22:
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The definitions of kilo, giga, and mega based on powers of two are included only to reflect common usage. IEEE/ASTM SI 10-1997 states "This practice frequently leads to confusion and is deprecated." Further confusion results from the popular use of the megabyte representing 1 024 000 bytes to define
279:
The documentation of modern memory modules, such as the standards for the memory ICs and a reference design of the module requires over one hundred pages. The standards specify the physical and electrical characteristics of the modules, and include the data for computer simulations of the memory
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is maintained by JEDEC committee JC41. This committee consists of members from manufacturers of microprocessors, memory ICs, memory modules, and other components, as well as component integrators, such as video card and personal computer makers. Standard 21 is published in loose-leaf binder
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JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper
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Memory modules of the DDR2-SDRAM type are available for laptop, desktop, and server computers in a wide selection of capacities and access speeds. The standards specify memory module label formats for end-user markets. For example:
217:, for an alternate system of prefixes and includes a table of the IEC prefixes in the note. However the JEDEC specification does not explicitly include the IEC prefixes in the list of general terms and definitions.
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JEDEC Standard 100B.01 specifies common terms, units, and other definitions in use in the semiconductor industry. JESC21-C specifies semiconductor memories from the 256 bit static
261:
The purpose of this
Standard is to define the minimum set of requirements for JEDEC compliant 512 Mb through 8 Gb for x4, x8, and x16 DDR3 SDRAM devices.
100:. The purpose of the standard is to promote the uniform use of symbols, abbreviations, terms, and definitions throughout the semiconductor industry.
433:
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The specification cites three prefixes as follows, with the note that these prefixes are included in the document only to reflect common usage.
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is a 1 GB DDR2 Registered DIMM, with address/command parity function, using 2 ranks of x4 SDRAMs operational to PC2-3200 performance with
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kibi (Ki), mebi (Mi), gibi (Gi), and tebi (Ti) as powers of 2, and kilo, mega, giga, and tera as powers of 10. For example,
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product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.
295:= 3, tRCD = 3, tRP = 3, using JEDEC SPD revision 1.1, raw card reference design file D revision 2 used for the assembly.
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the capacity of the 1.44-MB high-density diskette. An alternative system is found in
Amendment 2 to IEC 60027-2:
123:(B) is a binary character string typically operated upon as one unit. It is usually shorter than a computer word.
116:(b) is the smallest unit of information in the binary numeration system and is represented by the digits 0 and 1.
63:(JEDEC) Solid State Technology Association, a semiconductor trade and engineering standardization organization.
625:
369:"Terms, Definitions, and Letter Symbols for Microcomputers, Microprocessors, and Memory Integrated Circuits"
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Terms, Definitions, and Letter
Symbols for Microcomputers, Microprocessors, and Memory Integrated Circuits
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are the specifications for semiconductor memory circuits and similar storage devices promulgated by the
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The Joint
Electron Device Engineering Council characterizes its standardization efforts as follows:
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144:"as a prefix to units of semiconductor storage capacity" to designate multiples of the units.
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The JEDEC DDR3 SDRAM standard JESD-79-3f uses Mb and Gb to specify binary memory capacity: "
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434:"JEDEC dictionary entry: giga (G) (as a prefix to units of semiconductor storage capacity)"
420:"JEDEC dictionary entry: mega (M) (as a prefix to units of semiconductor storage capacity)"
406:"JEDEC dictionary entry: kilo (K) (as a prefix to units of semiconductor storage capacity)"
221:
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8:
35:
Please help update this article to reflect recent events or newly available information.
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The document notes that these prefixes are used in their decimal sense for
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The specification contains citations of the commonly used prefixes
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Letter symbols to be used in electrical technology – Part 2
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The JEDEC terms dictionary further includes definitions for the
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It refers to the IEEE/ASTM SI 10-1997 standard as stating that "
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The specification defines the two common units of information:
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Preliminary publication of JEDEC Semiconductor Memory
Standard
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209:". The document further refers to the description of the IEC
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this practice frequently leads to confusion and is deprecated
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JEDEC Solid State
Technology Association (December 2002).
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The
December 2002 JEDEC Standard 100B.01 is entitled
215:"Letter symbols to be used in electrical technology"
273:JESD21-C: Configurations for Solid State Memories
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128:Unit prefixes for semiconductor storage capacity
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482:Double Data Rate (DDR) SDRAM Specification
334:Quote from JEDEC Standard 100B.01, page 8:
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61:Joint Electron Device Engineering Council
276:format to accommodate frequent updates.
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459:"DDR3 SDRAM STANDARD | JESD79-3F"
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52:Electronics industry recommendations
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239:2 tebi Ti tera + binary: (2) =
213:in Amendment 2 of IEC 60027-2,
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280:module operating in a system.
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289:1GB 2Rx4 PC2-3200P-333-11-D2
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316:Timeline of binary prefixes
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78:JEDEC standardization goals
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201:(2 or K, where K = 1024).
188:): A multiplier equal to
178:(2 or K, where K = 1024).
168:): A multiplier equal to
29:This article needs to be
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224:data rates measured in
606:Online JEDEC documents
447:JEDEC dictionary entry
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92:JEDEC Standard 100B.01
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57:JEDEC memory standards
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626:Units of information
222:serial communication
104:Units of information
540:Bit Wide TTL SRAM
461:. JEDEC. Jul 2012
395:Ref. ANSI X3.172.
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380:. Retrieved
376:JESD 100B.01
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41:January 2013
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378:. p. 8
293:CAS Latency
620:Categories
590:2013-08-08
557:2013-08-08
524:2009-04-05
499:2013-08-08
465:2022-08-21
382:2009-04-05
352:References
255:tera: (10)
72:DDR4 SDRAM
306:IEC 60027
74:modules.
300:See also
267:JESD21-C
611:JESD218
570:JEDEC,
537:JEDEC,
479:JEDEC,
31:updated
140:, and
584:(PDF)
577:(PDF)
551:(PDF)
544:(PDF)
519:(PDF)
493:(PDF)
486:(PDF)
372:(PDF)
322:Notes
226:bits
182:giga
162:mega
152:kilo
142:giga
138:mega
134:kilo
121:byte
119:The
112:The
55:The
252:776
249:627
246:511
243:099
198:824
195:741
192:073
175:576
172:048
114:bit
70:to
68:RAM
622::
374:.
359:^
263:"
228:.
136:,
468:.
436:.
422:.
408:.
385:.
342:.
241:1
190:1
186:G
184:(
170:1
166:M
164:(
156:K
154:(
43:)
39:(
33:.
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