75:
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43:
bonded to the other side of the metal sheet inside the package. This allows for an efficient heat transfer from the transistor die to an external heat sink but also implies that the metal sheet is electrically connected to the die (for a
60:
TO-126 descriptor is derived from the original full name for the package: Transistor
Outline Package, Case Style 126. In the updated JEDEC outline system, the package is numbered as TO-225AA.
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It is relatively common to find packages that contain other components than their designated ones, such as diodes or
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35:. The package is rectangular with a hole in the middle to allow for easy mounting to a board or a
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39:. On one side of the package typically a metal sheet is exposed, with the transistor
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471:[GOST R 57439—2017 Semiconductor devices - basic dimensions]
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446:[GOST 18472—88 Semiconductor devices - basic dimensions]
469:"ГОСТ Р 57439—2017 ПРИБОРЫ ПОЛУПРОВОДНИКОВЫЕ - Основные размеры"
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397:[Outline drawings for semiconductor devices; Type H]
395:"TGL 26713/09: Gehäuse für Halbleiterbauelemente - Bauform H"
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16:
444:"ГОСТ 18472—88 ПРИБОРЫ ПОЛУПРОВОДНИКОВЫЕ - Основные размеры"
401:(in German). Leipzig: Verlag für Standardisierung. June 1988
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48:
usually the collector is connected to this metal sheet).
341:
MJE340 MJE350 Complementary silicon power transistors
20:
Front and back of a transistor in a TO-126 package.
1014:
475:(in Russian). Gosstandart. 2017. p. 70-71
997:
518:
237:, a plastic package with higher power ratings
231:, a metal package with similar power ratings
450:(in Russian). Rosstandart. 1988. p. 56
420:"NPN Silicon Transistors BD135 BD137 BD139"
1004:
990:
920:List of integrated circuit packaging types
532:
525:
511:
389:
387:
385:
302:
282:
257:BD135; BD137; BD139; NPN power transistors
278:
276:
73:
66:refers to this package style as SOT-32.
15:
577:(SOD-123 / SOD-323 / SOD-523 / SOD-923)
382:
1015:
972:This electronics-related article is a
506:
273:
69:
51:
31:for devices with three pins, such as
960:
310:"JEDEC TO-126 package specification"
13:
14:
1039:
490:
964:
461:
180:Kombinat Mikroelektronik Erfurt
559:(DO-7 / DO-26 / DO-35 / DO-41)
436:
412:
351:
332:
263:, Philips Semiconductors, 1999
248:
203:
82:packages, from left to right:
1:
241:
976:. You can help Knowledge by
949:in transistor packages, etc.
915:Integrated circuit packaging
7:
222:
46:bipolar junction transistor
10:
1044:
959:
321:. May 1968. Archived from
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930:Surface-mount technology
935:Through-hole technology
364:. JEDEC. Archived from
106:Designation for TO-126
100:Standards organization
1023:Semiconductor packages
565:(MELF / SOD-80 / LL34)
534:Semiconductor packages
94:
21:
925:Printed circuit board
77:
29:semiconductor package
19:
910:Electronic packaging
347:, STMicroelectronics
283:Bill Roehr (2001),
78:Size comparison of
947:voltage regulators
292:, On Semiconductor
95:
70:National Standards
64:STMicroelectronics
52:History and origin
22:
1028:Electronics stubs
985:
984:
954:
953:
703:(Super-247) (SMT)
697:(Super-220) (SMT)
571:(SMA / SMB / SMC)
328:on June 18, 2017.
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903:Related topics
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769:TSSOP / HTSSOP
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497:TO-126 Package
492:
491:External links
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80:BJT transistor
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691:(D3PAK) (SMT)
690:
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685:(D2PAK) (SMT)
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679:(I2PAK) (SMT)
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371:on 2016-04-10
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192:TGL 26713/09
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174:R 57439—2017
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34:
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27:is a type of
26:
18:
978:expanding it
971:
956:
894:WL-CSP / WLP
764:TSOP / HTSOP
673:(DPAK) (SMT)
667:(IPAK) (SMT)
661:(TH / Panel)
655:(TH / Panel)
649:(TH / Panel)
643:(TH / Panel)
640:
631:(TH / Panel)
601:(TH / Panel)
499:, EESemi.com
477:. Retrieved
463:
452:. Retrieved
438:
427:. Retrieved
414:
403:. Retrieved
373:. Retrieved
366:the original
353:
340:
334:
323:the original
316:
304:
294:, retrieved
285:
265:, retrieved
256:
250:
205:
62:
55:
24:
23:
812:QUIP / QUIL
167:Rosstandart
151:Gosstandart
33:transistors
1017:Categories
820:Grid array
759:SOP / SSOP
711:Single row
594:SOT / TSOT
479:2021-06-17
454:2021-06-17
429:2021-08-20
405:2021-06-15
375:2021-06-21
296:2014-01-25
267:2013-12-09
242:References
184:TGL 11811
142:DIN 41869
129:IEC 60191
90:, TO-126,
874:Flip Chip
793:QIP / QIL
754:SO / SOIC
744:Flat Pack
739:DIP / DIL
718:SIP / SIL
586:3...5-pin
425:. Siemens
158:18472—88
119:TO-225AA
103:Standard
37:heat sink
783:Quad row
727:Dual row
359:"TO-225"
223:See also
553:(DO-27)
541:Single
210:Russian
701:TO-274
695:TO-273
689:TO-268
683:TO-263
677:TO-262
671:TO-252
665:TO-251
659:TO-247
653:TO-220
647:TO-202
641:TO-126
569:DO-214
563:DO-213
557:DO-204
551:DO-201
235:TO-220
161:KT-27
116:JEP95
84:SOT-23
25:TO-126
852:Wafer
635:TO-92
629:TO-66
623:TO-39
617:TO-18
543:diode
473:(PDF)
448:(PDF)
423:(PDF)
399:(PDF)
369:(PDF)
362:(PDF)
345:(PDF)
326:(PDF)
318:JEDEC
313:(PDF)
290:(PDF)
261:(PDF)
229:TO-66
214:КТ-27
145:12A3
112:JEDEC
88:TO-92
58:JEDEC
974:stub
889:UICC
832:eWLB
798:PLCC
749:MSOP
637:(TH)
625:(TH)
619:(TH)
613:(TH)
611:TO-8
607:(TH)
605:TO-5
599:TO-3
195:H1B
172:GOST
156:GOST
132:A56
92:TO-3
56:The
879:PoP
869:CSP
865:COG
862:COF
859:COB
842:PGA
837:LGA
827:BGA
808:QFP
803:QFN
789:LCC
774:ZIP
734:DFN
575:SOD
138:DIN
125:IEC
41:die
1019::
884:QP
384:^
315:.
275:^
212::
187:N
86:,
1005:e
998:t
991:v
980:.
526:e
519:t
512:v
482:.
457:.
432:.
408:.
378:.
Text is available under the Creative Commons Attribution-ShareAlike License. Additional terms may apply.
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