2614:
datawords in memory, which in practice is very often the case. For instance, in DDR1, two adjacent data words will be read from each chip in the same clock cycle and placed in the pre-fetch buffer. Each word will then be transmitted on consecutive rising and falling edges of the clock cycle. Similarly, in DDR2 with a 4n pre-fetch buffer, four consecutive data words are read and placed in buffer while a clock, which is twice faster than the internal clock of DDR, transmits each of the word in consecutive rising and falling edge of the faster external clock
3644:
3216:
command contained the ID of the chip that should process it. Data was transferred in 4- or 8-word bursts across an 18-bit (per chip) data bus, using one of two differential data clocks (DCLK0/DCLK0# and DCLK1/DCLK1#). Unlike standard SDRAM, the clock was generated by the data source (the SLDRAM chip in the case of a read operation) and transmitted in the same direction as the data, greatly reducing data skew. To avoid the need for a pause when the source of the DCLK changes, each command specified which DCLK pair it would use.
2289:
2621:), the IOs will operate 8 times faster than the memory core (each memory access results in a burst of 8 datawords on the IOs). Thus, a 200 MHz memory core is combined with IOs that each operate eight times faster (1600 megabits per second). If the memory has 16 IOs, the total read bandwidth would be 200 MHz x 8 datawords/access x 16 IOs = 25.6 gigabits per second (Gbit/s) or 3.2 gigabytes per second (GB/s). Modules with multiple DRAM chips can provide correspondingly higher bandwidth.
2474:, later words are accessed in increasing address order, wrapping back to the start of the block when the end is reached. So, for example, for a burst length of four, and a requested column address of five, the words would be accessed in the order 5-6-7-4. If the burst length were eight, the access order would be 5-6-7-0-1-2-3-4. This is done by adding a counter to the column address, and ignoring carries past the burst length. The interleaved burst mode computes the address using an
2467:
option: sequential or interleaved. Typically, a memory controller will require one or the other. When the burst length is one or two, the burst type does not matter. For a burst length of one, the requested word is the only word accessed. For a burst length of two, the requested word is accessed first, and the other word in the aligned block is accessed second. This is the following word if an even address was specified, and the previous word if an odd address was specified.
2816:
1514:
2939:
1787:
cycle proceeds as usual, but the following clock cycle is ignored, except for testing the CKE input again. Normal operations resume on the rising edge of the clock after the one where CKE is sampled high. Put another way, all other chip operations are timed relative to the rising edge of a masked clock. The masked clock is the logical AND of the input clock and the state of the CKE signal during the previous rising edge of the input clock.
1590:
3421:
SDRAM's read and write commands specify a channel number to access. Reads and writes may thus be performed independent of the currently active state of the DRAM array, with the equivalent of four full DRAM rows being "open" for access at a time. This is an improvement over the two open rows possible in a standard two-bank SDRAM. (There is actually a 17th "dummy channel" used for some operations.)
1767:
standard, which outlines requirements and guidelines for producing a memory module that can operate reliably at 100 MHz. This standard was widely influential, and the term "PC100" quickly became a common identifier for 100 MHz SDRAM modules, and modules are now commonly designated with "PC"-prefixed numbers (PC66, PC100 or PC133 - although the actual meaning of the numbers has changed).
2463:. A cache line fetch is typically triggered by a read from a particular address, and SDRAM allows the "critical word" of the cache line to be transferred first. ("Word" here refers to the width of the SDRAM chip or DIMM, which is 64 bits for a typical DIMM.) SDRAM chips support two possible conventions for the ordering of the remaining words in the cache line.
3425:
DRAM array may be precharged while read commands to the channel buffer continue. To write, first the data is written to a channel buffer (typically previous initialized using a
Prefetch command), then a restore command, with the same parameters as the prefetch command, copies a segment of data from the channel to the sense amplifier array.
3537:(GPUs). GDDR SDRAM is distinct from commodity types of DDR SDRAM such as DDR3, although they share some core technologies. Their primary characteristics are higher clock frequencies for both the DRAM core and I/O interface, which provides greater memory bandwidth for GPUs. As of 2023, there are eight successive generations of GDDR:
3433:
cells.) The SRAM bits are designed to be four DRAM bits wide, and are conveniently connected to one of the four DRAM bits they straddle.) Additional commands prefetch a pair of segments to a pair of channels, and an optional command combines prefetch, read, and precharge to reduce the overhead of random reads.
3428:
Unlike a normal SDRAM write, which must be performed to an active (open) row, the VCSDRAM bank must be precharged (closed) when the restore command is issued. An active command immediately after the restore command specifies the DRAM row completes the write to the DRAM array. There is, in addition, a
3424:
To read from VCSDRAM, after the active command, a "prefetch" command is required to copy data from the sense amplifier array to the channel SDRAM. This command specifies a bank, two bits of column address (to select the segment of the row), and four bits of channel number. Once this is performed, the
3346:
Individual devices had 8-bit IDs. The 9th bit of the ID sent in commands was used to address multiple devices. Any aligned power-of-2 sized group could be addressed. If the transmitted msbit was set, all least-significant bits up to and including the least-significant 0 bit of the transmitted address
3113:
in San
Francisco in 2008, and was due to be released to market during 2011. The timing varied considerably during its development - it was originally expected to be released in 2012, and later (during 2010) expected to be released in 2015, before samples were announced in early 2011 and manufacturers
2558:
Finally, if CKE is lowered at the same time as an auto-refresh command is sent to the SDRAM, the SDRAM enters self-refresh mode. This is like power down, but the SDRAM uses an on-chip timer to generate internal refresh cycles as necessary. The clock may be stopped during this time. While self-refresh
2435:
Interrupting a read burst by a write command is possible, but more difficult. It can be done if the DQM signal is used to suppress output from the SDRAM so that the memory controller may drive data over the DQ lines to the SDRAM in time for the write operation. Because the effects of DQM on read data
2424:
A read, burst terminate, or precharge command may be issued at any time after a read command, and will interrupt the read burst after the configured CAS latency. So if a read command is issued on cycle 0, another read command is issued on cycle 2, and the CAS latency is 3, then the first read command
2371:
When the memory controller needs to access a different row, it must first return that bank's sense amplifiers to an idle state, ready to sense the next row. This is known as a "precharge" operation, or "closing" the row. A precharge may be commanded explicitly, or it may be performed automatically at
1762:
In operation, CAS latency is a specific number of clock cycles programmed into the SDRAM's mode register and expected by the DRAM controller. Any value may be programmed, but the SDRAM will not operate correctly if it is too low. At higher clock rates, the useful CAS latency in clock cycles naturally
1580:
means that the chip can accept a new command before it has finished processing the previous one. For a pipelined write, the write command can be immediately followed by another command without waiting for the data to be written into the memory array. For a pipelined read, the requested data appears a
2849:
Use of the data bus is intricate and thus requires a complex DRAM controller circuit. This is because data written to the DRAM must be presented in the same cycle as the write command, but reads produce output 2 or 3 cycles after the read command. The DRAM controller must ensure that the data bus is
2609:
The drawback of the older fast column access method was that a new column address had to be sent for each additional dataword on the row. The address bus had to operate at the same frequency as the data bus. Prefetch architecture simplifies this process by allowing a single address request to result
2562:
SDRAM designed for battery-powered devices offers some additional power-saving options. One is temperature-dependent refresh; an on-chip temperature sensor reduces the refresh rate at lower temperatures, rather than always running it at the worst-case rate. Another is selective refresh, which limits
2367:
command is accompanied by the data to be written driven on to the DQ lines during the same rising clock edge. It is the duty of the memory controller to ensure that the SDRAM is not driving read data on to the DQ lines at the same time that it needs to drive write data on to those lines. This can be
3439:
A 13-bit address bus, as illustrated here, is suitable for a device up to 128 Mbit. It has two banks, each containing 8,192 rows and 8,192 columns. Thus, row addresses are 13 bits, segment addresses are two bits, and eight column address bits are required to select one byte from the 2,048 bits
3215:
SLDRAM used an 11-bit command bus (10 command bits CA9:0 plus one start-of-command FLAG line) to transmit 40-bit command packets on 4 consecutive edges of a differential command clock (CCLK/CCLK#). Unlike SDRAM, there were no per-chip select signals; each chip was assigned an ID when reset, and the
3090:
DDR3 memory chips are being made commercially, and computer systems using them were available from the second half of 2007, with significant usage from 2008 onwards. Initial clock rates were 400 and 533 MHz, which are described as DDR3-800 and DDR3-1066 (PC3-6400 and PC3-8500 modules), but 667
3057:
Typical DDR2 SDRAM clock rates are 200, 266, 333 or 400 MHz (periods of 5, 3.75, 3 and 2.5 ns), generally described as DDR2-400, DDR2-533, DDR2-667 and DDR2-800 (periods of 2.5, 1.875, 1.5 and 1.25 ns). Corresponding 240-pin DIMMs are known as PC2-3200 through PC2-6400. DDR2 SDRAM is
2586:
precharge, row access, column access. Row access is the heart of a read operation, as it involves the careful sensing of the tiny signals in DRAM memory cells; it is the slowest phase of memory operation. However, once a row is read, subsequent column accesses to that same row can be very quick, as
2530:
It is possible to refresh a RAM chip by opening and closing (activating and precharging) each row in each bank. However, to simplify the memory controller, SDRAM chips support an "auto refresh" command, which performs these operations to one row in each bank simultaneously. The SDRAM also maintains
3420:
VCM inserts an SRAM cache of 16 "channel" buffers, each 1/4 row "segment" in size, between DRAM banks' sense amplifier rows and the data I/O pins. "Prefetch" and "restore" commands, unique to VCSDRAM, copy data between the DRAM's sense amplifier row and the channel buffers, while the equivalent of
3027:
interface was developed. This uses the same commands, accepted once per cycle, but reads or writes two words of data per clock cycle. The DDR interface accomplishes this by reading and writing data on both the rising and falling edges of the clock signal. In addition, some minor changes to the SDR
1805:
appears because, following digital logic conventions, the data lines are known as "DQ" lines.) When high, these signals suppress data I/O. When accompanying write data, the data is not actually written to the DRAM. When asserted high two cycles before a read cycle, the read data is not output from
3198:
SLDRAM boasted higher performance and competed against RDRAM. It was developed during the late 1990s by the SLDRAM Consortium. The SLDRAM Consortium consisted of about 20 major DRAM and computer industry manufacturers. (The SLDRAM Consortium became incorporated as SLDRAM Inc. and then changed its
2975:
A module built out of 100 MHz SDRAM chips is not necessarily capable of operating at 100 MHz. The PC100 standard specifies the capabilities of the memory module as a whole. PC100 is used in many older computers; PCs around the late 1990s were the most common computers with PC100 memory.
2521:
Later (double data rate) SDRAM standards use more mode register bits, and provide additional mode registers called "extended mode registers". The register number is encoded on the bank address pins during the load mode register command. For example, DDR2 SDRAM has a 13-bit mode register, a 13-bit
2509:
M6, M5, M4: CAS latency. Generally only 010 (CL2) and 011 (CL3) are legal. Specifies the number of cycles between a read command and data output from the chip. The chip has a fundamental limit on this value in nanoseconds; during initialization, the memory controller must use its knowledge of the
3432:
Although normally a segment is restored to the same memory address as it was prefetched from, the channel buffers may also be used for very efficient copying or clearing of large, aligned memory blocks. (The use of quarter-row segments is driven by the fact that DRAM cells are narrower than SRAM
3053:
DDR2 SDRAM is very similar to DDR SDRAM, but doubles the minimum read or write unit again, to four consecutive words. The bus protocol was also simplified to allow higher performance operation. (In particular, the "burst terminate" command is deleted.) This allows the bus rate of the SDRAM to be
2439:
Doing this in only two clock cycles requires careful coordination between the time the SDRAM takes to turn off its output on a clock edge and the time the data must be supplied as input to the SDRAM for the write on the following clock edge. If the clock frequency is too high to allow sufficient
1786:
clock enable. When this signal is low, the chip behaves as if the clock has stopped. No commands are interpreted and command latency times do not elapse. The state of other control lines is not relevant. The effect of this signal is actually delayed by one clock cycle. That is, the current clock
3038:
Typical DDR SDRAM clock rates are 133, 166 and 200 MHz (7.5, 6, and 5 ns/cycle), generally described as DDR-266, DDR-333 and DDR-400 (3.75, 3, and 2.5 ns per beat). Corresponding 184-pin DIMMs are known as PC-2100, PC-2700 and PC-3200. Performance up to DDR-550 (PC-4400) is available.
2613:
In a prefetch buffer architecture, when a memory access occurs to a row the buffer grabs a set of adjacent data words on the row and reads them out ("bursts" them) in rapid-fire sequence on the IO pins, without the need for individual column address requests. This assumes the CPU wants adjacent
2466:
Bursts always access an aligned block of BL consecutive words beginning on a multiple of BL. So, for example, a four-word burst access to any column address from four to seven will return words four to seven. The ordering, however, depends on the requested address, and the configured burst type
3075:
DDR3 continues the trend, doubling the minimum read or write unit to eight consecutive words. This allows another doubling of bandwidth and external bus rate without having to change the clock rate of internal operations, just the width. To maintain 800–1600 M transfers/s (both edges of a
2495:
Single data rate SDRAM has a single 10-bit programmable mode register. Later double-data-rate SDRAM standards add additional mode registers, addressed using the bank address pins. For SDR SDRAM, the bank address pins and address lines A10 and above are ignored, but should be zero during a mode
1766:
SDRAM modules have their own timing specifications, which may be slower than those of the chips on the module. When 100 MHz SDRAM chips first appeared, some manufacturers sold "100 MHz" modules that could not reliably operate at that clock rate. In response, Intel published the PC100
2516:
M2, M1, M0: Burst length. Values of 000, 001, 010 and 011 specify a burst size of 1, 2, 4 or 8 words, respectively. Each read (and write, if M9 is 0) will perform that many accesses, unless interrupted by a burst stop or other command. A value of 111 specifies a full-row burst. The burst will
2309:
command activates an idle bank. It presents a two-bit bank address (BA0–BA1) and a 13-bit row address (A0–A12), and causes a read of that row into the bank's array of all 16,384 column sense amplifiers. This is also known as "opening" the row. This operation has the side effect of
2543:
As mentioned, the clock enable (CKE) input can be used to effectively stop the clock to an SDRAM. The CKE input is sampled each rising edge of the clock, and if it is low, the following rising edge of the clock is ignored for all purposes other than checking CKE. As long as CKE is low, it is
2478:
operation between the counter and the address. Using the same starting address of five, a four-word burst would return words in the order 5-4-7-6. An eight-word burst would be 5-4-7-6-1-0-3-2. Although more confusing to humans, this can be easier to implement in hardware, and is preferred by
3384:
Additional commands (with CMD5 set) opened and closed rows without a data transfer, performed refresh operations, read or wrote configuration registers, and performed other maintenance operations. Most of these commands supported an additional 4-bit sub-ID (sent as 5 bits, using the same
2436:
are delayed by two cycles, but the effects of DQM on write data are immediate, DQM must be raised (to mask the read data) beginning at least two cycles before write command but must be lowered for the cycle of the write command (assuming the write command is intended to have an effect).
2359:
command is issued, the SDRAM will produce the corresponding output data on the DQ lines in time for the rising edge of the clock a few clock cycles later, depending on the configured CAS latency. Subsequent words of the burst will be produced in time for subsequent rising clock edges.
2605:
Traditional DRAM architectures have long supported fast column access to bits on an open row. For an 8-bit-wide memory chip with a 2,048 bit wide row, accesses to any of the 256 datawords (2048/8) on the row can be very quick, provided no intervening accesses to other rows occur.
1752: Hz) to 5 ns for DDR-400, but remained relatively unchanged through DDR2-800 and DDR3-1600 generations. However, by operating the interface circuitry at increasingly higher multiples of the fundamental read rate, the achievable bandwidth has increased rapidly.
2396:
The no operation command is always permitted, while the load mode register command requires that all banks be idle, and a delay afterward for the changes to take effect. The auto refresh command also requires that all banks be idle, and takes a refresh cycle time
2486:
If the requested column address is at the start of a block, both burst modes (sequential and interleaved) return data in the same sequential sequence 0-1-2-3-4-5-6-7. The difference only matters if fetching a cache line from memory in critical-word-first order.
3203:
and did not require licensing fees. The specifications called for a 64-bit bus running at a 200, 300 or 400 MHz clock frequency. This is achieved by all signals being on the same line and thereby avoiding the synchronization time of multiple lines. Like
3169:
In March 2017, JEDEC announced a DDR5 standard is under development, but provided no details except for the goals of doubling the bandwidth of DDR4, reducing power consumption, and publishing the standard in 2018. The standard was released on 14 July 2020.
3189:
was a proprietary technology that competed against DDR. Its relatively high price and disappointing performance (resulting from high latencies and a narrow 16-bit data channel versus DDR's 64 bit channel) caused it to lose the race to succeed SDR SDRAM.
2296:
As an example, a 512 MB SDRAM DIMM (which contains 512 MB), might be made of eight or nine SDRAM chips, each containing 512 Mbit of storage, and each one contributing 8 bits to the DIMM's 64- or 72-bit width. A typical 512 Mbit SDRAM
3114:
began to announce that commercial production and release to market was anticipated in 2012. DDR4 reached mass market adoption around 2015, which is comparable with the approximately five years taken for DDR3 to achieve mass market transition over DDR2.
1563:
that responds to incoming commands. These commands can be pipelined to improve performance, with previously started operations completing while new commands are received. The memory is divided into several equally sized but independent sections called
2550:
If the SDRAM is idle (all banks precharged, no commands in progress) when CKE is lowered, the SDRAM automatically enters power-down mode, consuming minimal power until CKE is raised again. This must not last longer than the maximum refresh interval
3022:
While the access latency of DRAM is fundamentally limited by the DRAM array, DRAM has very high potential bandwidth because each internal read is actually a row of many thousands of bits. To make more of this bandwidth available to users, a
3054:
doubled without increasing the clock rate of internal RAM operations; instead, internal operations are performed in units four times as wide as SDRAM. Also, an extra bank address pin (BA2) was added to allow eight banks on large RAM chips.
3058:
now available at a clock rate of 533 MHz generally described as DDR2-1066 and the corresponding DIMMs are known as PC2-8500 (also named PC2-8600 depending on the manufacturer). Performance up to DDR2-1250 (PC2-10000) is available.
2853:
Typical SDR SDRAM clock rates are 66, 100, and 133 MHz (periods of 15, 10, and 7.5 ns), respectively denoted PC66, PC100, and PC133. Clock rates up to 200 MHz were available. It operates at a voltage of 3.3 V.
2459:. To transfer a 64-byte cache line requires eight consecutive accesses to a 64-bit DIMM, which can all be triggered by a single read or write command by configuring the SDRAM chips, using the mode register, to perform eight-word
5986:
Kalter, H. L.; Stapper, C. H.; Barth, J. E.; Dilorenzo, J.; Drake, C. E.; Fifield, J. A.; Kelley, G. A.; Lewis, S. C.; van der Hoeven, W. B.; Jankosky, J. A. (1990). "A 50-ns 16-Mb DRAM with a 10-ns data rate and on-chip ECC".
2431:
Although the interrupting read may be to any active bank, a precharge command will only interrupt the read burst if it is to the same bank or all banks; a precharge command to a different bank will not interrupt a read burst.
2531:
an internal counter, which iterates over all possible rows. The memory controller must simply issue a sufficient number of auto refresh commands (one per row, 8192 in the example we have been using) every refresh interval (t
1605:
The earliest DRAMs were often synchronized with the CPU clock (clocked) and were used with early microprocessors. In the mid-1970s, DRAMs moved to the asynchronous design, but in the 1990s returned to synchronous operation.
2838:, single data rate SDRAM can accept one command and transfer one word of data per clock cycle. Chips are made with a variety of data bus sizes (most commonly 4, 8 or 16 bits), but chips are generally assembled into 168-pin
3003:
form factors. PC133 is the fastest and final SDR SDRAM standard ever approved by the JEDEC, and delivers a bandwidth of 1.066 GB per second (=1.066 GB/s). (1 GB/s = one billion bytes per second) PC133 is
3404:
because VCM was not nearly as expensive as RDRAM was. A Virtual
Channel Memory (VCM) module is mechanically and electrically compatible with standard SDRAM, so support for both depends only on the capabilities of the
1763:
increases. 10–15 ns is 2–3 cycles (CL2–3) of the 200 MHz clock of DDR-400 SDRAM, CL4-6 for DDR2-800, and CL8-12 for DDR3-1600. Slower clock cycles will naturally allow lower numbers of CAS latency cycles.
1724:
There are several limits on DRAM performance. Most noted is the read cycle time, the time between successive read operations to an open row. This time decreased from 10 ns for 100 MHz SDRAM (1 MHz =
3385:
multiple-destination encoding as the primary ID) which could be used to distinguish devices that were assigned the same primary ID because they were connected in parallel and always read/written at the same time.
1874:
SDRAM devices are internally divided into either two, four or eight independent internal data banks. One to three bank address inputs (BA0, BA1 and BA2) are used to select which bank a command is directed toward.
7754:
3083:. As with all DDR SDRAM generations, commands are still restricted to one clock edge and command latencies are given in terms of clock cycles, which are half the speed of the usually quoted transfer rate (a
2387:
command opening a row, and the corresponding precharge command closing it. This limit is usually dwarfed by desired read and write commands to the row, so its value has little effect on typical performance.
2301:
internally contains four independent 16 MB memory banks. Each bank is an array of 8,192 rows of 16,384 bits each. (2048 8-bit columns). A bank is either idle, active, or changing from one to the other.
2567:(LPDDR) and LPDDR2 is "deep power down" mode, which invalidates the memory and requires a full reinitialization to exit from. This is activated by sending a "burst terminate" command while lowering CKE.
3143:
validated 40 nm DRAM chips, considered a "significant step" towards DDR4 development since, as of 2009, current DRAM chips were only beginning to migrate to a 50 nm process. In
January 2011,
6323:
7629:
7253:
3061:
Note that because internal operations are at 1/2 the clock rate, DDR2-400 memory (internal clock rate 100 MHz) has somewhat higher latency than DDR-400 (internal clock rate 200 MHz).
6040:
The first commercial synchronous DRAM, the
Samsung 16-Mbit KM48SL2000, employs a single-bank architecture that lets system designers easily transition from asynchronous to synchronous systems.
2352:
commands require a column address. Because each chip accesses eight bits of data at a time, there are 2,048 possible column addresses thus requiring only 11 address lines (A0–A9, A11).
3347:
were ignored for "is this addressed to me?" purposes. (If the ID8 bit is actually considered less significant than ID0, the unicast address matching becomes a special case of this pattern.)
1759:, the time between supplying a column address and receiving the corresponding data. Again, this has remained relatively constant at 10–15 ns through the last few generations of DDR SDRAM.
2416:
When a bank is open, there are four commands permitted: read, write, burst terminate, and precharge. Read and write commands begin bursts, which can be interrupted by following commands.
2857:
This type of SDRAM is slower than the DDR variants, because only one word of data is transmitted per clock cycle (single data rate). But this type is also faster than its predecessors
1883:
Many commands also use an address presented on the address input pins. Some commands, which either do not use an address, or present a column address, also use A10 to select variants.
1670:
to facilitate interoperability of electronic components. JEDEC formally adopted its first SDRAM standard in 1993 and subsequently adopted other SDRAM standards, including those for
3400:, but released as an open standard with no licensing fees. It is pin-compatible with standard SDRAM, but the commands are different. The technology was a potential competitor of
1655:
due to the additional logic. The benefits of SDRAM's internal buffering come from its ability to interleave operations to multiple banks of memory, thereby increasing effective
3125:
per second. They were expected to be introduced at frequency rates of 2133 MHz, estimated to rise to a potential 4266 MHz and lowered voltage of 1.05 V by 2013.
7077:
3429:
17th "dummy channel" which allows writes to the currently open row. It may not be read from, but may be prefetched to, written to, and restored to the sense amplifier array.
7722:
7478:
7664:
3616:. It is designed to be used in conjunction with high-performance graphics accelerators and network devices. The first HBM memory chip was produced by SK Hynix in 2013.
3091:
and 800 MHz, described as DDR3-1333 and DDR3-1600 (PC3-10600 and PC3-12800 modules) are now common. Performance up to DDR3-2800 (PC3 22400 modules) are available.
7765:
3028:
interface timing were made in hindsight, and the supply voltage was reduced from 3.3 to 2.5 V. As a result, DDR SDRAM is not backwards compatible with SDR SDRAM.
7880:
1750:
2957:. PC100 refers to Synchronous DRAM operating at a clock frequency of 100 MHz, on a 64-bit-wide bus, at a voltage of 3.3 V. PC100 is available in 168-pin
2559:
mode consumes slightly more power than power-down mode, it allows the memory controller to be disabled entirely, which commonly more than makes up the difference.
2329:
before reads or writes to it may occur. This time, rounded up to the next multiple of the clock period, specifies the minimum number of wait cycles between an
2617:
The prefetch buffer depth can also be thought of as the ratio between the core memory frequency and the IO frequency. In an 8n prefetch architecture (such as
2379:
Although refreshing a row is an automatic side effect of activating it, there is a minimum time for this to happen, which requires a minimum row access time t
7978:
7285:
7190:
3436:
The above are the JEDEC-standardized commands. Earlier chips did not support the dummy channel or pair prefetch, and use a different encoding for precharge.
1551:
interface, in which input control signals have a direct effect on internal functions delayed only by the trip across its semiconductor pathways. SDRAM has a
6684:
6807:
6425:
2582:
The prefetch architecture takes advantage of the specific characteristics of memory accesses to DRAM. Typical DRAM memory operations involve three phases:
7983:
7973:
6327:
2884:. PC66 is Synchronous DRAM operating at a clock frequency of 66.66 MHz, on a 64-bit bus, at a voltage of 3.3 V. PC66 is available in 168-pin
7504:
2563:
self-refresh to a portion of the DRAM array. The fraction which is refreshed is configured using an extended mode register. The third, implemented in
7327:
6932:
1651:
SDRAM latency is not inherently lower (faster access times) than asynchronous DRAM. Indeed, early SDRAM was somewhat slower than contemporaneous
6631:
6508:
2896:
2428:
If the command issued on cycle 2 were burst terminate, or a precharge of the active bank, then no output would be generated during cycle 5.
6098:
7696:
7603:
7574:
7047:
6715:
3464:(writing to a specified bit plane without affecting the others) and block write (filling a block of memory with a single colour). Unlike
3448:
Synchronous graphics RAM (SGRAM) is a specialized form of SDRAM for graphics adaptors. It is designed for graphics-related tasks such as
2376:, which must elapse before that row is fully "closed" and so the bank is idle in order to receive another activate command on that bank.
3147:
announced the completion and release for testing of a 30 nm 2048 MB DDR4 DRAM module. It has a maximum bandwidth of 2.13
2341:
command. During these wait cycles, additional commands may be sent to other banks; because each bank operates completely independently.
7907:
8298:
2425:
will begin bursting data out during cycles 3 and 4, then the results from the second read command will appear beginning with cycle 5.
1775:
All commands are timed relative to the rising edge of a clock signal. In addition to the clock, there are six control signals, mostly
1555:
interface, whereby changes on control inputs are recognised after a rising edge of its clock input. In SDRAM families standardized by
5071:
2988:
2954:
2881:
2598:
wide, so internally 2,048 bits are read into 2,048 separate sense amplifiers during the row access phase. Row accesses might take 50
2583:
7367:
1795:
chip select. When this signal is high, the chip ignores all other inputs (except for CKE), and acts as if a NOP command is received.
626:
5737:
4905:
7549:
6373:
2995:
operating at a clock frequency of 133 MHz, on a 64-bit-wide bus, at a voltage of 3.3 V. PC133 is available in 168-pin
6589:
6556:
6471:
4521:
4334:
4180:
1500:
6348:
1041:
6399:
6489:
3805:
3601:
2694:
6196:
1574:
fashion. This allows SDRAMs to achieve greater concurrency and higher data transfer rates than asynchronous DRAMs could.
7421:
3388:
There were a number of 8-bit control registers and 32-bit status registers to control various device timing parameters.
2555:, or memory contents may be lost. It is legal to stop the clock entirely during this time for additional power savings.
2503:
M9: Write burst mode. If 0, writes use the read burst length and mode. If 1, all writes are non-burst (single location).
6841:
6287:
1250:
202:
6658:
247:
6781:
5970:
5943:
5916:
2325:
commands are possible to that row. Activation requires a minimum amount of time, called the row-to-column delay, or t
989:
932:
252:
7822:
6305:
6257:
3035:
for greater clarity) doubles the minimum read or write unit; every access refers to at least two consecutive words.
2547:
If CKE is lowered while the SDRAM is performing operations, it simply "freezes" in place until CKE is raised again.
2409:.) The only other command that is permitted on an idle bank is the active command. This takes, as mentioned above, t
8329:
5102:
3704:
100:
7179:
1570:, allowing the device to operate on a memory access command in each bank simultaneously and speed up access in an
1315:
975:
919:
6429:
2368:
done by waiting until a read burst has finished, by terminating a read burst, or by using the DQM control line.
8010:
6244:
3414:
3136:
prefetch as DDR3. Thus, it will be necessary to interleave reads from several banks to keep the data bus busy.
1001:
670:
482:
78:
6214:
2443:
If the read command includes auto-precharge, the precharge begins the same cycle as the interrupting command.
7791:
7313:
1865:, this selects one of eight commands. It generally distinguishes read-like commands from write-like commands.
1581:
fixed number of clock cycles (latency) after the read command, during which additional commands can be sent.
1350:
6450:
8159:
8019:
7929:
6771:
5884:
3465:
2830:
48LC32M8A2 SDRAM chips. They run at 133 MHz (7.5 ns clock period) and have 8-bit wide data buses.
2782:
2766:
2736:
701:
596:
497:
7479:"Samsung Electronics Announces Industry's First 8Gb LPDDR5 DRAM for 5G and AI-powered Mobile Applications"
658:
7514:
7114:
2499:
The bits are M9 through M0, presented on address lines A9 through A0 during a load mode register cycle.
2265:
DDR3 and DDR4 use A12 during read and write command to indicate "burst chop", half-length data transfer
6959:
6269:
3373:
A notable omission from the specification was per-byte write enables; it was designed for systems with
2892:
form factors. The theoretical bandwidth is 533 MB/s. (1 MB/s = one million bytes per second)
2372:
the conclusion of a read or write operation. Again, there is a minimum time, the row precharge delay, t
1617:
RAM and presented their results at the
International Solid-State Circuits Convention in 1990. In 1998,
1493:
1290:
1189:
1061:
691:
680:
7881:"Samsung Electronics Starts Producing Industry's First 16-Gigabit GDDR6 for Advanced Graphics Systems"
7630:"Samsung Announces the World's First 222 MHz 32Mbit SGRAM for 3D Graphics and Networking Applications"
6921:
3087:
of 8 with DDR3-800 is 8/(400 MHz) = 20 ns, exactly the same latency of CAS2 on PC100 SDR SDRAM).
789:
7254:"Samsung Develops the Industry's Fastest DDR3 SRAM for High Performance EDP and Network Applications"
6983:
6141:
5866:
2535:= 64 ms is a common value). All banks must be idle (closed, precharged) when this command is issued.
2240:
The most significant settings are CAS latency (2 or 3 cycles) and burst length (1, 2, 4 or 8 cycles)
2215:
Auto refresh: refresh one row of each bank, using an internal counter. All banks must be precharged.
552:
487:
382:
6622:
3625:
2513:
M3: Burst type. 0 - requests sequential burst ordering, while 1 requests interleaved burst ordering.
1644:) the same year and mass-produced in 1993. By 2000, SDRAM had replaced virtually all other types of
5883:
A concise but thorough review of SDRAM architecture/terminology and command timing dependencies in
3534:
2602:, depending on the speed of the DRAM, whereas column accesses off an open row are less than 10 ns.
2275:
controls it, during which the other control lines are used as row address bits 16, 15 and 14. When
1362:
1345:
834:
120:
5908:
Microprocessor: Prolegomenes - Calculation and
Storage Functions - Calculation Models and Computer
3076:
400–800 MHz clock), the internal RAM array has to perform 100–200 M fetches per second.
7544:
3410:
1357:
1174:
897:
302:
137:
115:
95:
48:
8288:
3178:
In addition to DDR, there were several other proposed memory technologies to succeed SDR SDRAM.
2246:
All SDRAM generations (SDR and DDRx) use essentially the same commands, with the changes being:
6892:
5871:
3609:
2858:
2471:
2460:
1230:
447:
317:
257:
7036:
6181:
2517:
continue until interrupted. Full-row bursts are only permitted with the sequential burst type.
579:
8111:
7854:
7727:
7634:
7452:
7447:
7395:
7390:
7332:
7258:
6928:
5671:
5075:
4550:
3783:
3597:
3592:
3496:
3491:μPD481850, introduced in December 1994. The earliest known commercial device to use SGRAM is
3472:, SGRAM is single-ported. However, it can open two memory pages at once, which simulates the
3110:
3080:
1656:
1486:
733:
651:
437:
242:
222:
212:
68:
33:
7967:
1728:
8272:
7145:
6533:
5996:
3907:
2965:
2950:
2877:
1577:
1560:
1536:
where the operation of its external pin interface is coordinated by an externally supplied
1429:
1297:
1076:
1036:
959:
572:
477:
367:
262:
125:
105:
88:
83:
8303:
7359:
3633:
8:
7761:
7700:
7669:
7180:"EMOTION ENGINE AND GRAPHICS SYNTHESIZER USED IN THE CORE OF PLAYSTATION BECOME ONE CHIP"
7150:
7082:
6812:
5251:
3895:
3855:
3741:
3605:
3580:
3208:, SLDRAM uses a double-pumped bus, giving it an effective speed of 400, 600, or 800
3005:
2969:
2862:
1701:
1637:
1594:
1335:
1026:
964:
949:
816:
768:
621:
432:
130:
6000:
3657:
Please help update this article to reflect recent events or newly available information.
8143:
8003:
7307:
3504:
3500:
2820:
1690:
1662:
Today, virtually all SDRAM is manufactured in compliance with standards established by
1571:
1544:
1435:
1400:
1046:
472:
457:
402:
397:
387:
362:
287:
7988:
2522:
extended mode register No. 1 (EMR1), and a 5-bit extended mode register No. 2 (EMR2).
7536:
7509:
6166:
6030:
5966:
5939:
5912:
5696:
3406:
3152:
2827:
1841:, column address strobe. This is also not a strobe, rather a command bit. Along with
1709:
1686:
1112:
1107:
1031:
996:
850:
828:
727:
686:
589:
427:
152:
6598:
6565:
6229:
3629:
6352:
6004:
3522:
3121:
or less, compared to the 1.5 V of DDR3 chips, and have in excess of 2 billion
3024:
2715:
2575:
DDR SDRAM employs prefetch architecture to allow quick and easy access to multiple
1713:
1622:
1614:
1447:
1441:
1367:
1330:
1320:
1285:
1097:
1051:
1019:
794:
777:
462:
422:
182:
167:
63:
53:
7078:"Samsung Electronics Develops First 128Mb SDRAM with DDR/SDR Manufacturing Option"
3219:
The basic read/write command consisted of (beginning with CA9 of the first word):
8095:
7959:
Everything you always wanted to know about SDRAM (memory), but were afraid to ask
6845:
6403:
6025:
5960:
5933:
5906:
3473:
3357:
CMD4=1 to open (activate) the specified row; CMD4=0 to use the currently open row
2865:(FPM-RAM) which took typically two or three clocks to transfer one word of data.
1340:
1167:
1154:
845:
840:
696:
563:
542:
517:
377:
297:
227:
197:
172:
58:
29:
6509:"DDR5 Memory Specification Released: Setting the Stage for DDR5-6400 And Beyond"
8324:
7823:"Samsung Increases Production Volumes of 8 GB HBM2 Chips Due to Growing Demand"
3449:
2920:
2311:
2262:
DDR2 deletes the burst terminate command; DDR3 reassigns it as "ZQ calibration"
1667:
1652:
1459:
1377:
1220:
877:
739:
675:
547:
532:
512:
507:
452:
417:
372:
322:
312:
307:
292:
187:
177:
110:
7723:"Samsung Electronics Develops Industry's First Ultra-Fast GDDR4 Graphics DRAM"
2288:
8318:
8249:
8164:
7996:
6964:
6085:
5813:
5017:
4433:
4428:
4158:
3860:
3572:
GDDR was initially known as DDR SGRAM. It was commercially introduced as a 16
3469:
3200:
3122:
2916:
1465:
1092:
1087:
1056:
811:
721:
537:
527:
522:
502:
337:
327:
207:
192:
6838:
2268:
7849:
7665:"Samsung Electronics Announces JEDEC-Compliant 256Mb GDDR2 for 3D Graphics"
7290:
6649:
5573:
5547:
4861:
4807:
4779:
2912:
2904:
2475:
1694:
1537:
1412:
1406:
1372:
1240:
1195:
1179:
1071:
867:
862:
822:
784:
467:
442:
342:
277:
232:
217:
7228:
7011:
6867:
6451:"Samsung Develops Industry's First DDR4 DRAM, Using 30nm Class Technology"
8209:
8204:
8199:
8194:
8189:
8184:
3453:
3084:
2114:
Write with auto precharge: as above, and precharge (close row) when done
1776:
1756:
1566:
1533:
1471:
1423:
857:
392:
332:
237:
6743:
2238:
Load mode register: A0 through A9 are loaded to configure the DRAM chip.
2062:
Read with auto precharge: as above, and precharge (close row) when done
1806:
the chip. There is one DQM line per 8 bits on a x16 memory chip or DIMM.
8179:
8082:
8077:
8072:
8067:
4264:
3526:
3516:
3457:
3378:
3164:
3106:
3100:
3070:
3048:
2932:
2843:
2823:
2815:
2792:
2774:
2747:
2652:
2646:
2640:
2634:
2599:
2564:
2544:
permissible to change the clock rate, or even stop the clock entirely.
2456:
1679:
1675:
1066:
892:
646:
412:
407:
282:
147:
73:
20:
7958:
2587:
the sense amplifiers also act as latches. For reference, a row of a 1
2401:
to return the chip to the idle state. (This time is usually equal to t
2259:
Additional extended mode registers (selected by the bank address bits)
1513:
8239:
8062:
7962:
7827:
7796:
5137:
5009:
4010:
3736:
3530:
3374:
3205:
3017:
2992:
2938:
2704:
2628:
2576:
2452:
2413:
before the row is fully open and can accept read and write commands.
1671:
1626:
1453:
1418:
1255:
1184:
1082:
953:
944:
641:
584:
352:
272:
7908:"Samsung fires up its foundries for mass production of GDDR6 memory"
6008:
3155:
technology and draws 40% less power than an equivalent DDR3 module.
8234:
8039:
8034:
7119:
5877:
5628:
3613:
3461:
1705:
1641:
1382:
1325:
1260:
1215:
1200:
970:
939:
912:
887:
745:
631:
357:
267:
162:
157:
5885:
High-Performance DRAM System Design
Constraints and Considerations
3366:
CMD1=1 to close the row after this access; CMD1=0 to leave it open
8267:
8131:
7884:
7859:
7732:
7674:
7639:
7482:
7457:
7400:
7337:
7263:
7155:
7087:
6896:
6817:
6690:
6125:
Micron, General DDR SDRAM Functionality, Technical Note, TN-46-05
5143:
4197:
3731:
3576:
3484:
3144:
3140:
3000:
2962:
2889:
2655:'s prefetch buffer size is 8n; there is an additional mode of 16n
2649:'s prefetch buffer size is 8n (eight datawords per memory access)
2643:'s prefetch buffer size is 8n (eight datawords per memory access)
2588:
1633:
1618:
1280:
1270:
1265:
1225:
1127:
1122:
1102:
907:
882:
872:
663:
7930:"Samsung Begins Producing The Fastest GDDR6 Memory In The World"
2637:'s prefetch buffer size is 4n (four datawords per memory access)
1689:
varieties, for systems that require greater scalability such as
8221:
8106:
7792:"Micron Begins to Sample GDDR5X Memory, Unveils Specs of Chips"
7043:
5818:
5690:
5148:
5107:
5022:
4897:
4667:
4272:
4202:
3969:
3709:
3566:
3562:
3554:
3510:
3507:
model released in
December 1995, using the NEC μPD481850 chip.
3148:
2900:
2631:'s prefetch buffer size is 2n (two datawords per memory access)
2624:
Each generation of SDRAM has a different prefetch buffer size:
2189:
Precharge all: deactivate (close) the current row of all banks
2163:
Precharge: deactivate (close) the current row of selected bank
1547:(ICs) produced from the early 1970s to the early 1990s used an
1275:
1235:
1117:
1006:
804:
347:
7294:. 4 November 2003. Archived from the original on July 10, 2019
6808:"Samsung Electronics Comes Out with Super-Fast 16M DDR SGRAMs"
2010:
Burst terminate: stop a burst read or burst write in progress
1589:
8229:
8174:
8169:
8136:
8121:
8101:
8089:
7984:
PC SDRAM Serial
Presence Detect (SPD) Specification, Rev 1.2B
6493:
6377:
5861:
5857:
5853:
5849:
5845:
5841:
5804:
5538:
5498:
5452:
5394:
5323:
5133:
4535:
4348:
4188:
3778:
3558:
3550:
3546:
3542:
3538:
3401:
3360:
CMD3=1 to transfer an 8-word burst; CMD3=0 for a 4-word burst
3186:
3132:
double the internal prefetch width again, but uses the same 8
2908:
2480:
1663:
1556:
1210:
1147:
1142:
1137:
799:
756:
750:
636:
616:
601:
6400:"Samsung hints to DDR4 with first validated 40 nm DRAM"
3655:. The reason given is: Advances in DDR5 need to be included.
19:"PC100" redirects here. For the Japanese home computer, see
8262:
8257:
8126:
8116:
7186:
7115:"Samsung Demonstrates World's First DDR 3 Memory Prototype"
5985:
5837:
5729:
5245:
5153:
4853:
4373:
4193:
3753:
3492:
3209:
3199:
name to Advanced Memory International, Inc.) SLDRAM was an
3118:
2996:
2958:
2885:
2839:
2618:
2591:
2314:
the dynamic (capacitive) memory storage cells of that row.
1645:
1598:
1205:
492:
142:
6374:"JEDEC Announces Key Attributes of Upcoming DDR4 Standard"
5931:
3079:
Again, with every doubling, the downside is the increased
2137:
Active (activate): open a row for read and write commands
1700:
Today, the world's largest manufacturers of SDRAM include
7580:
6777:
6721:
5179:
5090:
3816:
3692:
3488:
3397:
3396:
VCM was a proprietary type of SDRAM that was designed by
2595:
2088:
Write: write a burst of data to the currently active row
2036:
Read: read a burst of data from the currently active row
1648:
in modern computers, because of its greater performance.
1610:
1245:
1132:
902:
6472:"Samsung develops DDR4 memory, up to 40% more efficient"
6324:"Next-Generation DDR4 Memory to Reach 4.266GHz - Report"
2850:
never required for a read and a write at the same time.
1559:, the clock signal controls the stepping of an internal
8018:
6620:
6490:"JEDEC DDR5 & NVDIMM-P Standards Under Development"
6306:"heise online - IT-News, Nachrichten und Hintergründe"
2923:. It was superseded by the PC100 and PC133 standards.
2256:
Wider mode registers (DDR2 and up use 13 bits, A0–A12)
1825:
a strobe, but rather simply a command bit. Along with
7422:"Samsung 50nm 2GB DDR3 chips are industry's smallest"
7328:"Samsung Shows Industry's First 2-Gigabit DDR2 SDRAM"
5880:- Flash website built by Tel-Aviv University students
3391:
1779:, which are sampled on the rising edge of the clock:
1731:
611:
2972:
with PC66 and was superseded by the PC133 standard.
2510:
clock frequency to translate that limit into cycles.
6651:
128M-BIT VirtualChannel SDRAM preliminary datasheet
6554:
6020:
6018:
3443:
3381:, which always write in multiples of a cache line.
7140:
7138:
6288:"IDF: "DDR3 won't catch up with DDR2 during 2009""
6245:"G.SKILL Announces DDR3 Memory Kit For Ivy Bridge"
6135:
6133:
6131:
5887:, a master thesis from the University of Maryland.
3369:CMD0 selects the DCLK pair to use (DCLK1 or DCLK0)
2570:
1744:
1666:, an electronics industry association that adopts
6197:"Pipe Dreams: Six P35-DDR3 Motherboards Compared"
6194:
3680:Synchronous dynamic random-access memory (SDRAM)
3193:
2506:M8, M7: Operating mode. Reserved, and must be 00.
2250:Additional address bits to support larger devices
8316:
7380:ATI engineers by way of Beyond 3D's Dave Baumann
6242:
6015:
3487:HM5283206, introduced in November 1994, and the
2579:located on a common physical row in the memory.
1821:, row address strobe. Despite the name, this is
7135:
6366:
6351:(in German). hardware-infos.com. Archived from
6326:. Xbitlabs.com. August 16, 2010. Archived from
6142:"The outlook for DRAMs in consumer electronics"
6128:
1891:The SDR SDRAM commands are defined as follows:
7979:133 MHz PC133 SDRAM SO-DIMM Specification
7659:
7657:
7604:"16M-BIT SYNCHRONOUS GRAPHICS RAM: μPD4811650"
6500:
3600:(HBM) is a high-performance RAM interface for
3586:
2949:is a standard for internal removable computer
2763:Internal operations are at 1/2 the clock rate.
2279:is high, other commands are the same as above.
8004:
7816:
7814:
7223:
7221:
7219:
7217:
7215:
7213:
7211:
6862:
6860:
6858:
6856:
6854:
6230:"Super Talent & TEAM: DDR3-1600 Is Here!"
5792:
5714:
5678:
5436:
5402:
5229:
5165:
5122:
4684:
3995:
3955:
3339:5 or 4 bits spare for row or column expansion
2987:is a computer memory standard defined by the
2317:Once the row has been activated or "opened",
2283:
1494:
7383:
7072:
7070:
7068:
6916:
6914:
6802:
6800:
6798:
6679:
6677:
6597:(data sheet), pp. 32–33, archived from
3511:Graphics double data rate SDRAM (GDDR SDRAM)
3223:SLDRAM Read, write or row op request packet
2419:
7654:
7320:
7174:
7172:
7006:
7004:
6587:
5958:
3319:
3299:
3291:
3288:
3282:
3268:
2804:point-to-point (single module per channel)
8011:
7997:
7811:
7505:"Samsung Unleashes a Roomy DDR4 256GB RAM"
7208:
6885:
6851:
6766:
6764:
6710:
6708:
6227:
6038:(15–21). Hayden Publishing Company. 1993.
5959:Jacob, B.; Ng, S. W.; Wang, D. T. (2008).
5874:- EEPROM with timing data on SDRAM modules
3533:designed to be used as the main memory of
3350:A read/write command had the msbit clear:
2903:-based PCs. It also features in the Beige
1501:
1487:
7065:
6911:
6795:
6674:
6624:HYB39V64x0yT 64MBit Virtual Channel SDRAM
6558:HYSL8M18D600A 600 Mb/s/pin 8M x 18 SLDRAM
6531:
5904:
5072:Synchronous graphics random-access memory
3212:. (1 MT/s = 1000^2 transfers per second)
2455:will generally access memory in units of
7899:
7601:
7169:
7001:
6591:SLD4M18DR400 400 Mb/s/pin 4M x 18 SLDRAM
6064:
6062:
6060:
6058:
6056:
6054:
6052:
6050:
6048:
3476:nature of other video RAM technologies.
2937:
2814:
2287:
1588:
1522:Synchronous dynamic random-access memory
1512:
7905:
7352:
7109:
7107:
7105:
6978:
6976:
6974:
6761:
6705:
6397:
6099:"Nanya 256 Mb DDR SDRAM Datasheet"
5932:B. Jacob; S. W. Ng; D. T. Wang (2008).
2842:that read or write 64 (non-ECC) or 72 (
2391:
1869:
8317:
7820:
7789:
7391:"Our Proud Heritage from 2000 to 2009"
6988:STOL (Semiconductor Technology Online)
6426:"DDR3 Will be Cheaper, Faster in 2009"
6423:
6398:Gruener, Wolfgang (February 4, 2009).
6139:
3181:
2876:refers to internal removable computer
2819:The 64 MB of sound memory on the
2271:of the activate command. A new signal
1878:
7992:
7448:"Our Proud Heritage from 2010 to Now"
6506:
6045:
5111:
5101:
3713:
3703:
3479:The earliest known SGRAM memory are 8
3363:CMD2=1 for a write, CMD2=0 for a read
1849:, this selects one of eight commands.
1833:, this selects one of eight commands.
1042:Vision Electronic Recording Apparatus
7360:"ソニー、65nm対応の半導体設備を導入。3年間で2,000億円の投資"
7102:
6971:
6349:"IDF: DDR4 memory targeted for 2012"
5989:IEEE Journal of Solid-State Circuits
5115:
3717:
3637:
3626:Random-access memory § Timeline
3483:Mbit chips dating back to 1994: the
3409:. In the late 1990s, a number of PC
3173:
2931:For the Japanese home computer, see
2440:time, three cycles may be required.
7608:NEC Device Technology International
7537:"Hitachi HM5283206FP10 8Mbit SGRAM"
6848:page 118 "High-Bandwidth DRAM"
6647:
13:
7513:. 6 September 2018. Archived from
6555:Hyundai Electronics (1997-12-20),
6243:Jennifer Johnson (24 April 2012).
6215:"AMD to Adopt DDR3 in Three Years"
6195:Thomas Soderstrom (June 5, 2007).
3392:Virtual channel memory (VCM) SDRAM
2538:
1810:
1770:
203:Data validation and reconciliation
14:
8341:
7952:
5962:Memory Systems: Cache, DRAM, Disk
5935:Memory Systems: Cache, DRAM, Disk
3316:
3313:
3310:
3302:
2446:
2211:
2208:
2205:
2185:
2179:
2159:
2006:
2003:
2000:
1980:
1977:
1974:
1954:
1951:
1948:
1945:
1942:
1939:
1613:invented DDR SDRAM, they built a
253:Distributed file system for cloud
7906:Killian, Zak (18 January 2018).
7790:Shilov, Anton (March 29, 2016).
7370:from the original on 2016-08-13.
5965:. Morgan Kaufmann. p. 333.
5938:. Morgan Kaufmann. p. 324.
5840:(graphics DDR) and its subtypes
5065:
3642:
3444:Synchronous Graphics RAM (SGRAM)
2915:. It is also used in many early
2490:
101:Areal density (computer storage)
7974:PC SDRAM Specification, Rev 1.7
7922:
7873:
7842:
7821:Shilov, Anton (July 19, 2017).
7783:
7771:from the original on 2022-01-24
7747:
7715:
7689:
7622:
7595:
7567:
7555:from the original on 2003-07-16
7529:
7497:
7471:
7440:
7414:
7374:
7286:"Elpida ships 2GB DDR2 modules"
7278:
7246:
7196:from the original on 2017-02-27
7053:from the original on 2019-06-21
7029:
6950:
6938:from the original on 2019-06-21
6832:
6773:NEC Application Specific Memory
6736:
6664:from the original on 2013-12-03
6641:
6637:from the original on 2018-11-12
6614:
6581:
6548:
6525:
6482:
6464:
6443:
6428:. dailytech.com. Archived from
6424:Jansen, Ng (January 20, 2009).
6417:
6391:
6341:
6316:
6298:
6280:
6262:
6251:
6236:
6221:
6207:
6188:
6174:
6159:
3285:
3274:
3271:
3265:
3117:The DDR4 chips run at 1.2
3105:DDR4 SDRAM is the successor to
2821:Sound Blaster X-Fi Fatality Pro
2571:DDR SDRAM prefetch architecture
2525:
2451:A modern microprocessor with a
2228:
2225:
2222:
2219:
2202:
2199:
2196:
2193:
2182:
2176:
2173:
2170:
2167:
2156:
2150:
2147:
2144:
2141:
2127:
2124:
2121:
2118:
2107:
2101:
2098:
2095:
2092:
2081:
2075:
2072:
2069:
2066:
2055:
2049:
2046:
2043:
2040:
2029:
2023:
2020:
2017:
2014:
1997:
1994:
1991:
1988:
1971:
1968:
1965:
1962:
1958:Command inhibit (no operation)
1936:
920:Programmable metallization cell
6270:"DDR4 not expected until 2015"
6119:
6091:
5979:
5952:
5925:
5898:
3634:Transistor count § Memory
3413:chipsets (such as the popular
3194:Synchronous-link DRAM (SLDRAM)
2942:DIMM: 168 pins and two notches
2659:
483:Persistence (computer science)
1:
8293:
6621:Siemens Semiconductor Group,
6402:. tgdaily.com. Archived from
5891:
3503:, starting with the Japanese
1351:Electronic quantum holography
8020:Dynamic random-access memory
7970:, May 2011, Hardware Secrets
6967:. February 1996. p. 40.
6564:(data sheet), archived from
6228:Wesly Fink (July 20, 2007).
6140:Graham, Allan (2007-01-12).
3630:Flash memory § Timeline
3460:. It adds functions such as
3417:) included VCSDRAM support.
3336:10 or 11 bits of row address
3031:DDR SDRAM (sometimes called
702:Video RAM (dual-ported DRAM)
498:Non-RAID drive architectures
7:
7755:"K4W1G1646G-BC08 Datasheet"
5831:
3619:
3587:High Bandwidth Memory (HBM)
3529:) is a type of specialized
2919:systems with a 66 MHz
2834:Originally simply known as
2292:SDRAM memory module, zoomed
2253:Additional bank select bits
1886:
1857:, write enable. Along with
1685:SDRAM is also available in
10:
8346:
6588:SLDRAM Inc. (1998-07-09),
6507:Smith, Ryan (2020-07-14).
3623:
3590:
3514:
3440:(256 bytes) in a segment.
3162:
3098:
3068:
3046:
3015:
2930:
2895:This standard was used by
2787:Much longer CAS latencies
2284:Construction and operation
2237:
2214:
2188:
2162:
2136:
2113:
2087:
2061:
2035:
2009:
1983:
1957:
1584:
1291:Holographic Versatile Disc
1190:Compact Disc Digital Audio
1062:Magnetic-tape data storage
681:Content-addressable memory
18:
8281:
8248:
8220:
8152:
8048:
8027:
7968:Understanding RAM Timings
7312:: CS1 maint: unfit URL (
5867:List of device bandwidths
5649:
5642:
5639:
5632:
5627:
5519:
5512:
5509:
5388:
5381:
5378:
5371:
5368:
5362:
5355:
5352:
4998:
4995:
4816:
4813:
4793:
4786:
4783:
4758:
4755:
4717:
4645:
4638:
4635:
4517:
4400:
4397:
4362:
4330:
4219:
4216:
4111:
4108:
4041:
4038:
3768:
3651:This section needs to be
3535:graphics processing units
3109:. It was revealed at the
2791:
2773:
2754:"Burst terminate" removed
2746:
2703:
2677:
2672:
2669:
2483:for its microprocessors.
2420:Interrupting a read burst
2269:DDR4 changes the encoding
2234:
2133:
1719:
1636:) followed soon after by
488:Persistent data structure
383:Digital rights management
6893:"KM48SL2000-7 Datasheet"
6532:Dean Kent (1998-10-24),
6088:based on powers of 1024.
3674:
3342:7 bits of column address
2979:
2926:
2880:standard defined by the
2756:4 units used in parallel
2610:in multiple data words.
1363:DNA digital data storage
1346:Holographic data storage
835:Solid-state hybrid drive
121:Network-attached storage
8330:South Korean inventions
7545:Smithsonian Institution
6957:"Ultra 64 Tech Specs".
3158:
3094:
3064:
3042:
2868:
1801:data mask. (The letter
1526:synchronous dynamic RAM
1358:5D optical data storage
1175:3D optical data storage
898:Universal Flash Storage
303:Replication (computing)
248:Distributed file system
138:Single-instance storage
116:Direct-attached storage
96:Continuous availability
16:Type of computer memory
7697:"K4D553238F Datasheet"
7602:Takeuchi, Kei (1998).
7364:pc.watch.impress.co.jp
6922:"MSM5718C50/MD5764802"
5872:Serial presence detect
3333:3 bits of bank address
3011:
2943:
2859:extended data out DRAM
2831:
2810:
2293:
1746:
1745:{\displaystyle 10^{6}}
1602:
1518:
1231:Nintendo optical discs
448:Storage virtualization
318:Information repository
258:Distributed data store
7855:Samsung Semiconductor
7728:Samsung Semiconductor
7635:Samsung Semiconductor
7453:Samsung Semiconductor
7396:Samsung Semiconductor
7333:Samsung Semiconductor
7259:Samsung Semiconductor
6780:. Fall 1995. p.
6453:. Samsung. 2011-01-04
6182:"What is DDR memory?"
5083:Date of introduction
5076:High Bandwidth Memory
3685:Date of introduction
3598:High Bandwidth Memory
3593:High Bandwidth Memory
3111:Intel Developer Forum
3008:with PC100 and PC66.
2941:
2818:
2291:
1755:Another limit is the
1747:
1597:SDRAM ICs on a PC100
1592:
1516:
734:Mellon optical memory
722:Williams–Kilburn tube
438:Locality of reference
243:Clustered file system
69:Memory access pattern
7576:UPD4811650 Datasheet
6330:on December 19, 2010
6167:"SDRAM Part Catalog"
3151:at 1.2 V, uses
2951:random-access memory
2392:Command interactions
1870:Bank selection (BAn)
1729:
1561:finite-state machine
1430:Magnetic-core memory
1077:Digital Data Storage
1037:Quadruplex videotape
478:In-memory processing
368:Information transfer
263:Distributed database
126:Storage area network
106:Block (data storage)
7762:Samsung Electronics
7701:Samsung Electronics
7670:Samsung Electronics
7428:. 29 September 2008
7340:. 20 September 2004
7151:Samsung Electronics
7083:Samsung Electronics
6820:. 17 September 1998
6813:Samsung Electronics
6717:μPD481850 Datasheet
6686:HM5283206 Datasheet
6217:. 28 November 2005.
6026:"Electronic Design"
6001:1990IJSSC..25.1118K
5079:
3681:
3581:Samsung Electronics
3415:VIA KX133 and KT133
3327:9 bits of device ID
3224:
3182:Rambus DRAM (RDRAM)
3006:backward compatible
2970:backward compatible
2863:fast page mode DRAM
2666:
2470:For the sequential
1879:Addressing (A10/An)
1702:Samsung Electronics
1638:Hyundai Electronics
1545:integrated circuits
1517:SDRAM memory module
1027:Phonograph cylinder
965:Electrochemical RAM
817:Solid-state storage
433:Memory segmentation
131:Block-level storage
8144:Hybrid Memory Cube
7887:. January 18, 2018
7735:. October 26, 2005
7189:. April 21, 2003.
7123:. 17 February 2005
7090:. 10 February 1999
6844:2015-02-06 at the
6693:. 11 November 1994
5905:P. Darche (2020).
5070:
3679:
3501:video game console
3222:
3139:In February 2009,
2991:. PC133 refers to
2944:
2846:) bits at a time.
2832:
2826:is built from two
2779:Access is ≥8 words
2752:Access is ≥4 words
2712:Access is ≥2 words
2665:SDRAM feature map
2664:
2294:
1742:
1615:dual-edge clocking
1609:In the late 1980s
1603:
1519:
1436:Plated-wire memory
1401:Paper data storage
1047:Magnetic recording
473:In-memory database
458:Memory-mapped file
403:Volume boot record
398:Master boot record
388:Volume (computing)
363:Data communication
288:Data deduplication
8312:
8311:
7936:. 18 January 2018
7764:. November 2010.
7266:. 29 January 2003
7046:. 12 March 1998.
6931:. February 1999.
6929:Oki Semiconductor
6839:ISSCC 2014 Trends
6724:. 6 December 1994
6535:RAM Guide: SLDRAM
6492:(Press release).
6376:(Press release).
6276:. 16 August 2010.
6171:070928 micron.com
6148:. AspenCore Media
6031:Electronic Design
5829:
5828:
5063:
5062:
3672:
3671:
3407:memory controller
3330:6 bits of command
3324:
3323:
3174:Failed successors
3153:pseudo open drain
2953:, defined by the
2808:
2807:
2383:delay between an
2244:
2243:
1710:Micron Technology
1511:
1510:
1108:8 mm video format
1032:Phonograph record
851:Flash Core Module
829:Solid-state drive
728:Delay-line memory
687:Computational RAM
590:Scratchpad memory
428:Disk partitioning
153:Unstructured data
79:Secondary storage
8337:
8304:Transistor count
8013:
8006:
7999:
7990:
7989:
7946:
7945:
7943:
7941:
7926:
7920:
7919:
7917:
7915:
7903:
7897:
7896:
7894:
7892:
7877:
7871:
7870:
7868:
7866:
7846:
7840:
7839:
7837:
7835:
7818:
7809:
7808:
7806:
7804:
7787:
7781:
7780:
7778:
7776:
7770:
7759:
7751:
7745:
7744:
7742:
7740:
7719:
7713:
7712:
7710:
7708:
7693:
7687:
7686:
7684:
7682:
7677:. 28 August 2003
7661:
7652:
7651:
7649:
7647:
7626:
7620:
7619:
7617:
7615:
7599:
7593:
7592:
7590:
7588:
7571:
7565:
7564:
7562:
7560:
7554:
7541:
7533:
7527:
7526:
7524:
7522:
7517:on June 21, 2019
7501:
7495:
7494:
7492:
7490:
7475:
7469:
7468:
7466:
7464:
7444:
7438:
7437:
7435:
7433:
7418:
7412:
7411:
7409:
7407:
7387:
7381:
7378:
7372:
7371:
7356:
7350:
7349:
7347:
7345:
7324:
7318:
7317:
7311:
7303:
7301:
7299:
7282:
7276:
7275:
7273:
7271:
7250:
7244:
7243:
7241:
7239:
7229:"History: 2000s"
7225:
7206:
7205:
7203:
7201:
7195:
7184:
7176:
7167:
7166:
7164:
7162:
7142:
7133:
7132:
7130:
7128:
7111:
7100:
7099:
7097:
7095:
7074:
7063:
7062:
7060:
7058:
7052:
7041:
7033:
7027:
7026:
7024:
7022:
7012:"History: 1990s"
7008:
6999:
6998:
6996:
6994:
6980:
6969:
6968:
6954:
6948:
6947:
6945:
6943:
6937:
6926:
6918:
6909:
6908:
6906:
6904:
6889:
6883:
6882:
6880:
6878:
6868:"History: 2010s"
6864:
6849:
6836:
6830:
6829:
6827:
6825:
6804:
6793:
6792:
6790:
6788:
6768:
6759:
6758:
6756:
6754:
6740:
6734:
6733:
6731:
6729:
6712:
6703:
6702:
6700:
6698:
6681:
6672:
6671:
6670:
6669:
6663:
6656:
6645:
6639:
6638:
6636:
6629:
6618:
6612:
6611:
6610:
6609:
6603:
6596:
6585:
6579:
6578:
6577:
6576:
6570:
6563:
6552:
6546:
6545:
6544:
6543:
6538:, Tom's Hardware
6529:
6523:
6522:
6520:
6519:
6504:
6498:
6497:
6496:. 30 March 2017.
6486:
6480:
6479:
6468:
6462:
6461:
6459:
6458:
6447:
6441:
6440:
6438:
6437:
6432:on June 22, 2009
6421:
6415:
6414:
6412:
6411:
6395:
6389:
6388:
6386:
6385:
6370:
6364:
6363:
6361:
6360:
6345:
6339:
6338:
6336:
6335:
6320:
6314:
6313:
6302:
6296:
6295:
6284:
6278:
6277:
6274:semiaccurate.com
6266:
6260:
6258:DDR4 PDF page 23
6255:
6249:
6248:
6240:
6234:
6233:
6225:
6219:
6218:
6211:
6205:
6204:
6192:
6186:
6185:
6178:
6172:
6170:
6163:
6157:
6156:
6154:
6153:
6137:
6126:
6123:
6117:
6116:
6114:
6113:
6103:
6095:
6089:
6066:
6043:
6042:
6022:
6013:
6012:
5983:
5977:
5976:
5956:
5950:
5949:
5929:
5923:
5922:
5902:
5794:
5716:
5680:
5438:
5404:
5231:
5167:
5124:
5117:
5099:Manufacturer(s)
5080:
5069:
4686:
3997:
3957:
3719:
3701:Manufacturer(s)
3682:
3678:
3667:
3664:
3658:
3646:
3645:
3638:
3575:
3523:double data rate
3482:
3225:
3221:
3025:double data rate
2803:
2760:
2731:
2726:
2690:
2673:Feature changes
2667:
2663:
2594:device is 2,048
2496:register write.
2278:
2274:
1914:
1909:
1904:
1899:
1894:
1893:
1864:
1860:
1855:
1848:
1844:
1839:
1832:
1828:
1819:
1793:
1751:
1749:
1748:
1743:
1741:
1740:
1714:Nanya Technology
1632:
1625:SDRAM, known as
1623:double data rate
1503:
1496:
1489:
1448:Thin-film memory
1442:Core rope memory
1368:Universal memory
1331:Millipede memory
1321:Racetrack memory
1286:Ultra HD Blu-ray
1098:Linear Tape-Open
1052:Magnetic storage
1020:Analog recording
463:Software entropy
423:Disk aggregation
183:Data degradation
168:Data compression
64:Memory hierarchy
54:Memory coherence
26:
25:
8345:
8344:
8340:
8339:
8338:
8336:
8335:
8334:
8315:
8314:
8313:
8308:
8277:
8244:
8216:
8148:
8096:Fast Cycle DRAM
8044:
8023:
8017:
7961:, August 2010,
7955:
7950:
7949:
7939:
7937:
7928:
7927:
7923:
7913:
7911:
7904:
7900:
7890:
7888:
7879:
7878:
7874:
7864:
7862:
7848:
7847:
7843:
7833:
7831:
7819:
7812:
7802:
7800:
7788:
7784:
7774:
7772:
7768:
7757:
7753:
7752:
7748:
7738:
7736:
7721:
7720:
7716:
7706:
7704:
7695:
7694:
7690:
7680:
7678:
7663:
7662:
7655:
7645:
7643:
7628:
7627:
7623:
7613:
7611:
7600:
7596:
7586:
7584:
7583:. December 1997
7573:
7572:
7568:
7558:
7556:
7552:
7539:
7535:
7534:
7530:
7520:
7518:
7503:
7502:
7498:
7488:
7486:
7485:. July 17, 2018
7477:
7476:
7472:
7462:
7460:
7446:
7445:
7441:
7431:
7429:
7420:
7419:
7415:
7405:
7403:
7389:
7388:
7384:
7379:
7375:
7358:
7357:
7353:
7343:
7341:
7326:
7325:
7321:
7305:
7304:
7297:
7295:
7284:
7283:
7279:
7269:
7267:
7252:
7251:
7247:
7237:
7235:
7227:
7226:
7209:
7199:
7197:
7193:
7182:
7178:
7177:
7170:
7160:
7158:
7144:
7143:
7136:
7126:
7124:
7113:
7112:
7103:
7093:
7091:
7076:
7075:
7066:
7056:
7054:
7050:
7039:
7035:
7034:
7030:
7020:
7018:
7010:
7009:
7002:
6992:
6990:
6982:
6981:
6972:
6963:. No. 14.
6960:Next Generation
6956:
6955:
6951:
6941:
6939:
6935:
6924:
6920:
6919:
6912:
6902:
6900:
6891:
6890:
6886:
6876:
6874:
6866:
6865:
6852:
6846:Wayback Machine
6837:
6833:
6823:
6821:
6806:
6805:
6796:
6786:
6784:
6770:
6769:
6762:
6752:
6750:
6742:
6741:
6737:
6727:
6725:
6714:
6713:
6706:
6696:
6694:
6683:
6682:
6675:
6667:
6665:
6661:
6654:
6646:
6642:
6634:
6627:
6619:
6615:
6607:
6605:
6601:
6594:
6586:
6582:
6574:
6572:
6568:
6561:
6553:
6549:
6541:
6539:
6530:
6526:
6517:
6515:
6505:
6501:
6488:
6487:
6483:
6470:
6469:
6465:
6456:
6454:
6449:
6448:
6444:
6435:
6433:
6422:
6418:
6409:
6407:
6406:on May 24, 2009
6396:
6392:
6383:
6381:
6372:
6371:
6367:
6358:
6356:
6347:
6346:
6342:
6333:
6331:
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6321:
6317:
6304:
6303:
6299:
6286:
6285:
6281:
6268:
6267:
6263:
6256:
6252:
6241:
6237:
6226:
6222:
6213:
6212:
6208:
6193:
6189:
6180:
6179:
6175:
6165:
6164:
6160:
6151:
6149:
6138:
6129:
6124:
6120:
6111:
6109:
6101:
6097:
6096:
6092:
6086:binary prefixes
6067:
6046:
6024:
6023:
6016:
6009:10.1109/4.62132
5984:
5980:
5973:
5957:
5953:
5946:
5930:
5926:
5919:
5903:
5899:
5894:
5834:
5068:
3677:
3668:
3662:
3659:
3656:
3647:
3643:
3636:
3622:
3595:
3589:
3579:memory chip by
3573:
3519:
3513:
3480:
3446:
3394:
3300:Row (continued)
3196:
3184:
3176:
3167:
3161:
3103:
3097:
3073:
3067:
3051:
3045:
3020:
3014:
2982:
2936:
2929:
2871:
2813:
2801:
2797:
2786:
2780:
2764:
2762:
2758:
2757:
2755:
2753:
2742:
2729:
2724:
2720:
2699:
2688:
2684:
2662:
2573:
2554:
2541:
2539:Low power modes
2534:
2528:
2493:
2449:
2422:
2412:
2408:
2404:
2400:
2394:
2382:
2375:
2333:command, and a
2328:
2286:
2276:
2272:
2239:
1912:
1907:
1902:
1897:
1889:
1881:
1872:
1862:
1858:
1853:
1846:
1842:
1837:
1830:
1826:
1817:
1813:
1811:Command signals
1791:
1773:
1771:Control signals
1736:
1732:
1730:
1727:
1726:
1722:
1630:
1587:
1507:
1478:
1477:
1396:
1388:
1387:
1341:Patterned media
1311:
1303:
1302:
1170:
1160:
1159:
1155:Hard disk drive
1022:
1012:
1011:
992:
981:
980:
935:
925:
924:
846:IBM FlashSystem
841:USB flash drive
780:
763:
762:
717:
709:
708:
697:Dual-ported RAM
575:
558:
557:
518:Cloud computing
378:Copy protection
298:Data redundancy
228:Shared resource
198:Data validation
173:Data corruption
148:Structured data
59:Cache coherence
44:
30:Computer memory
24:
17:
12:
11:
5:
8343:
8333:
8332:
8327:
8310:
8309:
8307:
8306:
8301:
8296:
8294:SDRAM timeline
8291:
8285:
8283:
8279:
8278:
8276:
8275:
8270:
8265:
8260:
8254:
8252:
8250:Memory modules
8246:
8245:
8243:
8242:
8237:
8232:
8226:
8224:
8218:
8217:
8215:
8214:
8213:
8212:
8207:
8202:
8197:
8192:
8187:
8182:
8172:
8167:
8162:
8156:
8154:
8150:
8149:
8147:
8146:
8141:
8140:
8139:
8134:
8129:
8124:
8119:
8109:
8104:
8099:
8093:
8087:
8086:
8085:
8080:
8075:
8070:
8060:
8054:
8052:
8046:
8045:
8043:
8042:
8037:
8031:
8029:
8025:
8024:
8016:
8015:
8008:
8001:
7993:
7987:
7986:
7981:
7976:
7971:
7965:
7954:
7953:External links
7951:
7948:
7947:
7921:
7898:
7872:
7841:
7810:
7782:
7746:
7714:
7688:
7653:
7642:. 12 July 1999
7621:
7594:
7566:
7528:
7510:Tom's Hardware
7496:
7470:
7439:
7413:
7382:
7373:
7351:
7319:
7277:
7245:
7207:
7168:
7134:
7101:
7064:
7037:"Direct RDRAM"
7028:
7000:
6970:
6949:
6910:
6884:
6850:
6831:
6794:
6760:
6735:
6704:
6673:
6640:
6613:
6580:
6547:
6524:
6499:
6481:
6463:
6442:
6416:
6390:
6365:
6340:
6315:
6297:
6279:
6261:
6250:
6235:
6220:
6206:
6201:Tom's Hardware
6187:
6173:
6158:
6127:
6118:
6090:
6044:
6014:
5978:
5971:
5951:
5944:
5924:
5917:
5911:. p. 59.
5896:
5895:
5893:
5890:
5889:
5888:
5881:
5878:SDRAM Tutorial
5875:
5869:
5864:
5833:
5830:
5827:
5826:
5824:
5821:
5816:
5811:
5808:
5801:
5798:
5795:
5789:
5788:
5786:
5779:
5776:
5773:
5770:
5767:
5764:
5757:
5753:
5752:
5750:
5743:
5740:
5735:
5732:
5727:
5724:
5717:
5711:
5710:
5708:
5705:
5702:
5699:
5694:
5687:
5684:
5683:MT58K256M32JA
5681:
5675:
5674:
5669:
5662:
5655:
5651:
5650:
5648:
5641:
5638:
5631:
5626:
5625:SGRAM (GDDR3)
5623:
5620:
5613:
5609:
5608:
5606:
5603:
5600:
5593:
5590:
5589:SGRAM (GDDR3)
5587:
5584:
5581:
5577:
5576:
5571:
5568:
5567:SGRAM (GDDR5)
5565:
5562:
5555:
5551:
5550:
5545:
5542:
5535:
5532:
5525:
5521:
5520:
5518:
5511:
5508:
5501:
5496:
5495:SGRAM (GDDR4)
5493:
5490:
5483:
5479:
5478:
5476:
5469:
5466:
5459:
5456:
5449:
5446:
5439:
5433:
5432:
5430:
5427:
5424:
5417:
5414:
5411:
5408:
5405:
5399:
5398:
5390:
5389:
5387:
5380:
5377:
5370:
5367:
5366:SGRAM (GDDR2)
5364:
5361:
5354:
5350:
5349:
5347:
5340:
5337:
5330:
5327:
5320:
5317:
5310:
5306:
5305:
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5300:
5297:
5290:
5287:
5284:
5281:
5278:
5274:
5273:
5271:
5264:
5261:
5254:
5249:
5242:
5239:
5232:
5230:September 1998
5226:
5225:
5223:
5220:
5217:
5214:
5211:
5208:
5205:
5202:
5198:
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5015:
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5007:
5004:
4997:
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4983:
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4568:
4565:
4562:
4559:
4556:
4553:
4547:
4546:
4544:
4541:
4538:
4533:
4532:Sony, Toshiba
4530:
4527:
4524:
4519:
4515:
4514:
4512:
4505:
4502:
4499:
4496:
4493:
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4415:
4412:
4405:
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4399:
4395:
4394:
4392:
4385:
4382:
4379:
4376:
4371:
4368:
4360:
4359:
4357:
4354:
4351:
4346:
4345:Sony, Toshiba
4343:
4340:
4337:
4332:
4328:
4327:
4325:
4318:
4315:
4308:
4305:
4302:
4299:
4292:
4288:
4287:
4285:
4278:
4275:
4270:
4267:
4262:
4254:
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4110:
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4096:
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4080:
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4063:
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4053:
4050:
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4026:
4023:
4016:
4013:
4008:
4005:
3998:
3992:
3991:
3989:
3982:
3979:
3972:
3967:
3964:
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3863:
3858:
3853:
3850:
3847:
3839:
3838:
3836:
3829:
3826:
3819:
3814:
3811:
3808:
3802:
3801:
3799:
3796:
3793:
3786:
3781:
3776:
3773:
3770:
3766:
3765:
3763:
3756:
3751:
3744:
3739:
3734:
3728:
3725:
3721:
3720:
3715:
3712:
3707:
3702:
3699:
3696:
3689:
3686:
3676:
3673:
3670:
3669:
3650:
3648:
3641:
3621:
3618:
3591:Main article:
3588:
3585:
3515:Main article:
3512:
3509:
3450:texture memory
3445:
3442:
3393:
3390:
3371:
3370:
3367:
3364:
3361:
3358:
3355:
3344:
3343:
3340:
3337:
3334:
3331:
3328:
3322:
3321:
3318:
3315:
3312:
3309:
3305:
3304:
3301:
3298:
3294:
3293:
3290:
3287:
3284:
3281:
3277:
3276:
3273:
3270:
3267:
3264:
3260:
3259:
3256:
3253:
3250:
3247:
3244:
3241:
3238:
3235:
3232:
3229:
3195:
3192:
3183:
3180:
3175:
3172:
3163:Main article:
3160:
3157:
3123:data transfers
3099:Main article:
3096:
3093:
3069:Main article:
3066:
3063:
3047:Main article:
3044:
3041:
3016:Main article:
3013:
3010:
2981:
2978:
2928:
2925:
2870:
2867:
2861:(EDO-RAM) and
2812:
2809:
2806:
2805:
2799:
2795:
2789:
2788:
2777:
2771:
2770:
2750:
2744:
2743:
2741:
2740:
2733:
2727:
2722:
2718:
2716:Double clocked
2713:
2709:
2707:
2701:
2700:
2698:
2697:
2691:
2686:
2681:
2679:
2675:
2674:
2671:
2661:
2658:
2657:
2656:
2650:
2644:
2638:
2632:
2572:
2569:
2552:
2540:
2537:
2532:
2527:
2524:
2519:
2518:
2514:
2511:
2507:
2504:
2492:
2489:
2448:
2447:Burst ordering
2445:
2421:
2418:
2410:
2406:
2402:
2398:
2393:
2390:
2380:
2373:
2326:
2285:
2282:
2281:
2280:
2266:
2263:
2260:
2257:
2254:
2251:
2242:
2241:
2236:
2233:
2230:
2227:
2224:
2221:
2217:
2216:
2213:
2210:
2207:
2204:
2201:
2198:
2195:
2191:
2190:
2187:
2184:
2181:
2178:
2175:
2172:
2169:
2165:
2164:
2161:
2158:
2155:
2152:
2149:
2146:
2143:
2139:
2138:
2135:
2132:
2129:
2126:
2123:
2120:
2116:
2115:
2112:
2109:
2106:
2103:
2100:
2097:
2094:
2090:
2089:
2086:
2083:
2080:
2077:
2074:
2071:
2068:
2064:
2063:
2060:
2057:
2054:
2051:
2048:
2045:
2042:
2038:
2037:
2034:
2031:
2028:
2025:
2022:
2019:
2016:
2012:
2011:
2008:
2005:
2002:
1999:
1996:
1993:
1990:
1986:
1985:
1982:
1979:
1976:
1973:
1970:
1967:
1964:
1960:
1959:
1956:
1953:
1950:
1947:
1944:
1941:
1938:
1934:
1933:
1930:
1924:
1921:
1915:
1910:
1905:
1900:
1888:
1885:
1880:
1877:
1871:
1868:
1867:
1866:
1850:
1834:
1812:
1809:
1808:
1807:
1796:
1788:
1772:
1769:
1739:
1735:
1721:
1718:
1668:open standards
1653:burst EDO DRAM
1586:
1583:
1509:
1508:
1506:
1505:
1498:
1491:
1483:
1480:
1479:
1476:
1475:
1469:
1463:
1460:Twistor memory
1457:
1451:
1445:
1439:
1433:
1427:
1421:
1416:
1410:
1404:
1397:
1394:
1393:
1390:
1389:
1386:
1385:
1380:
1378:Quantum memory
1375:
1370:
1365:
1360:
1355:
1354:
1353:
1343:
1338:
1333:
1328:
1323:
1318:
1312:
1310:In development
1309:
1308:
1305:
1304:
1301:
1300:
1295:
1294:
1293:
1288:
1283:
1278:
1273:
1268:
1263:
1258:
1253:
1248:
1243:
1238:
1233:
1228:
1223:
1221:Super Video CD
1218:
1213:
1208:
1203:
1198:
1193:
1187:
1182:
1171:
1166:
1165:
1162:
1161:
1158:
1157:
1152:
1151:
1150:
1145:
1140:
1135:
1130:
1125:
1120:
1115:
1110:
1105:
1100:
1095:
1090:
1085:
1080:
1074:
1069:
1064:
1059:
1054:
1044:
1039:
1034:
1029:
1023:
1018:
1017:
1014:
1013:
1010:
1009:
1004:
999:
993:
987:
986:
983:
982:
979:
978:
973:
968:
962:
957:
947:
942:
936:
931:
930:
927:
926:
923:
922:
917:
916:
915:
910:
905:
900:
895:
890:
885:
880:
878:MultiMediaCard
875:
870:
865:
855:
854:
853:
848:
843:
838:
832:
826:
814:
809:
808:
807:
802:
792:
787:
781:
776:
775:
772:
771:
765:
764:
761:
760:
754:
748:
743:
740:Selectron tube
737:
731:
725:
718:
715:
714:
711:
710:
707:
706:
705:
704:
694:
689:
684:
678:
673:
668:
667:
666:
656:
655:
654:
649:
644:
639:
634:
629:
624:
619:
614:
609:
604:
594:
593:
592:
587:
580:Hardware cache
576:
571:
570:
567:
566:
560:
559:
556:
555:
550:
545:
540:
535:
533:Edge computing
530:
525:
520:
515:
513:Grid computing
510:
508:Bank switching
505:
500:
495:
490:
485:
480:
475:
470:
465:
460:
455:
453:Virtual memory
450:
445:
440:
435:
430:
425:
420:
418:Disk mirroring
415:
410:
405:
400:
395:
390:
385:
380:
375:
373:Temporary file
370:
365:
360:
355:
350:
345:
340:
335:
330:
325:
323:Knowledge base
320:
315:
313:Storage record
310:
308:Memory refresh
305:
300:
295:
293:Data structure
290:
285:
280:
275:
270:
265:
260:
255:
250:
245:
240:
235:
230:
225:
220:
215:
210:
205:
200:
195:
190:
188:Data integrity
185:
180:
178:Data cleansing
175:
170:
165:
160:
155:
150:
145:
140:
135:
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7910:. Tech Report
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6899:. August 1992
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6604:on 2012-04-26
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6571:on 2012-04-26
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5413:SGRAM (GDDR)
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5166:December 1994
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5123:November 1994
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2917:Intel Celeron
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2913:PowerBook G3s
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2897:Intel Pentium
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1984:No operation
1961:
1935:
1931:
1929:
1925:
1922:
1920:
1916:
1911:
1906:
1901:
1896:
1895:
1892:
1884:
1876:
1856:
1851:
1840:
1835:
1824:
1820:
1815:
1814:
1804:
1800:
1797:
1794:
1789:
1785:
1782:
1781:
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1778:
1768:
1764:
1760:
1758:
1753:
1737:
1733:
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1715:
1711:
1707:
1703:
1698:
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1692:
1688:
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1681:
1677:
1673:
1669:
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1596:
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1504:
1499:
1497:
1492:
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1485:
1484:
1482:
1481:
1473:
1470:
1467:
1466:Bubble memory
1464:
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1458:
1455:
1452:
1449:
1446:
1443:
1440:
1437:
1434:
1431:
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1237:
1234:
1232:
1229:
1227:
1224:
1222:
1219:
1217:
1214:
1212:
1209:
1207:
1204:
1202:
1199:
1197:
1194:
1191:
1188:
1186:
1183:
1181:
1178:
1177:
1176:
1173:
1172:
1169:
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1163:
1156:
1153:
1149:
1146:
1144:
1141:
1139:
1136:
1134:
1131:
1129:
1126:
1124:
1121:
1119:
1116:
1114:
1111:
1109:
1106:
1104:
1101:
1099:
1096:
1094:
1093:Cassette tape
1091:
1089:
1088:Videocassette
1086:
1084:
1081:
1078:
1075:
1073:
1070:
1068:
1065:
1063:
1060:
1058:
1057:Magnetic tape
1055:
1053:
1050:
1049:
1048:
1045:
1043:
1040:
1038:
1035:
1033:
1030:
1028:
1025:
1024:
1021:
1016:
1015:
1008:
1005:
1003:
1000:
998:
995:
994:
991:
985:
984:
977:
974:
972:
969:
966:
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961:
958:
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951:
948:
946:
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941:
938:
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934:
929:
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921:
918:
914:
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904:
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899:
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891:
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871:
869:
866:
864:
861:
860:
859:
856:
852:
849:
847:
844:
842:
839:
836:
833:
830:
827:
824:
821:
820:
818:
815:
813:
812:ROM cartridge
810:
806:
803:
801:
798:
797:
796:
793:
791:
788:
786:
783:
782:
779:
774:
773:
770:
767:
766:
758:
755:
752:
749:
747:
744:
741:
738:
735:
732:
729:
726:
723:
720:
719:
713:
712:
703:
700:
699:
698:
695:
693:
690:
688:
685:
682:
679:
677:
674:
672:
669:
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662:
661:
660:
657:
653:
650:
648:
645:
643:
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638:
635:
633:
630:
628:
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623:
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605:
603:
600:
599:
598:
595:
591:
588:
586:
583:
582:
581:
578:
577:
574:
569:
568:
565:
562:
561:
554:
551:
549:
546:
544:
541:
539:
538:Dew computing
536:
534:
531:
529:
528:Fog computing
526:
524:
523:Cloud storage
521:
519:
516:
514:
511:
509:
506:
504:
503:Memory paging
501:
499:
496:
494:
491:
489:
486:
484:
481:
479:
476:
474:
471:
469:
466:
464:
461:
459:
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451:
449:
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444:
441:
439:
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431:
429:
426:
424:
421:
419:
416:
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411:
409:
406:
404:
401:
399:
396:
394:
391:
389:
386:
384:
381:
379:
376:
374:
371:
369:
366:
364:
361:
359:
356:
354:
351:
349:
346:
344:
341:
339:
338:File deletion
336:
334:
331:
329:
328:Computer file
326:
324:
321:
319:
316:
314:
311:
309:
306:
304:
301:
299:
296:
294:
291:
289:
286:
284:
281:
279:
276:
274:
271:
269:
266:
264:
261:
259:
256:
254:
251:
249:
246:
244:
241:
239:
236:
234:
231:
229:
226:
224:
221:
219:
216:
214:
211:
209:
208:Data recovery
206:
204:
201:
199:
196:
194:
193:Data security
191:
189:
186:
184:
181:
179:
176:
174:
171:
169:
166:
164:
161:
159:
156:
154:
151:
149:
146:
144:
141:
139:
136:
132:
129:
127:
124:
123:
122:
119:
117:
114:
112:
109:
107:
104:
102:
99:
97:
94:
90:
89:floating-gate
87:
86:
85:
82:
80:
77:
75:
72:
70:
67:
65:
62:
60:
57:
55:
52:
50:
47:
46:
40:
39:
35:
31:
28:
27:
22:
8092:(Mobile DDR)
8057:
8049:
8028:Asynchronous
7938:. Retrieved
7933:
7924:
7912:. Retrieved
7901:
7889:. Retrieved
7875:
7863:. Retrieved
7853:
7844:
7832:. Retrieved
7826:
7801:. Retrieved
7795:
7785:
7773:. Retrieved
7749:
7737:. Retrieved
7726:
7717:
7705:. Retrieved
7703:. March 2005
7691:
7679:. Retrieved
7668:
7644:. Retrieved
7633:
7624:
7612:. Retrieved
7607:
7597:
7585:. Retrieved
7575:
7569:
7557:. Retrieved
7543:
7531:
7519:. Retrieved
7515:the original
7508:
7499:
7487:. Retrieved
7473:
7461:. Retrieved
7451:
7442:
7430:. Retrieved
7425:
7416:
7404:. Retrieved
7394:
7385:
7376:
7363:
7354:
7342:. Retrieved
7331:
7322:
7296:. Retrieved
7291:The Inquirer
7289:
7280:
7268:. Retrieved
7257:
7248:
7236:. Retrieved
7232:
7198:. Retrieved
7159:. Retrieved
7149:
7125:. Retrieved
7118:
7092:. Retrieved
7081:
7055:. Retrieved
7031:
7019:. Retrieved
7015:
6991:. Retrieved
6987:
6958:
6952:
6940:. Retrieved
6901:. Retrieved
6887:
6875:. Retrieved
6871:
6834:
6822:. Retrieved
6811:
6785:. Retrieved
6772:
6751:. Retrieved
6747:
6738:
6726:. Retrieved
6716:
6695:. Retrieved
6685:
6666:, retrieved
6650:
6648:NEC (1999),
6643:
6623:
6616:
6606:, retrieved
6599:the original
6590:
6583:
6573:, retrieved
6566:the original
6557:
6550:
6540:, retrieved
6534:
6527:
6516:. Retrieved
6512:
6502:
6484:
6475:
6466:
6455:. Retrieved
6445:
6434:. Retrieved
6430:the original
6419:
6408:. Retrieved
6404:the original
6393:
6382:. Retrieved
6380:. 2011-08-22
6368:
6357:. Retrieved
6353:the original
6343:
6332:. Retrieved
6328:the original
6318:
6310:heise online
6309:
6300:
6291:
6282:
6273:
6264:
6253:
6238:
6232:. Anandtech.
6223:
6209:
6200:
6190:
6176:
6161:
6150:. Retrieved
6145:
6121:
6110:. Retrieved
6108:. April 2003
6105:
6093:
6081:
6077:
6073:
6069:
6039:
6035:
6029:
5992:
5988:
5981:
5961:
5954:
5934:
5927:
5907:
5900:
5823:225 mm
5793:January 2018
5782:
5781:
5760:
5759:
5746:
5745:
5720:
5719:
5707:140 mm
5665:
5664:
5658:
5657:
5644:
5643:
5634:
5633:
5616:
5615:
5605:100 mm
5596:
5595:
5558:
5557:
5528:
5527:
5514:
5513:
5504:
5503:
5486:
5485:
5472:
5471:
5462:
5461:
5442:
5441:
5437:October 2005
5420:
5419:
5383:
5382:
5373:
5372:
5357:
5356:
5343:
5342:
5333:
5332:
5313:
5312:
5302:280 mm
5293:
5292:
5286:SGRAM (SDR)
5267:
5266:
5257:
5256:
5235:
5234:
5222:280 mm
5216:350 nm
5210:SGRAM (SDR)
5194:280 mm
5185:
5184:
5176:SGRAM (SDR)
5074:(SGRAM) and
5054:
5053:
5028:
5027:
5000:
4999:
4986:
4985:
4964:
4963:
4950:
4949:
4928:
4927:
4914:
4913:
4891:
4890:
4884:
4883:
4870:
4869:
4840:
4839:
4818:
4817:
4788:
4787:
4767:
4766:
4760:
4759:
4748:
4747:
4726:
4725:
4712:
4711:
4690:
4689:
4676:
4675:
4661:
4660:
4654:
4653:
4640:
4639:
4618:
4617:
4604:
4603:
4582:
4581:
4571:
4570:
4508:
4507:
4486:
4485:
4472:
4471:
4462:
4461:
4442:
4441:
4418:
4417:
4408:
4407:
4388:
4387:
4364:
4363:
4321:
4320:
4311:
4310:
4295:
4294:
4281:
4280:
4258:
4257:
4247:
4246:
4237:
4236:
4221:
4220:
4210:279 mm
4167:
4166:
4139:
4138:
4129:
4128:
4113:
4112:
4099:
4098:
4089:
4088:
4069:
4068:
4059:
4058:
4043:
4042:
4029:
4028:
4019:
4018:
4001:
4000:
3985:
3984:
3975:
3974:
3948:325 mm
3939:
3938:
3913:
3912:
3901:
3900:
3883:
3882:
3869:
3868:
3843:
3842:
3832:
3831:
3822:
3821:
3798:325 mm
3789:
3788:
3759:
3758:
3747:
3746:
3660:
3652:
3596:
3571:
3520:
3478:
3454:framebuffers
3447:
3438:
3435:
3431:
3427:
3423:
3419:
3395:
3387:
3383:
3372:
3349:
3345:
3283:Command code
3218:
3214:
3197:
3185:
3177:
3168:
3138:
3133:
3129:
3127:
3116:
3104:
3089:
3078:
3074:
3060:
3056:
3052:
3037:
3032:
3030:
3021:
2999:and 144-pin
2984:
2983:
2974:
2966:form factors
2961:and 144-pin
2946:
2945:
2905:Power Mac G3
2894:
2888:and 144-pin
2873:
2872:
2856:
2852:
2848:
2835:
2833:
2730:2.5 - 7.5 ns
2623:
2616:
2612:
2608:
2604:
2581:
2574:
2561:
2557:
2549:
2546:
2542:
2529:
2526:Auto refresh
2520:
2498:
2494:
2485:
2476:exclusive or
2469:
2465:
2450:
2442:
2438:
2434:
2430:
2427:
2423:
2415:
2395:
2384:
2378:
2370:
2364:
2362:
2356:
2354:
2349:
2345:
2343:
2338:
2334:
2330:
2322:
2318:
2316:
2306:
2304:
2298:
2295:
2245:
1927:
1918:
1890:
1882:
1873:
1852:
1836:
1822:
1816:
1802:
1798:
1790:
1783:
1774:
1765:
1761:
1754:
1723:
1699:
1695:workstations
1684:
1661:
1650:
1608:
1604:
1576:
1565:
1552:
1549:asynchronous
1548:
1542:
1538:clock signal
1529:
1525:
1521:
1520:
1413:Punched tape
1407:Punched card
1373:Time crystal
1241:Hyper CD-ROM
1180:Optical disc
1072:Tape library
1007:FeFET memory
988:Early-stage
868:CompactFlash
863:Memory Stick
823:Flash memory
785:Diode matrix
769:Non-volatile
606:
553:Kryder's law
543:Amdahl's law
468:Software rot
443:Logical disk
343:File copying
278:Data storage
233:File sharing
218:Data cluster
34:data storage
8050:Synchronous
5995:(5): 1118.
5797:K4ZAF325BM
5775:20 nm
5701:20 nm
5583:K4W1G1646G
5429:77 mm
5407:K4D553238F
5280:KM4132G112
5204:μPD4811650
5158:58 mm
5096:SDRAM type
5047:10 nm
4979:20 nm
4943:20 nm
4833:40 nm
4824:16384 Mbit
4741:50 nm
4732:16384 Mbit
4705:50 nm
4633:60 nm
4597:80 nm
4564:90 nm
4551:Xenos eDRAM
4543:86 mm
4522:EE+GS eDRAM
4501:80 nm
4381:90 nm
4356:86 mm
4335:EE+GS eDRAM
3861:150 nm
3772:MSM5718C50
3727:KM48SL2000
3698:SDRAM type
3604:SDRAM from
3497:PlayStation
3462:bit masking
3458:video cards
3456:, found on
3411:northbridge
3085:CAS latency
2968:. PC100 is
2759:1.25 - 5 ns
2660:Generations
2457:cache lines
1757:CAS latency
1621:released a
1572:interleaved
1553:synchronous
1472:Floppy disk
1424:Drum memory
858:Memory card
825:is used in:
759:(2002–2010)
724:(1946–1947)
548:Moore's law
393:Boot sector
333:Object file
238:File system
49:Memory cell
8319:Categories
7914:18 January
6668:2012-07-17
6608:2011-12-27
6575:2011-12-27
6542:2011-01-01
6518:2020-07-15
6457:2011-03-13
6436:2009-06-17
6410:2009-06-16
6384:2011-01-06
6359:2009-06-16
6334:2011-01-03
6152:2021-04-13
6112:2015-08-02
5892:References
5738:20 nm
5679:March 2016
5622:4096 Mbit
5586:1024 Mbit
5574:40 nm
5564:2048 Mbit
5548:60 nm
5534:1024 Mbit
5403:March 2005
5170:μPD481850
5127:HM5283206
5089:Capacity (
5086:Chip name
5006:8192 Mbit
4934:8192 Mbit
4862:30 nm
4850:2048 Mbit
4798:2048 Mbit
4696:8192 Mbit
4685:April 2008
4624:1024 Mbit
4492:2048 Mbit
4452:1024 Mbit
4149:1024 Mbit
3956:March 1998
3926:MD5764802
3889:1024 Mbit
3856:Mitsubishi
3849:1024 Mbit
3691:Capacity (
3688:Chip name
3624:See also:
3602:3D-stacked
3527:GDDR SDRAM
3517:GDDR SDRAM
3379:ECC memory
3165:DDR5 SDRAM
3107:DDR3 SDRAM
3101:DDR4 SDRAM
3071:DDR3 SDRAM
3049:DDR2 SDRAM
2933:NEC PC-100
2824:sound card
2653:DDR5 SDRAM
2647:DDR4 SDRAM
2641:DDR3 SDRAM
2635:DDR2 SDRAM
2577:data words
2565:Mobile DDR
2472:burst mode
2312:refreshing
1777:active low
1687:registered
1680:DDR3 SDRAM
1629:, chip (64
1578:Pipelining
1395:Historical
1067:Tape drive
893:SmartMedia
716:Historical
413:Disk image
408:Disk array
283:Data store
84:MOS memory
74:Memory map
21:NEC PC-100
8299:Bandwidth
8240:XDR2 DRAM
8063:DDR SDRAM
7963:AnandTech
7828:AnandTech
7797:AnandTech
7426:SlashGear
7308:cite news
7146:"History"
6513:AnandTech
6106:intel.com
5715:June 2016
5492:512 Mbit
5448:256 Mbit
5410:256 Mbit
5363:256 Mbit
5319:128 Mbit
5038:128 Gbit
4588:512 Mbit
4398:512 Mbit
4301:256 Mbit
4227:288 Mbit
4119:128 Mbit
4079:128 Mbit
3996:June 1998
3806:N64 RDRAM
3583:in 1998.
3531:DDR SDRAM
3521:Graphics
3505:SCPH-5000
3474:dual-port
3269:Device ID
3206:DDR SDRAM
3128:DDR4 did
3018:DDR SDRAM
2993:SDR SDRAM
2761:per cycle
2732:per cycle
2629:DDR SDRAM
1657:bandwidth
1627:DDR SDRAM
1532:) is any
1454:Disk pack
1419:Plugboard
1256:DVD-Video
1185:LaserDisc
1083:Videotape
954:3D XPoint
945:Memristor
585:CPU cache
353:Core dump
273:Data bank
223:Directory
8235:XDR DRAM
8153:Graphics
8040:EDO DRAM
8035:FPM DRAM
7934:Wccftech
7766:Archived
7550:Archived
7368:Archived
7191:Archived
7120:Phys.org
7048:Archived
6984:"Memory"
6933:Archived
6842:Archived
6659:archived
6632:archived
6476:TechSpot
5832:See also
5810:Samsung
5800:16 Gbit
5772:Samsung
5766:64 Gbit
5734:Samsung
5726:32 Gbit
5629:SK Hynix
5592:Samsung
5458:Samsung
5416:Samsung
5369:Samsung
5329:Samsung
5289:Samsung
5283:32 Mbit
5241:16 Mbit
5207:16 Mbit
5044:Samsung
5014:Samsung
4976:Samsung
4970:12 Gbit
4940:Samsung
4902:Samsung
4738:Samsung
4702:Samsung
4594:Samsung
4555:80 Mbit
4526:32 Mbit
4498:Samsung
4378:Samsung
4370:72 Mbit
4339:32 Mbit
4269:Samsung
4185:32 Mbit
4181:GS eDRAM
4155:Samsung
4125:Samsung
4085:Samsung
4055:Hyundai
4049:64 Mbit
4015:Samsung
4007:64 Mbit
3963:72 Mbit
3929:64 Mbit
3810:36 Mbit
3775:18 Mbit
3620:Timeline
3614:SK Hynix
2907:, early
2781:Signal:
2765:Signal:
2735:Signal:
2693:Signal:
1932:Command
1887:Commands
1706:SK Hynix
1642:SK Hynix
1383:UltraRAM
1261:DVD card
1216:Video CD
1201:CD Video
971:Nano-RAM
940:Memistor
913:XQD card
888:SIM card
746:Dekatron
632:XDR DRAM
627:EDO DRAM
564:Volatile
358:Hex dump
268:Database
163:Metadata
158:Big data
8268:UniDIMM
8132:HBM-PIM
8098:(FCRAM)
7940:16 July
7891:15 July
7885:Samsung
7865:16 July
7860:Samsung
7834:29 June
7803:16 July
7775:10 July
7733:Samsung
7707:10 July
7681:26 June
7675:Samsung
7646:10 July
7640:Samsung
7614:10 July
7587:10 July
7559:10 July
7521:4 April
7483:Samsung
7463:25 June
7458:Samsung
7432:25 June
7406:25 June
7401:Samsung
7344:25 June
7338:Samsung
7298:25 June
7270:25 June
7264:Samsung
7238:4 April
7233:az5miao
7200:26 June
7161:19 June
7156:Samsung
7127:23 June
7094:23 June
7088:Samsung
7057:21 June
7021:4 April
7016:az5miao
6993:25 June
6942:21 June
6903:19 June
6897:Samsung
6877:4 April
6872:az5miao
6824:23 June
6818:Samsung
6787:21 June
6753:10 July
6744:"PU-18"
6728:10 July
6697:10 July
6691:Hitachi
5997:Bibcode
5803:SGRAM (
5689:SGRAM (
5686:8 Gbit
5537:SGRAM (
5451:SGRAM (
5393:SGRAM (
5322:SGRAM (
5252:Samsung
5244:SGRAM (
5173:8 Mbit
5144:Hitachi
5130:8 Mbit
5103:Process
5050:FinFET
4973:LPDDR4
4937:LPDDR4
4198:Toshiba
3896:Hyundai
3742:Samsung
3705:Process
3653:updated
3606:Samsung
3525:SDRAM (
3485:Hitachi
3320:Column
3145:Samsung
3141:Samsung
3081:latency
3001:SO-DIMM
2963:SO-DIMM
2890:SO-DIMM
2802:≤ 1.2 V
2783:SSTL_15
2769:(1.8V)
2767:SSTL_18
2725:= 2.5 V
2689:= 3.3 V
2584:bitline
2355:When a
1691:servers
1619:Samsung
1601:package
1595:Hyundai
1585:History
1468:(~1970)
1462:(~1968)
1444:(1960s)
1281:Blu-ray
1271:MiniDVD
1266:DVD-RAM
1226:Mini CD
1168:Optical
1128:U-matic
1123:MicroMV
1103:Betamax
967:(ECRAM)
908:MicroP2
883:SD card
873:PC Card
664:1T-SRAM
622:QDRSRAM
213:Storage
43:General
8222:Rambus
8107:RLDRAM
8022:(DRAM)
7739:8 July
7489:8 July
7044:Rambus
6748:PSXDEV
6068:Here,
5969:
5942:
5915:
5819:FinFET
5697:Micron
5691:GDDR5X
5570:Hynix
5544:Hynix
5149:350 nm
5108:MOSFET
5078:(HBM)
5023:FinFET
5010:LPDDR5
4898:LPDDR4
4858:Hynix
4830:Hynix
4804:Hynix
4776:Hynix
4672:Hynix
4668:LPDDR2
4630:Hynix
4558:eDRAM
4529:eDRAM
4458:Hynix
4434:110 nm
4429:Elpida
4404:Hynix
4342:eDRAM
4307:Hynix
4273:100 nm
4233:Hynix
4230:RDRAM
4203:180 nm
4159:140 nm
3970:Rambus
3966:RDRAM
3932:RDRAM
3813:RDRAM
3710:MOSFET
3632:, and
3574:
3567:GDDR6W
3563:GDDR6X
3555:GDDR5X
3481:
3375:caches
3354:CMD5=0
3149:Gbit/s
2909:iBooks
2901:AMD K6
2878:memory
2828:Micron
2785:(1.5V)
2739:(2.5V)
2737:SSTL_2
2678:SDRAM
2461:bursts
2385:active
2331:active
2307:active
2111:column
2085:column
2059:column
2033:column
1720:Timing
1712:, and
1631:
1593:Eight
1474:(1971)
1456:(1962)
1450:(1962)
1438:(1957)
1432:(1949)
1426:(1932)
1415:(1725)
1409:(1725)
1403:(1725)
1276:HD DVD
1236:CD-ROM
1192:(CDDA)
1118:MiniDV
837:(SSHD)
819:(SSS)
805:EEPROM
753:(2009)
742:(1952)
736:(1951)
730:(1947)
348:Backup
8325:SDRAM
8282:Lists
8230:RDRAM
8210:GDDR7
8205:GDDR6
8200:GDDR5
8195:GDDR4
8190:GDDR3
8185:GDDR2
8175:SGRAM
8170:MDRAM
8137:HBM3E
8122:HBM2E
8102:eDRAM
8090:LPDDR
8058:SDRAM
7850:"HBM"
7769:(PDF)
7758:(PDF)
7553:(PDF)
7540:(PDF)
7194:(PDF)
7183:(PDF)
7051:(PDF)
7040:(PDF)
6936:(PDF)
6925:(PDF)
6662:(PDF)
6655:(PDF)
6635:(PDF)
6628:(PDF)
6602:(PDF)
6595:(PDF)
6569:(PDF)
6562:(PDF)
6494:JEDEC
6378:JEDEC
6292:Alphr
6102:(PDF)
6080:, or
5862:GDDR7
5858:GDDR6
5854:GDDR5
5850:GDDR4
5846:GDDR3
5842:GDDR2
5814:10 nm
5805:GDDR6
5778:CMOS
5769:HBM2
5756:2017
5742:CMOS
5704:CMOS
5654:2013
5640:CMOS
5612:2012
5602:CMOS
5580:2010
5554:2009
5539:GDDR5
5524:2007
5510:CMOS
5499:Hynix
5482:2005
5468:CMOS
5453:GDDR4
5426:CMOS
5395:GDDR3
5379:CMOS
5353:2003
5339:CMOS
5324:GDDR2
5309:2002
5299:CMOS
5277:1999
5263:CMOS
5219:CMOS
5201:1997
5191:CMOS
5134:SGRAM
5112:Area
5041:DDR4
5018:10 nm
4996:2018
4982:CMOS
4960:2015
4946:CMOS
4924:2014
4910:CMOS
4906:20 nm
4880:2013
4866:CMOS
4836:CMOS
4827:DDR3
4814:2011
4808:40 nm
4801:DDR3
4784:CMOS
4780:44 nm
4773:DDR3
4756:2009
4744:CMOS
4735:DDR3
4722:2008
4708:CMOS
4699:DDR3
4650:2008
4636:CMOS
4627:DDR2
4614:2006
4600:CMOS
4591:DDR3
4567:CMOS
4540:CMOS
4536:65 nm
4518:2005
4504:CMOS
4495:DDR2
4482:2004
4468:CMOS
4455:DDR2
4438:CMOS
4414:CMOS
4401:DDR2
4384:CMOS
4353:CMOS
4349:90 nm
4331:2003
4317:CMOS
4291:2002
4277:CMOS
4243:CMOS
4217:2001
4207:CMOS
4189:eDRAM
4177:2000
4163:CMOS
4135:CMOS
4109:1999
4095:CMOS
4065:CMOS
4039:1998
4025:CMOS
3981:CMOS
3945:CMOS
3923:1998
3879:1997
3865:CMOS
3828:CMOS
3795:CMOS
3779:RDRAM
3769:1996
3724:1992
3714:Area
3675:SDRAM
3559:GDDR6
3551:GDDR5
3547:GDDR4
3543:GDDR3
3539:GDDR2
3499:(PS)
3402:RDRAM
3275:CMD5
3187:RDRAM
2989:JEDEC
2985:PC133
2980:PC133
2955:JEDEC
2947:PC100
2927:PC100
2882:JEDEC
2840:DIMMs
2836:SDRAM
2695:LVTTL
2670:Type
2481:Intel
2453:cache
2365:write
2350:write
2344:Both
2339:write
2323:write
1664:JEDEC
1640:(now
1567:banks
1557:JEDEC
1543:DRAM
1530:SDRAM
1336:ECRAM
1316:CBRAM
1251:DVD+R
1211:CD-RW
1148:D-VHS
1143:VHS-C
1138:S-VHS
1079:(DDS)
1002:ReRAM
997:FeRAM
990:NVRAM
976:CBRAM
933:NVRAM
831:(SSD)
800:EPROM
757:Z-RAM
751:T-RAM
683:(CAM)
671:ReRAM
637:RDRAM
617:LPDDR
612:SGRAM
607:SDRAM
602:eDRAM
36:types
8273:CAMM
8263:DIMM
8258:SIMM
8180:GDDR
8165:WRAM
8160:VRAM
8127:HBM3
8117:HBM2
8083:DDR5
8078:DDR4
8073:DDR3
8068:DDR2
7942:2019
7916:2018
7893:2019
7867:2019
7836:2019
7805:2019
7777:2019
7741:2019
7709:2019
7683:2019
7648:2019
7616:2019
7610:(48)
7589:2019
7561:2019
7523:2022
7491:2019
7465:2019
7434:2019
7408:2019
7346:2019
7314:link
7300:2019
7272:2019
7240:2022
7202:2019
7187:Sony
7163:2019
7129:2019
7096:2019
7059:2019
7023:2022
6995:2019
6944:2019
6905:2019
6879:2022
6826:2019
6789:2019
6755:2019
6730:2019
6699:2019
5967:ISBN
5940:ISBN
5913:ISBN
5860:and
5838:GDDR
5730:HBM2
5246:GDDR
5213:NEC
5154:CMOS
5091:bits
4854:DDR4
4561:NEC
4374:DDR3
4304:SDR
4265:DDR2
4194:Sony
4152:DDR
4122:DDR
4082:SDR
4052:DDR
3935:Oki
3892:SDR
3852:SDR
3754:CMOS
3732:Mbit
3693:bits
3612:and
3577:Mbit
3565:and
3493:Sony
3470:WRAM
3468:and
3466:VRAM
3452:and
3377:and
3292:Row
3289:Bank
3286:CMD0
3258:CA0
3228:FLAG
3210:MT/s
3159:DDR5
3095:DDR4
3065:DDR3
3043:DDR2
3033:DDR1
2997:DIMM
2959:DIMM
2911:and
2899:and
2886:DIMM
2874:PC66
2869:PC66
2793:DDR4
2775:DDR3
2748:DDR2
2705:DDR1
2619:DDR3
2596:bits
2592:DDR3
2589:Gbit
2357:read
2348:and
2346:read
2335:read
2321:and
2319:read
2305:The
2299:chip
2235:mode
2154:bank
2131:bank
2105:bank
2079:bank
2053:bank
2027:bank
1861:and
1845:and
1829:and
1693:and
1678:and
1676:DDR2
1646:DRAM
1634:Mbit
1599:DIMM
1534:DRAM
1326:NRAM
1298:WORM
1206:CD-R
960:MRAM
795:PROM
790:MROM
692:VRAM
676:QRAM
659:SRAM
647:GDDR
597:DRAM
493:RAID
143:Data
32:and
8112:HBM
7581:NEC
6782:359
6778:NEC
6722:NEC
6146:EDN
6005:doi
5672:HBM
5180:NEC
5138:SDR
5116:Ref
4011:DDR
3908:SOI
3817:NEC
3784:Oki
3737:SDR
3730:16
3718:Ref
3610:AMD
3495:'s
3489:NEC
3398:NEC
3272:ID0
3266:ID8
3255:CA1
3252:CA2
3249:CA3
3246:CA4
3243:CA5
3240:CA6
3237:CA7
3234:CA8
3231:CA9
3130:not
3012:DDR
2921:FSB
2844:ECC
2811:SDR
2553:REF
2533:REF
2411:RCD
2403:RCD
2399:RFC
2381:RAS
2337:or
2327:RCD
2277:ACT
2273:ACT
2232:0 0
2134:row
1923:A10
1908:CAS
1903:RAS
1863:CAS
1859:RAS
1843:RAS
1838:CAS
1827:CAS
1823:not
1818:RAS
1799:DQM
1784:CKE
1672:DDR
1611:IBM
1528:or
1246:DVD
1133:VHS
950:PCM
903:SxS
778:ROM
652:HBM
642:DDR
573:RAM
8321::
7932:.
7883:.
7858:.
7852:.
7825:.
7813:^
7794:.
7760:.
7731:.
7725:.
7699:.
7673:.
7667:.
7656:^
7638:.
7632:.
7606:.
7579:.
7548:.
7542:.
7507:.
7481:.
7456:.
7450:.
7424:.
7399:.
7393:.
7366:.
7362:.
7336:.
7330:.
7310:}}
7306:{{
7288:.
7262:.
7256:.
7231:.
7210:^
7185:.
7171:^
7154:.
7148:.
7137:^
7117:.
7104:^
7086:.
7080:.
7067:^
7042:.
7014:.
7003:^
6986:.
6973:^
6927:.
6913:^
6895:.
6870:.
6853:^
6816:.
6810:.
6797:^
6776:.
6763:^
6746:.
6720:.
6707:^
6689:.
6676:^
6657:,
6630:,
6511:.
6474:.
6308:.
6290:.
6272:.
6199:.
6144:.
6130:^
6104:.
6076:,
6072:,
6047:^
6036:41
6034:.
6028:.
6017:^
6003:.
5993:25
5991:.
5856:,
5852:,
5848:,
5844:,
5807:)
5693:)
5541:)
5455:)
5397:)
5326:)
5248:)
5140:)
5093:)
4196:,
3695:)
3628:,
3608:,
3569:.
3561:,
3557:,
3553:,
3549:,
3545:,
3541:,
3308:0
3303:0
3297:0
3280:0
3263:1
2800:cc
2723:cc
2687:cc
2600:ns
2407:RP
2405:+t
2374:RP
2363:A
1917:BA
1913:WE
1898:CS
1854:WE
1847:WE
1831:WE
1792:CS
1734:10
1716:.
1708:,
1704:,
1697:.
1682:.
1674:,
1659:.
1540:.
1196:CD
1113:DV
8012:e
8005:t
7998:v
7944:.
7918:.
7895:.
7869:.
7838:.
7807:.
7779:.
7743:.
7711:.
7685:.
7650:.
7618:.
7591:.
7563:.
7525:.
7493:.
7467:.
7436:.
7410:.
7348:.
7316:)
7302:.
7274:.
7242:.
7204:.
7165:.
7131:.
7098:.
7061:.
7025:.
6997:.
6946:.
6907:.
6881:.
6828:.
6791:.
6757:.
6732:.
6701:.
6521:.
6478:.
6460:.
6439:.
6413:.
6387:.
6362:.
6337:.
6312:.
6294:.
6247:.
6203:.
6184:.
6169:.
6155:.
6115:.
6082:T
6078:G
6074:M
6070:K
6011:.
6007::
5999::
5975:.
5948:.
5921:.
5783:?
5761:?
5747:?
5721:?
5666:?
5659:?
5645:?
5635:?
5617:?
5597:?
5559:?
5529:?
5515:?
5505:?
5487:?
5473:?
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5421:?
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5055:?
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3790:?
3760:?
3748:?
3665:)
3661:(
3317:0
3314:0
3311:0
3134:n
3119:V
2935:.
2798:V
2721:V
2685:V
2551:t
2397:t
2229:L
2226:L
2223:L
2220:L
2212:x
2209:x
2206:x
2203:H
2200:L
2197:L
2194:L
2186:x
2183:H
2180:x
2177:L
2174:H
2171:L
2168:L
2160:x
2157:L
2151:L
2148:H
2145:L
2142:L
2128:H
2125:H
2122:L
2119:L
2108:H
2102:L
2099:L
2096:H
2093:L
2082:L
2076:L
2073:L
2070:H
2067:L
2056:H
2050:H
2047:L
2044:H
2041:L
2030:L
2024:H
2021:L
2018:H
2015:L
2007:x
2004:x
2001:x
1998:L
1995:H
1992:H
1989:L
1981:x
1978:x
1975:x
1972:H
1969:H
1966:H
1963:L
1955:x
1952:x
1949:x
1946:x
1943:x
1940:x
1937:H
1928:n
1926:A
1919:n
1803:Q
1738:6
1524:(
1502:e
1495:t
1488:v
956:)
952:(
23:.
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