275:
246:
409:
264:
185:
43:
84:
813:
138:
583:
477:
processes. There are many factors to consider in selection of either electrolytic or electroless plating methods. These include what the deposit will be used for, configuration of the part, materials compatibility and cost of processing. In different applications, electrolytic or electroless plating
391:
layer is used to counter this effect; these can be nickel or rhodium. Copper, which also migrates into gold, does so more slowly than silver. The copper is usually further plated with nickel. A gold-plated silver article is usually a silver substrate with layers of copper, nickel, and gold deposited
485:
may cause higher losses due to higher electrical resistance of nickel; a nickel-plated trace can have its useful length shortened three times in the 1 GHz band in comparison with the non-plated one. Selective plating is used, depositing the nickel and gold layers only on areas where it is
647:
If the gold layer does not completely dissolve into the solder, then slow intermetallic reactions can proceed in the solid state as the tin and gold atoms cross-migrate. Intermetallics have poor electrical conductivity and low strength. The ongoing intermetallic reactions also cause
369:. The thickness of gold plating on jewellery is noted in microns (or micro-meters). The microns of thickness determines how long the gold plating lasts with usage. The jewellery industry denotes different qualities of gold plating in the following terminology
400:
Gold, applied by evaporated methods or electroplating, has been specified by NASA to thermally control spacecraft instruments, due to its 99.4% reflectivity in infrared wavelengths.
667:) also dissolve completely into the solder, exposing the underlying metal (usually nickel) to the solder. Impurities in the nickel layer can prevent the solder from bonding to it.
496:
Wire bonding between gold plated contacts and aluminium wires or between aluminium contacts and gold wires under certain conditions develops a brittle layer of
383:
Gold plated silver jewellery can still tarnish as the silver atoms diffuse into the gold layer, causing slow gradual fading of its color and eventually causing
159:
462:, is often deposited on the copper substrate before the gold plating. The layer of nickel provides mechanical backing for the gold layer, improving its
753:
146:
793:
616:
63% tin – 37% lead solder is used, no lead-gold compounds are formed, because gold preferentially reacts with tin, forming the
328:
is the decorative covering of an object with gold, which typically involve more traditional methods and much larger objects.
779:
833:
232:
119:
70:
94:
683:
layer before applying the gold layer; improper cleaning leads to a nickel surface difficult to solder. A stronger
644:
planes, significantly lowering the mechanical strength and therefore reliability of the resulting solder joints.
817:
387:
of the surface. This process may take months and even years, depending on the thickness of the gold layer. A
56:
31:
569:
is deposited using lower concentration of gold in the baths. Usually contains nickel and/or cobalt as well.
559:; these elements interfere with die bonding, therefore the plating baths cannot be used for semiconductors.
497:
652:, leading to mechanical failure of the joint, similar to the degradation of gold-aluminium bonds known as
274:
17:
668:
283:
551:, with Knoop hardness between 120–300 and purity of 99.7–99.9% gold. Often contains a small amount of
245:
597:. Solder which contains more than 4–5% gold can become brittle. The joint surface is dull-looking.
203:
680:
151:
848:
520:
706:
564:
542:
429:
254:
545:
can be plated. This technology can be used for depositing layers suitable for wire bonding.
490:
470:
425:
321:
749:
8:
791:
528:
474:
199:
843:
641:
379:
Heavy gold plated / Vermeil - gold layer thickness greater than or equal to 2.5 micron
101:
838:
684:
649:
207:
62:
408:
700:
676:
659:
A 2–3 μm layer of gold dissolves completely within one second during typical
531:
ranges between 60 and 85. The plating baths have to be kept free of contamination.
797:
353:
Non-cyanide, generally sulphite or chloride-based for gold and gold alloy plating
268:
250:
775:
725:
672:
660:
613:
609:
570:
313:
827:
664:
653:
501:
455:
388:
671:
contains phosphorus. Nickel with more than 8% phosphorus is not solderable.
573:
are often made by controlled-depth immersion of only the edge of the boards.
524:
466:
resistance. It also reduces the impact of pores present in the gold layer.
287:
279:
512:
There are several types of gold plating used in the electronics industry:
538:
482:
309:
384:
376:
Gold plated - gold layer thickness greater than or equal to 0.5 micron
373:
Gold flashed / Gold washed - gold layer thickness less than 0.5 micron
590:
417:
366:
282:—one of five known examples to have been plated—on display at the
263:
448:
440:
341:
325:
317:
137:
812:
688:
594:
556:
552:
459:
421:
320:
refers to modern coating methods, such as the ones used in the
305:
301:
444:
350:
Acid gold plating for bright hard gold and gold alloy plating
336:
There are five recognized classes of gold plating chemistry:
93:
may be in need of reorganization to comply with
Knowledge's
605:
593:
gold-plated parts can be problematic as gold is soluble in
463:
436:
297:
691:
is another nickel contaminant that hinders solderability.
663:
conditions. Layers of gold thinner than 0.5 μm (0.02
486:
required and does not cause the detrimental side effects.
703:- inventor who was first to do gold plating as a business
601:
582:
416:
Gold plating is often used in electronics, to provide a
365:
Gold plating of silver is used in the manufacture of
687:
can help, as it aids dissolving the oxide deposits.
640:
disperse in the solder matrix, forming preferential
194:may lack focus or may be about more than one topic
469:Both the nickel and gold layers can be plated by
825:
439:tend to diffuse through the gold layer, causing
435:With direct gold-on-copper plating, the copper
300:onto the surface of another metal, most often
198:Please help improve this article, possibly by
104:to make improvements to the overall structure.
347:Neutral gold cyanide, for high-purity plating
420:-resistant electrically conductive layer on
489:Gold plating may lead to formation of gold
71:Learn how and when to remove these messages
27:Coating an object with a thin layer of gold
296:is a method of depositing a thin layer of
679:. An acid bath is required to remove the
331:
233:Learn how and when to remove this message
120:Learn how and when to remove this message
773:
581:
523:. The gold layer is easily soldered and
407:
273:
262:
253:space craft that protects a gold-plated
244:
162:of all important aspects of the article.
750:"Nickel-gold plating copper PCB traces"
608:in their liquid state, forming brittle
14:
826:
158:Please consider expanding the lead to
395:
312:), by a chemical or electrochemical (
202:the article and/or by introducing a
178:
131:
77:
36:
577:
443:of its surface and formation of an
24:
25:
860:
805:
767:
586:Gold-plated printed circuit board
412:Gold-plated electrical connectors
344:, for gold and gold alloy plating
52:This article has multiple issues.
811:
183:
136:
82:
41:
782:from the original on 2017-04-11
778:. Products Finishing Magazine.
756:from the original on 2022-12-07
249:Gold-plated aluminium cover on
206:, or discuss this issue on the
150:may be too short to adequately
60:or discuss these issues on the
742:
718:
403:
160:provide an accessible overview
13:
1:
726:"Gold Coating | NASA Spinoff"
712:
498:gold-aluminium intermetallics
32:Gold plating (disambiguation)
774:Weisberg, Alfred M. (1997).
549:Bright hard gold on contacts
360:
7:
752:. Polar Instruments. 2003.
694:
481:At higher frequencies, the
10:
865:
669:Electroless nickel plating
537:is deposited from special
478:can have cost advantages.
284:National Automobile Museum
29:
834:Electronics manufacturing
507:
628:compound. Particles of
517:Soft, pure gold plating
600:Gold reacts with both
587:
543:printed circuit boards
521:semiconductor industry
454:A layer of a suitable
430:printed circuit boards
413:
332:Gold plating chemistry
290:
271:
267:A gold plated desktop
260:
707:Gold-filled jewellery
585:
565:printed circuit board
426:electrical connectors
411:
277:
266:
248:
820:at Wikimedia Commons
563:Bright hard gold on
322:electronics industry
30:For other uses, see
675:nickel may contain
204:disambiguation page
102:editing the article
796:2022-11-30 at the
588:
414:
396:Space applications
291:
272:
261:
816:Media related to
650:Kirkendall effect
243:
242:
235:
225:
224:
177:
176:
130:
129:
122:
95:layout guidelines
75:
16:(Redirected from
856:
815:
800:
790:
788:
787:
771:
765:
764:
762:
761:
746:
740:
739:
737:
736:
730:spinoff.nasa.gov
722:
701:Daniel Davis Jr.
677:nickel hydroxide
673:Electrodeposited
639:
638:
637:
627:
626:
625:
578:Soldering issues
238:
231:
220:
217:
211:
187:
186:
179:
172:
169:
163:
140:
132:
125:
118:
114:
111:
105:
86:
85:
78:
67:
45:
44:
37:
21:
864:
863:
859:
858:
857:
855:
854:
853:
824:
823:
808:
803:
798:Wayback Machine
785:
783:
772:
768:
759:
757:
748:
747:
743:
734:
732:
724:
723:
719:
715:
697:
636:
633:
632:
631:
629:
624:
621:
620:
619:
617:
580:
571:Edge connectors
535:Soft, pure gold
519:is used in the
510:
424:, typically in
406:
398:
363:
334:
269:Stirling engine
256:Sounds of Earth
239:
228:
227:
226:
221:
215:
212:
197:
188:
184:
173:
167:
164:
157:
145:This article's
141:
126:
115:
109:
106:
100:Please help by
99:
87:
83:
46:
42:
35:
28:
23:
22:
15:
12:
11:
5:
862:
852:
851:
846:
841:
836:
822:
821:
807:
806:External links
804:
802:
801:
776:"Gold Plating"
766:
741:
716:
714:
711:
710:
709:
704:
696:
693:
661:wave soldering
634:
622:
610:intermetallics
579:
576:
575:
574:
560:
546:
532:
529:Knoop hardness
509:
506:
405:
402:
397:
394:
392:on top of it.
381:
380:
377:
374:
362:
359:
358:
357:
354:
351:
348:
345:
340:Alkaline gold
333:
330:
314:electroplating
278:A gold plated
241:
240:
223:
222:
191:
189:
182:
175:
174:
154:the key points
144:
142:
135:
128:
127:
90:
88:
81:
76:
50:
49:
47:
40:
26:
9:
6:
4:
3:
2:
861:
850:
849:Metal plating
847:
845:
842:
840:
837:
835:
832:
831:
829:
819:
814:
810:
809:
799:
795:
792:
781:
777:
770:
755:
751:
745:
731:
727:
721:
717:
708:
705:
702:
699:
698:
692:
690:
686:
682:
678:
674:
670:
666:
662:
657:
655:
654:purple plague
651:
645:
643:
615:
611:
607:
603:
598:
596:
592:
584:
572:
568:
566:
561:
558:
554:
550:
547:
544:
540:
536:
533:
530:
526:
522:
518:
515:
514:
513:
505:
503:
502:purple plague
499:
494:
492:
487:
484:
479:
476:
472:
467:
465:
461:
457:
456:barrier metal
452:
450:
446:
442:
438:
433:
431:
427:
423:
419:
410:
401:
393:
390:
389:barrier metal
386:
378:
375:
372:
371:
370:
368:
356:Miscellaneous
355:
352:
349:
346:
343:
339:
338:
337:
329:
327:
323:
319:
315:
311:
307:
303:
299:
295:
289:
285:
281:
276:
270:
265:
259:
257:
252:
247:
237:
234:
219:
209:
205:
201:
195:
192:This article
190:
181:
180:
171:
161:
155:
153:
148:
143:
139:
134:
133:
124:
121:
113:
103:
97:
96:
91:This article
89:
80:
79:
74:
72:
65:
64:
59:
58:
53:
48:
39:
38:
33:
19:
818:Gold plating
784:. Retrieved
769:
758:. Retrieved
744:
733:. Retrieved
729:
720:
658:
646:
599:
589:
562:
548:
539:electrolytes
534:
516:
511:
495:
488:
480:
471:electrolytic
468:
453:
434:
415:
399:
382:
364:
335:
294:Gold plating
293:
292:
288:Reno, Nevada
280:DMC DeLorean
255:
229:
216:January 2024
213:
193:
168:January 2024
165:
149:
147:lead section
116:
110:January 2024
107:
92:
68:
61:
55:
54:Please help
51:
681:passivation
525:wire bonded
500:, known as
483:skin effect
475:electroless
404:Electronics
316:) process.
310:silver-gilt
18:Gold plated
828:Categories
786:2013-04-03
760:2007-03-28
735:2024-04-22
713:References
458:, usually
441:tarnishing
385:tarnishing
324:, whereas
57:improve it
844:Jewellery
591:Soldering
541:. Entire
418:corrosion
367:jewellery
361:Jewellery
308:(to make
208:talk page
200:splitting
152:summarize
63:talk page
839:Coatings
794:Archived
780:Archived
754:Archived
695:See also
642:cleavage
614:eutectic
491:whiskers
449:sulphide
612:. When
555:and/or
451:layer.
447:and/or
342:cyanide
326:gilding
318:Plating
251:Voyager
689:Carbon
595:solder
557:cobalt
553:nickel
527:. Its
460:nickel
422:copper
306:silver
302:copper
258:record
508:Types
445:oxide
437:atoms
685:flux
665:thou
630:AuSn
618:AuSn
606:lead
604:and
567:tabs
464:wear
428:and
298:gold
602:tin
473:or
304:or
286:in
830::
728:.
656:.
504:.
493:.
432:.
66:.
789:.
763:.
738:.
635:4
623:4
236:)
230:(
218:)
214:(
210:.
196:.
170:)
166:(
156:.
123:)
117:(
112:)
108:(
98:.
73:)
69:(
34:.
20:)
Text is available under the Creative Commons Attribution-ShareAlike License. Additional terms may apply.