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Gold removal is performed to reduce the risk of failure associated with embrittled solder. Gold embrittlement is not a visually inspectable anomaly. In cases where analysis has determined there is a gold embrittlement condition, the gold embrittlement shall be considered a defect, see IPC-HDBK-001 or
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From at least 95% of the surfaces to be soldered of the through-hole component leads with 2.54 ÎĽm or more of gold thickness. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. From the surfaces to be soldered of solder terminals plated with 2.54
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Electroless Nickel Gold is what's typically used for surfacing bare PCB's - it's used to keep the pads from oxidizing. In fact, the gold dissolves into the solder. This is where the ENIG plating thickness is critical - anything over 50-100 microinches can lead to embrittlement - non-metallic
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2.54 ÎĽm gold thickness and all through-hole leads that will be hand soldered regardless of gold thickness. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. From the surfaces to be soldered of solder terminals plated with :
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Note: Gold embrittled solder connections can occur regardless of gold thickness when solder volume is low or the soldering process dwell time is not sufficient to allow the gold to dissolve throughout the entire solder joint.
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A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly.
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A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly.
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This is way too wordy. I really don't care about formulas or curcuit boards. I'm not a scientist. I don't like scientists.
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formations that compromise the solder connection. The IPC section in J-STD-001: 4.5.1 Gold
Removal
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Knowledge. If you would like to participate, please visit the project page, where you can join
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From at least 95% of the surfaces to be soldered of the through-hole component leads with : -->
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2.54 ÎĽm gold thickness and from all solder cup terminals, regardless of gold thickness.
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in the banner shell. Please resolve this conflict if possible.
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