191:
126:
31:
238:
138:
186:
versions are identical in form factor to the standard non-heatspreader versions. Both versions are JEDEC compliant in all respects. The heatspreader versions give the system designer greater latitude in thermally-enhanced board level and/or system design. RoHS compliant, lead-free and green material
174:
with pin spacings of 0.05" (1.27 mm). The metal strip forming the lead is wrapped around and under the edge of the package, resembling the letter J in cross-section. Lead counts range from 20 to 84. PLCC packages can be square or rectangular. Body widths range from 0.35" to 1.15". The PLCC "J"
228:
PLCCs continue to be used for a wide variety of device types, which would include memory, processors, controllers, ASICs, DSPs, etc. It is particularly common for read-only memories, as it provides an easily swappable socketed chip. Applications range from consumer products through automotive and
77:
and since they use all four edges of the package they can have a larger pin count. Chip carriers may be made of ceramic or plastic. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as
68:
Chip carriers may have either J-shaped metal leads for connections by solder or by a socket, or may be lead-less with metal pads for connections. If the leads extend beyond the package, the preferred description is
162:
A premolded PLCC was originally released in 1976, but did not see much market adoption. Texas
Instruments later released a postmolded variant that was soon adopted by most major semiconductor companies. The
272:
Prototypes and devices intended for extended temperature environments are typically packaged in ceramic, while high-volume products for consumer and commercial markets are typically packaged in plastic.
175:
Lead configuration requires less board space versus equivalent gull leaded components, which have flat leads that extend out perpendicularly to the narrow edge of the package. The PLCC is preferred over
60:(commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.
167:
trade group started a task force in 1981 to categorize PLCCs, with the MO-047 standard released in 1984 for square packages and the MO-052 standard released in 1985 for rectangular packages.
210:
process, or to allow for component replacement without reworking. Using a PLCC socket may be necessary in situations where the device requires stand-alone programming, such as some
82:. Other forms are proprietary to one or two manufacturers. Sometimes the term "chip carrier" is used to refer generically to any package for an integrated circuit.
462:
857:
282:
206:. The motivation for a surface-mount PLCC socket would be when working with devices that cannot withstand the heat involved during the
638:
632:
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596:
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17:
769:
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It is relatively common to find packages that contain other components than their designated ones, such as diodes or
826:
706:
416:
391:
313:
691:
448:
159:) has a rectangular plastic housing. It is a reduced cost evolution of the ceramic leadless chip carrier (CLCC).
179:
style chip carriers when lead counts exceed 40 pins due to the PLCC's more efficient use of board surface area.
500:
852:
735:
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108:
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57:
95:
Leadless chip carrier (LLCC): Leadless chip carrier, contacts are recessed vertically.
884:
745:
412:
387:
309:
70:
85:
Types of chip-carrier package are usually referred to by initialisms and include:
821:
774:
764:
779:
222:
898:
211:
194:
Leaded chip carrier extraction tool. Vacuum picks may also be used instead.
183:
338:"Integrated Circuit, IC Package Types; SOIC. Surface Mount Device Package"
440:
242:
125:
42:
34:
30:
361:
237:
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215:
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devices. Some through-hole sockets are designed for prototyping with
137:
144:
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608:
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37:
in QFJ68 / PLCC68, an example of a plastic leaded chip carrier
572:
566:
560:
554:
480:
164:
130:
79:
548:
542:
536:
198:
A PLCC circuit may either be installed in a PLCC socket or
261:", but instead has rounded pins through the edges of the
27:
Surface mount technology package for integrated circuits
432:
http://www.cpu-world.com/CPUs/80286/Intel-R80286-8.html
202:. PLCC sockets may in turn be surface mounted, or use
362:"CPU Collection Museum - Chip Package Information"
332:
330:
328:
326:
324:
322:
384:Surface mount technology: principles and practice
225:facilitates the removal of a PLCC from a socket.
896:
319:
120:
456:
306:Handbook of Semiconductor Technology Volume 2
434:"Intel R80286-8; Package 68-pin ceramic LCC"
304:Kenneth Jackson, Wolfgang Schroter, (ed),
300:
298:
104:DLCC: Dual lead-less chip carrier (ceramic)
858:List of integrated circuit packaging types
470:
463:
449:
356:
354:
283:List of integrated circuit packaging types
295:
236:
189:
136:
124:
29:
515:(SOD-123 / SOD-323 / SOD-523 / SOD-923)
351:
14:
897:
406:
381:
444:
73:". Chip carriers can be smaller than
92:CLCC: Ceramic leadless chip carrier
24:
400:
375:
187:sets are now qualified standards.
25:
916:
101:LCCC: Leaded ceramic chip carrier
411:. CRC Publishing. p. 173.
497:(DO-7 / DO-26 / DO-35 / DO-41)
425:
13:
1:
409:Electronic Materials Handbook
288:
887:in transistor packages, etc.
853:Integrated circuit packaging
241:Ceramic leadless package of
221:A specialized tool called a
7:
407:Minges, Merrill L. (1989).
276:
232:
153:plastic-leaded chip carrier
121:Plastic-leaded chip carrier
109:Plastic leaded chip carrier
49:is one of several kinds of
10:
921:
881:
840:
788:
757:
720:
664:
648:
522:
478:
129:Reverse side of an Intel
868:Surface-mount technology
98:LCC: Leaded chip carrier
63:
51:surface-mount technology
873:Through-hole technology
204:through-hole technology
503:(MELF / SOD-80 / LL34)
472:Semiconductor packages
246:
195:
148:
134:
133:: J-shaped metal leads
89:BCC: Bump chip carrier
38:
863:Printed circuit board
251:leadless chip carrier
240:
193:
140:
128:
75:dual in-line packages
33:
18:Leadless chip carrier
848:Electronic packaging
382:Prasad, Ray (1997).
170:The PLCC uses a "J"-
308:, Wiley VCH, 2000,
58:integrated circuits
885:voltage regulators
340:. Interfacebus.com
247:
196:
149:
135:
115:Package on package
39:
892:
891:
641:(Super-247) (SMT)
635:(Super-220) (SMT)
509:(SMA / SMB / SMC)
147:in QFJ32 / PLCC32
16:(Redirected from
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458:
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386:. p. 121.
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200:surface-mounted
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841:Related topics
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707:TSSOP / HTSSOP
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223:PLCC extractor
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26:
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905:Chip carriers
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629:(D3PAK) (SMT)
628:
625:
623:(D2PAK) (SMT)
622:
619:
617:(I2PAK) (SMT)
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418:0-87170-285-1
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393:0-412-12921-3
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314:3-527-29835-5
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216:wire wrapping
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55:
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48:
44:
36:
32:
19:
832:WL-CSP / WLP
702:TSOP / HTSOP
611:(DPAK) (SMT)
605:(IPAK) (SMT)
599:(TH / Panel)
593:(TH / Panel)
587:(TH / Panel)
581:(TH / Panel)
569:(TH / Panel)
539:(TH / Panel)
427:
408:
402:
383:
377:
366:. Retrieved
342:. Retrieved
305:
271:
254:
250:
248:
227:
220:
212:flash memory
197:
184:heatspreader
181:
169:
161:
156:
152:
150:
84:
67:
47:chip carrier
46:
40:
750:QUIP / QUIL
364:. CPU Shack
243:Intel 80286
229:aerospace.
43:electronics
35:Intel 80186
758:Grid array
697:SOP / SSOP
649:Single row
532:SOT / TSOT
368:2011-12-15
344:2011-12-15
316:, page 627
289:References
265:or molded
257:) has no "
812:Flip Chip
731:QIP / QIL
692:SO / SOIC
682:Flat Pack
677:DIP / DIL
656:SIP / SIL
524:3...5-pin
269:package.
71:flat pack
899:Category
721:Quad row
665:Dual row
277:See also
245:(bottom)
233:Leadless
145:DualBIOS
142:Gigabyte
54:packages
491:(DO-27)
479:Single
267:plastic
263:ceramic
639:TO-274
633:TO-273
627:TO-268
621:TO-263
615:TO-262
609:TO-252
603:TO-251
597:TO-247
591:TO-220
585:TO-202
579:TO-126
507:DO-214
501:DO-213
495:DO-204
489:DO-201
415:
390:
312:
208:reflow
107:PLCC:
790:Wafer
573:TO-92
567:TO-66
561:TO-39
555:TO-18
481:diode
259:leads
165:JEDEC
131:80C86
113:PoP:
80:JEDEC
64:Types
827:UICC
770:eWLB
736:PLCC
687:MSOP
575:(TH)
563:(TH)
557:(TH)
551:(TH)
549:TO-8
545:(TH)
543:TO-5
537:TO-3
413:ISBN
388:ISBN
310:ISBN
182:The
172:lead
157:PLCC
56:for
45:, a
817:PoP
807:CSP
803:COG
800:COF
797:COB
780:PGA
775:LGA
765:BGA
746:QFP
741:QFN
727:LCC
712:ZIP
672:DFN
513:SOD
255:LCC
177:DIP
41:In
901::
822:QP
353:^
321:^
297:^
249:A
218:.
151:A
464:e
457:t
450:v
421:.
396:.
371:.
347:.
253:(
155:(
69:"
20:)
Text is available under the Creative Commons Attribution-ShareAlike License. Additional terms may apply.
