414:QFN
1400:LCC
1385:ZIP
1345:DFN
1186:SOD
321:DIN
301:IEC
1574::
1495:QP
1030:^
828:^
784:.
766:^
694:.
669:.
634:.
622:^
603:.
589:^
506::
485:^
471:^
461:–
455:–
444:–
438:–
403:–
400:–
361:–
355:–
343:/
273:–
270:–
136:.
104:.
81:.
75:TO
73:.
65:,
35:,
31:,
1137:e
1130:t
1123:v
1075:.
1051:.
1024:.
999:.
974:.
950:.
926:.
902:.
878:.
854:.
822:.
795:.
760:.
729:.
704:.
679:.
654:.
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