20:
711:
28:
643:
742:
159:
The SOIC package is shorter and narrower than DIP, the side-to-side pitch being 6 mm for an SOIC-14 (from lead tip to lead tip), and the body width being 3.9 mm. These dimensions differ depending on the SOIC in question, and there are several variants. This package has "gull wing" leads
701:
Applications for a SSOP enable end-products (pagers, portable audio/video, disc drives, radio, RF devices/components, telecom) to be reduced in size and mass. Semiconductor families such as operational amplifiers, drivers, optoelectronics, controllers, logic, analog, memory, comparators and more
816:
over a standard TSSOP, thereby expanding the margin of operating parameters. Additionally, the exposed pad can be connected to ground, thereby reducing loop inductance for high-frequency applications. The exposed pad should be soldered directly to the PCB to realize the thermal and electrical
697:
The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP. This yields an IC package with a significant reduction in the size compared to standard package. All IC assembly processes remain the same as with standard SOPs.
139:
whether they are referring to the JEDEC or JEITA/EIAJ standards. The wider JEITA/EIAJ packages are more common with higher pin count ICs, but there is no guarantee that an SOIC package with any number of pins will be either one or the other.
172:
722:(TSOP) is a rectangular, thin-bodied component. A Type I TSOP has legs protruding from the width portion of the package. A Type II TSOP has the legs protruding from the length portion of the package. The ICs on
626:
Another SOIC variant, available only for 8-pin and 10-pin ICs, is the mini-SOIC, also called micro-SOIC. This case is much smaller, with a pitch of only 0.5 mm. See the table for the 10-pin model.
168:
The picture below shows the general shape of a SOIC narrow package, with major dimensions. The values of these dimensions (in millimetres) for common SOICs is shown in the table.
135:
Note that because of this, SOIC is not specific enough of a term to describe parts which are interchangeable. Many electronic retailers will list parts in either package as
436:
These are sometimes called "wide SOIC", as opposed to the narrower JEDEC MS-012, but they in turn are narrower than the JEDEC MS-013, which may also be called "wide SOIC".
800:, disk drives, recordable optical disks, telephone handsets, speed dialers, video / audio and consumer electronics / appliances are suggested uses for TSSOP packaging.
984:
19:
1379:
1160:
1154:
1148:
1136:
1124:
1118:
1106:
1010:
777:
74:
881:
674:
Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.65
151:
consistently refer to JEDEC 3.9 and 7.5 mm width parts as "SOIC" and to EIAJ Type II 5.3 mm width parts as "SOP".
1291:
977:
1218:
906:
1405:
It is relatively common to find packages that contain other components than their designated ones, such as diodes or
1348:
1228:
855:
750:
1213:
970:
171:
126:
1022:
1374:
956:
1257:
650:
Small-outline J-leaded package (SOJ) is a version of SOIC with J-type leads instead of gull-wing leads.
1262:
1223:
1208:
1193:
834:
719:
702:
using BiCMOS, CMOS or other silicon / GaAs technologies are well addressed by the SSOP product family.
541:
952:
1389:
1053:
51:
1394:
1233:
148:
1426:
1203:
1177:
631:
1384:
1353:
993:
765:
1369:
1252:
1198:
1045:
773:
658:
After SOIC came a family of smaller form factors with pin spacings less than 1.27 mm:
58:
710:
8:
1311:
1034:
129:. (EIAJ Type II is 5.3 mm body width, and slightly thicker and longer than JEDEC MS-012.)
98:
61:(DIP), with a typical thickness being 70% less. They are generally available in the same
32:
1338:
1328:
160:
protruding from the two long sides and a lead spacing of 0.050 in (1.27 mm).
54:
106:
27:
1406:
1267:
144:
88:
actually refers to IC packaging standards from at least two different organizations:
942:
110:
VERY THICK PROFILE, PLASTIC SMALL OUTLINE FAMILY, 1.27 MM PITCH, 7.50 MM BODY WIDTH.
812:(EP) variant of small outline packages can increase heat dissipation by as much as
753:
is a rectangular, thin-body component. A TSSOP's leg count can range from 8 to 64.
1343:
1296:
1286:
793:
761:
730:
947:
937:
1301:
102:
PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE, 3.9 MM BODY WIDTH.
1420:
885:
797:
642:
861:
962:
907:"Package Dimensions: MSOP8/-TP, SSOP20/28, TSSOP16, TSSOP20/-TP, TSSOP24"
630:
An excellent overview of different semiconductor packages is provided by
57:(IC) package which occupies an area about 30–50% less than an equivalent
789:
769:
65:
as their counterpart DIP ICs. The convention for naming the package is
36:
1333:
741:
757:
493:
is the number of pins), there's also the wide (or sometimes called
62:
1142:
1130:
1112:
1100:
1028:
1016:
785:
756:
TSSOPs are particularly suited for gate drivers, controllers,
1094:
1088:
1082:
1076:
1002:
781:
116:
92:
736:
1070:
1064:
1058:
726:
723:
120:
857:
471:
Next to the narrow SOIC package (commonly represented as
953:
Image of a 74HC4067 multiplexer chip in a SSOP package.
637:
669:
532:
are given for an 8-pins wide (extended) SOIC package.
73:
followed by the number of pins. For example, a 14-pin
705:
516:
The difference is mainly related to the parameters W
497:) version. This package is commonly represented as
154:
80:
1418:
77:would be housed in an SOIC-14 or SO-14 package.
729:were usually TSOPs until they were replaced by
694:mm lead spacing is less common, but not rare.
978:
943:Amkor Technology ExposedPad SOIC/SSOP Package
1380:List of integrated circuit packaging types
992:
985:
971:
751:thin-shrink small-outline package (TSSOP)
737:Thin-shrink small-outline package (TSSOP)
665:Thin-shrink small outline package (TSSOP)
740:
709:
641:
26:
18:
1037:(SOD-123 / SOD-323 / SOD-523 / SOD-923)
653:
1419:
123:, which term some vendors still use):
966:
175:A general SOIC, with major dimensions
638:Small-outline J-leaded package (SOJ)
670:Shrink small-outline package (SSOP)
431:
13:
185:Clearance between IC body and PCB
170:
14:
1438:
931:
706:Thin small-outline package (TSOP)
662:Thin small outline package (TSOP)
44:small outline integrated circuit
163:
155:General package characteristics
1019:(DO-7 / DO-26 / DO-35 / DO-41)
959:is shown for a size reference.
948:Amkor Technology SSOP package.
899:
874:
860:, National.com, archived from
848:
827:
803:
81:JEDEC and JEITA/EIAJ standards
1:
938:Amkor Technology SOIC Package
820:
524:. As an example, the values W
127:Semiconductor Device Packages
1409:in transistor packages, etc.
1375:Integrated circuit packaging
535:
16:Surface mount variant of DIP
7:
835:"TI Small Outline Packages"
10:
1443:
720:thin small-outline package
714:Hynix flash memory as TSOP
542:Mini Small Outline Package
539:
1403:
1362:
1310:
1279:
1242:
1186:
1170:
1044:
1000:
1390:Surface-mount technology
1395:Through-hole technology
149:Fairchild Semiconductor
1025:(MELF / SOD-80 / LL34)
994:Semiconductor packages
746:
715:
647:
632:National Semiconductor
176:
39:
24:
1385:Printed circuit board
744:
713:
645:
209:Total carrier length
193:Total carrier height
174:
30:
22:
1370:Electronic packaging
654:Smaller form factors
59:dual in-line package
35:(wide SOIC-28) in a
837:. Texas Instruments
745:ExposedPAD TSSOP-16
261:Lead-to-lead width
33:PIC microcontroller
1407:voltage regulators
882:"IC Package Types"
747:
716:
648:
177:
143:However, at least
55:integrated circuit
40:
25:
1414:
1413:
1163:(Super-247) (SMT)
1157:(Super-220) (SMT)
1031:(SMA / SMB / SMC)
624:
623:
469:
468:
429:
428:
273:
272:
145:Texas Instruments
111:
103:
1434:
987:
980:
973:
964:
963:
925:
924:
922:
920:
911:
903:
897:
896:
894:
893:
884:. Archived from
878:
872:
871:
870:
869:
852:
846:
845:
843:
842:
831:
815:
693:
689:
685:
682:inches) or 0.635
681:
677:
546:
545:
439:
438:
432:SOP (JEITA/EIAJ)
275:
274:
179:
178:
109:
101:
1442:
1441:
1437:
1436:
1435:
1433:
1432:
1431:
1417:
1416:
1415:
1410:
1399:
1358:
1306:
1275:
1238:
1182:
1166:
1040:
996:
991:
934:
929:
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918:
916:
909:
905:
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900:
891:
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875:
867:
865:
854:
853:
849:
840:
838:
833:
832:
828:
823:
813:
806:
794:optoelectronics
739:
731:ball grid array
708:
691:
687:
683:
679:
675:
672:
656:
640:
588:
579:
561:
555:
544:
538:
531:
527:
523:
519:
454:
448:
434:
317:
308:
290:
284:
258:
247:
228:
217:
201:Lead thickness
166:
157:
83:
52:surface-mounted
17:
12:
11:
5:
1440:
1430:
1429:
1412:
1411:
1404:
1401:
1400:
1398:
1397:
1392:
1387:
1382:
1377:
1372:
1366:
1364:
1363:Related topics
1360:
1359:
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1265:
1260:
1255:
1250:
1246:
1244:
1240:
1239:
1237:
1236:
1231:
1229:TSSOP / HTSSOP
1226:
1221:
1216:
1211:
1206:
1201:
1196:
1190:
1188:
1184:
1183:
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1007:
1005:
998:
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989:
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932:External links
930:
927:
926:
898:
873:
847:
825:
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822:
819:
805:
802:
798:Memory modules
738:
735:
727:memory modules
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540:Main article:
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250:IC body width
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114:
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104:
82:
79:
15:
9:
6:
4:
3:
2:
1439:
1428:
1427:Chip carriers
1425:
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1408:
1402:
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1210:
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1202:
1200:
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1192:
1191:
1189:
1185:
1179:
1176:
1175:
1173:
1169:
1162:
1159:
1156:
1153:
1151:(D3PAK) (SMT)
1150:
1147:
1145:(D2PAK) (SMT)
1144:
1141:
1139:(I2PAK) (SMT)
1138:
1135:
1132:
1129:
1126:
1123:
1120:
1117:
1114:
1111:
1108:
1105:
1102:
1099:
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1093:
1090:
1087:
1084:
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1078:
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1060:
1057:
1055:
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1049:
1047:
1043:
1036:
1033:
1030:
1027:
1024:
1021:
1018:
1015:
1012:
1009:
1008:
1006:
1004:
999:
995:
988:
983:
981:
976:
974:
969:
968:
965:
958:
954:
951:
949:
946:
944:
941:
939:
936:
935:
915:
908:
902:
888:on 2011-07-16
887:
883:
877:
864:on 2012-04-27
863:
859:
858:
851:
836:
830:
826:
818:
811:
801:
799:
795:
791:
787:
783:
779:
775:
771:
767:
763:
759:
754:
752:
743:
734:
732:
728:
725:
721:
712:
703:
699:
695:
690:inches ). 0.5
664:
661:
660:
659:
651:
644:
635:
633:
628:
619:
616:
613:
610:
607:
604:
601:
598:
595:
592:
591:
584:
581:
575:
572:
569:
566:
563:
557:
551:
548:
547:
543:
533:
514:
512:
510:
504:
502:
496:
492:
491:
486:
484:
478:
476:
464:
461:
458:
457:
450:
444:
441:
440:
437:
424:
421:
418:
415:
412:
409:
406:
403:
400:
397:
394:
393:
389:
386:
383:
380:
377:
374:
371:
368:
365:
362:
359:
358:
354:
351:
348:
345:
342:
339:
336:
333:
330:
327:
324:
323:
319:
313:
310:
304:
301:
298:
295:
292:
286:
280:
277:
276:
269:End overhang
268:
265:
264:
260:
254:
253:
249:
243:
242:
238:
235:
234:
230:
224:
223:
219:
213:
212:
208:
205:
204:
200:
197:
196:
192:
189:
188:
184:
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180:
173:
169:
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152:
150:
146:
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138:
128:
125:
124:
122:
118:
115:
108:
105:
100:
97:
96:
94:
91:
90:
89:
87:
86:Small outline
78:
76:
72:
68:
64:
60:
56:
53:
49:
45:
38:
34:
29:
21:
1354:WL-CSP / WLP
1224:TSOP / HTSOP
1133:(DPAK) (SMT)
1127:(IPAK) (SMT)
1121:(TH / Panel)
1115:(TH / Panel)
1109:(TH / Panel)
1103:(TH / Panel)
1091:(TH / Panel)
1061:(TH / Panel)
919:23 September
917:. Retrieved
913:
901:
890:. Retrieved
886:the original
876:
866:, retrieved
862:the original
856:
850:
839:. Retrieved
829:
809:
807:
755:
748:
717:
700:
696:
673:
657:
649:
629:
625:
515:
508:
506:
500:
498:
494:
489:
488:
482:
480:
474:
472:
470:
465:8.07 (7.67)
435:
231:Lead length
167:
164:SOIC (JEDEC)
158:
142:
136:
134:
119:(previously
85:
84:
70:
66:
47:
43:
41:
1272:QUIP / QUIL
810:exposed pad
804:Exposed pad
790:comparators
646:SOJ package
593:miniSOIC-10
462:5.41 (5.16)
346:0.41 (1.04)
220:Lead width
1280:Grid array
1219:SOP / SSOP
1171:Single row
1054:SOT / TSOT
892:2013-01-01
868:2012-04-27
841:2020-06-02
821:References
817:benefits.
780:, memory (
678:mm (0.0256
37:ZIF socket
1334:Flip Chip
1253:QIP / QIL
1214:SO / SOIC
1204:Flat Pack
1199:DIP / DIL
1178:SIP / SIL
1046:3...5-pin
814:1.5 times
686:mm (0.025
536:mini-SOIC
422:0.39–0.46
419:0.19–0.25
407:0.10–0.25
404:1.35–1.75
395:SOIC-16-N
387:0.39–0.46
384:0.19–0.25
375:8.55–8.75
372:0.10–0.25
369:1.35–1.75
360:SOIC-14-N
352:0.35–0.51
349:0.19–0.25
337:0.10–0.25
334:1.35–1.75
1421:Category
1243:Quad row
1187:Dual row
758:wireless
495:extended
487:, where
425:0.3–0.7
410:9.8–10.0
390:0.3–0.7
325:SOIC-8-N
63:pin-outs
1013:(DO-27)
1001:Single
957:quarter
914:IC Haus
766:op-amps
733:(BGA).
549:Package
442:Package
401:5.8–6.2
398:3.8–4.0
366:5.8–6.2
363:3.8–4.0
340:4.8–5.0
331:5.8–6.2
328:3.8–4.0
278:Package
50:) is a
23:SOIC-16
1161:TO-274
1155:TO-273
1149:TO-268
1143:TO-263
1137:TO-262
1131:TO-252
1125:TO-251
1119:TO-247
1113:TO-220
1107:TO-202
1101:TO-126
1029:DO-214
1023:DO-213
1017:DO-204
1011:DO-201
786:E2PROM
774:analog
692:
688:
684:
680:
676:
459:SOIC-8
239:Pitch
107:MS-013
99:MS-012
1312:Wafer
1095:TO-92
1089:TO-66
1083:TO-39
1077:TO-18
1003:diode
955:A US
910:(PDF)
782:EPROM
778:ASICs
770:logic
620:0.23
528:and W
520:and W
355:0.33
117:JEITA
93:JEDEC
1349:UICC
1292:eWLB
1258:PLCC
1209:MSOP
1097:(TH)
1085:(TH)
1079:(TH)
1073:(TH)
1071:TO-8
1067:(TH)
1065:TO-5
1059:TO-3
921:2018
808:The
792:and
724:DRAM
617:0.19
614:0.95
605:0.10
602:1.09
507:SOIC
481:SOIC
416:1.05
413:1.27
381:1.05
378:1.27
343:1.27
147:and
137:SOIC
121:EIAJ
75:4011
67:SOIC
48:SOIC
1339:PoP
1329:CSP
1325:COG
1322:COF
1319:COB
1302:PGA
1297:LGA
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