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to create a complex component such as a computer processor. Each chiplet in a computer processor provides only a portion of the processor's functionality. A set of chiplets can be implemented in a mix-and-match
93:, bunch of wires (BoW), AIB, OpenHBI, and OIF XSR. Chiplets not designed by the same company must be designed with interoperability in mind, a daunting task.
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380:"RAMP: Research accelerator for multiple processors - a community vision for a shared experimental parallel HW/SW platform"
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as a component of the RAMP Project (research accelerator for multiple processors) in 2006 extension for the
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Known good die: chiplets can be tested before assembly, improving the yield of the final device.
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Heterogeneous integration: chiplets can be fabricated with different processes, materials, and
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Reusable IP (intellectual property): the same chiplet can be used in many different devices
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Multiple chiplets working together in a single integrated circuit may be called a
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456:"U.S. Focuses on Invigorating 'Chiplets' to Stay Cutting-Edge in Tech"
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44:-like" assembly. This provides several advantages over a traditional
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242:"Common Heterogeneous Integration and IP Reuse Strategies (CHIPS)"
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268:"Heterogeneous Integration and the Evolution of IC Packaging"
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52:) which is monolithic as it comprises a single silicon die:
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Bertin, Claude L.; Su, Lo-Soun; Van Horn, Jody (2001).
417:"Accelerating Science Driven System Design With RAMP"
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Tiny integrated circuit with a well-defined function
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365:"UCIe Goes Back to the Drawing Board"
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300:. SpringerLink. pp. 149–200.
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98:University of California, Berkeley
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337:"Waiting for Chiplet Standards"
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351:"Is UCIe Really Universal?"
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217:" Retrieved 5 December 2022
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454:Clark, Don (11 May 2023).
230:Retrieved 5 December 2022
228:Chiplets: A Short History
111:Common examples include:
163:Brookes (25 July 2021).
266:Kenyon (6 April 2021).
226:Don Scansen, EE Times "
96:The term was coined by
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128:and later architecture
484:Semiconductor devices
165:"What Is a Chiplet?"
106:Department of Energy
479:Integrated circuits
367:. 22 February 2024.
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213:Semi Engineering "
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35:in a single
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277:28 December
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199:28 December
174:28 December
169:How-To Geek
132:NVidia H100
117:Meteor Lake
473:Categories
150:References
100:professor
33:interposer
23:is a tiny
321:7 October
190:"Chiplet"
124:based on
122:AMD Ryzen
76:hybrid IC
240:Keeler.
215:Chiplets
194:WikiChip
138:See also
82:, or an
437:1186854
80:2.5D IC
37:package
21:chiplet
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115:Intel
246:DARPA
126:Zen 2
61:nodes
433:OSTI
396:ISBN
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