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processes. There are many factors to consider in selection of either electrolytic or electroless plating methods. These include what the deposit will be used for, configuration of the part, materials compatibility and cost of processing. In different applications, electrolytic or electroless plating
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layer is used to counter this effect; these can be nickel or rhodium. Copper, which also migrates into gold, does so more slowly than silver. The copper is usually further plated with nickel. A gold-plated silver article is usually a silver substrate with layers of copper, nickel, and gold deposited
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may cause higher losses due to higher electrical resistance of nickel; a nickel-plated trace can have its useful length shortened three times in the 1 GHz band in comparison with the non-plated one. Selective plating is used, depositing the nickel and gold layers only on areas where it is
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If the gold layer does not completely dissolve into the solder, then slow intermetallic reactions can proceed in the solid state as the tin and gold atoms cross-migrate. Intermetallics have poor electrical conductivity and low strength. The ongoing intermetallic reactions also cause
358:. The thickness of gold plating on jewellery is noted in microns (or micro-meters). The microns of thickness determines how long the gold plating lasts with usage. The jewellery industry denotes different qualities of gold plating in the following terminology
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Gold, applied by evaporated methods or electroplating, has been specified by NASA to thermally control spacecraft instruments, due to its 99.4% reflectivity in infrared wavelengths.
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Wire bonding between gold plated contacts and aluminium wires or between aluminium contacts and gold wires under certain conditions develops a brittle layer of
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Gold plated silver jewellery can still tarnish as the silver atoms diffuse into the gold layer, causing slow gradual fading of its color and eventually causing
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451:, is often deposited on the copper substrate before the gold plating. The layer of nickel provides mechanical backing for the gold layer, improving its
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63% tin – 37% lead solder is used, no lead-gold compounds are formed, because gold preferentially reacts with tin, forming the
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is the decorative covering of an object with gold, which typically involve more traditional methods and much larger objects.
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layer before applying the gold layer; improper cleaning leads to a nickel surface difficult to solder. A stronger
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planes, significantly lowering the mechanical strength and therefore reliability of the resulting solder joints.
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of the surface. This process may take months and even years, depending on the thickness of the gold layer. A
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is deposited using lower concentration of gold in the baths. Usually contains nickel and/or cobalt as well.
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540:, with Knoop hardness between 120–300 and purity of 99.7–99.9% gold. Often contains a small amount of
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can be plated. This technology can be used for depositing layers suitable for wire bonding.
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Heavy gold plated / Vermeil - gold layer thickness greater than or equal to 2.5 micron
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A 2–3 μm layer of gold dissolves completely within one second during typical
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ranges between 60 and 85. The plating baths have to be kept free of contamination.
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Non-cyanide, generally sulphite or chloride-based for gold and gold alloy plating
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contains phosphorus. Nickel with more than 8% phosphorus is not solderable.
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are often made by controlled-depth immersion of only the edge of the boards.
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resistance. It also reduces the impact of pores present in the gold layer.
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There are several types of gold plating used in the electronics industry:
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Gold plated - gold layer thickness greater than or equal to 0.5 micron
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Gold flashed / Gold washed - gold layer thickness less than 0.5 micron
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refers to modern coating methods, such as the ones used in the
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Acid gold plating for bright hard gold and gold alloy plating
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There are five recognized classes of gold plating chemistry:
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may be in need of reorganization to comply with
Knowledge's
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gold-plated parts can be problematic as gold is soluble in
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is another nickel contaminant that hinders solderability.
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conditions. Layers of gold thinner than 0.5 μm (0.02
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required and does not cause the detrimental side effects.
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Gold plating is often used in electronics, to provide a
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Gold plating of silver is used in the manufacture of
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can help, as it aids dissolving the oxide deposits.
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disperse in the solder matrix, forming preferential
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458:Both the nickel and gold layers can be plated by
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428:tend to diffuse through the gold layer, causing
424:With direct gold-on-copper plating, the copper
289:onto the surface of another metal, most often
187:Please help improve this article, possibly by
93:to make improvements to the overall structure.
336:Neutral gold cyanide, for high-purity plating
409:-resistant electrically conductive layer on
478:Gold plating may lead to formation of gold
60:Learn how and when to remove these messages
16:Coating an object with a thin layer of gold
285:is a method of depositing a thin layer of
668:. An acid bath is required to remove the
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222:Learn how and when to remove this message
109:Learn how and when to remove this message
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512:. The gold layer is easily soldered and
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242:space craft that protects a gold-plated
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151:of all important aspects of the article.
739:"Nickel-gold plating copper PCB traces"
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147:Please consider expanding the lead to
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575:Gold-plated printed circuit board
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771:from the original on 2017-04-11
767:. Products Finishing Magazine.
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238:Gold-plated aluminium cover on
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149:provide an accessible overview
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715:"Gold Coating | NASA Spinoff"
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487:gold-aluminium intermetallics
21:Gold plating (disambiguation)
763:Weisberg, Alfred M. (1997).
538:Bright hard gold on contacts
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741:. Polar Instruments. 2003.
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470:At higher frequencies, the
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658:Electroless nickel plating
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823:Electronics manufacturing
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617:compound. Particles of
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19:For other uses, see
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670:passivation
514:wire bonded
489:, known as
472:skin effect
464:electroless
393:Electronics
305:) process.
299:silver-gilt
817:Categories
775:2013-04-03
749:2007-03-28
724:2024-04-22
702:References
447:, usually
430:tarnishing
374:tarnishing
313:, whereas
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833:Jewellery
580:Soldering
530:. Entire
407:corrosion
356:jewellery
350:Jewellery
297:(to make
197:talk page
189:splitting
141:summarize
52:talk page
828:Coatings
783:Archived
769:Archived
743:Archived
684:See also
631:cleavage
603:eutectic
480:whiskers
438:sulphide
601:. When
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331:cyanide
315:gilding
307:Plating
240:Voyager
678:Carbon
584:solder
546:cobalt
542:nickel
516:. Its
449:nickel
411:copper
295:silver
291:copper
247:record
497:Types
434:oxide
426:atoms
674:flux
654:thou
619:AuSn
607:AuSn
595:lead
593:and
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