247:
include unreinforced, glass-fiber reinforced, carbon fiber reinforced, and wear resistant grades. These resins are sold at a relatively low molecular weight so they can be melt processed by extrusion or injection-molding. The molded articles are then thermally treated for several days at temperatures up to 260 °C (500 °F). During this treatment, commonly referred to a postcure, the molecular weight increases through chain extension and the polymer gets much stronger and more chemically resistant. Prior to postcure, parts can be reground and reprocessed. After postcure, reprocessing is not practical.
33:
211:(TMA). The product achieved at the end of this process is a high molecular weight, fully imidized polymer solution with no condensation byproducts, since the carbon dioxide gas byproduct is easily removed. This form is convenient for the manufacture of wire enamel or coatings. The solution viscosity is controlled by stoichiometry, monofunctional reagents, and polymer solids. The typical polymer solids level is 35-45% and it may be diluted further by the supplier or user with diluents.
228:
added to provide the correct viscosity for application to the copper or aluminum conductor. Application is typically done by drawing the conductor through a bath of enamel and then through a die to control coating thickness. The wire is then passed through an oven to drive off the solvent and cure the coating. The wire usually is passed through the process several times to achieve the desired coating thickness.
160:
124:, such as high strength, melt processibility, exceptional high heat capability, and broad chemical resistance. Polyamide-imide polymers can be processed into a wide variety of forms, from injection or compression molded parts and ingots, to coatings, films, fibers and adhesives. Generally these articles reach their maximum properties with a subsequent thermal cure process.
152:
195:(DMSO) at temperatures between 20–60 °C. The byproduct HCl must be neutralized in situ or removed by washing it from the precipitated polymer. Further thermal treatment of the polyamideimide polymer increases molecular weight and causes the amic acid groups to form imides with the evolution of water.
1063:
In general, modern reciprocating-screw injection molding presses with microprocessor controls capable of closed-loop control are recommended for molding PAI. The press should be fitted with a low compression ratio, constant taper screw. The compression ratio should be between 1.1 and 1.5 to 1, and no
246:
The polyamide-imides used for molded articles are also based on aromatic diamines and trimellitic acid chloride, but the diamines are different from those used in the products used for coatings and the polymer is more fully imidized prior to compounding and pelletizing. Resins for injection molding
227:
The product used mainly for coatings is sold in a powdered form and is roughly 50% imidized. One of the major uses is as a magnet wire enamel. The magnet wire enamel is made by dissolving the PAI powder in a strong, aprotic solvent such as N-methyl pyrrolidone. Diluents and other additives can be
1157:
molecules can strongly interact with the polymer membranes causing swelling and plasticization due to high levels of impurities. Polyamide-imides can resist plasticization because of the strong intermolecular interactions arising from the polyimide functions as well as the ability of the polymer
1059:
dryer capable of maintaining a dew point of −40 °F (−40 °C) is recommended. If drying is done in pans or trays, put the resin in layers no more than 2 to 3 inches (5 to 8 cm) deep in drying trays. Dry for 24 hours at 250 °F, or 16 hours at 300 °F, or 8 hours at
1060:
350 °F. If drying at 350 °F (177 °C), limit drying time to 16 hours. For the injection molding press, a desiccant hopper dryer is recommended. The circulating air suction pipe should be at the base of the hopper, as near the feed throat as possible.
238:. The PAI aids in adhering the fluoropolymer to the metal substrate. They also find usage in non-stick cookware coatings. While solvents can be used, some water-borne systems are used. These are possible because the amide-imide contains acid functionality.
1054:
Polyamide-imide resin is hygroscopic, and picks up ambient moisture. Before processing the resin, drying is required to avoid brittle parts, foaming, and other molding problems. The resin must be dried to a moisture content of 500 ppm or less. A
1158:
chains to hydrogen bond with one another as a result of the amide bond. Although not currently used in any major industrial separation, polyamide-imides could be used for these types of processes where chemical and mechanical stability are required.
104:
that have exceptional mechanical, thermal and chemical resistant properties. Polyamide-imides are used extensively as wire coatings in making magnet wire. They are prepared from isocyanates and TMA (trimellic acid-anhydride) in
1149:, and other impurities from natural gas wells is an important industrial process. Pressures exceeding 1000 psia demand materials with good mechanical stability. The highly polar H
171:(TMAC). Reaction of the anhydride with the diamine produces an intermediate amic acid. The acid chloride functionality reacts with the aromatic amine to give the amide bond and
1134:
The high temperature and chemical resistance of polyamide-imides make them in principle suitable for membrane based gas separations. The separation of contaminants such as
231:
The PAI enamel is very thermally stable as well as abrasion and chemical resistant. PAI is often used over polyester wire enamels to achieve higher thermal ratings.
175:(HCl) as a by-product. In the commercial preparation of polyamideimides, the polymerization is carried out in a dipolar, aprotic solvent such as
109:-methyl-2-pyrrolidone (NMP). A prominent distributor of polyamide-imides is Solvay Specialty Polymers, which uses the trademark
143:
The currently popular commercial methods to synthesize polyamide-imides are the acid chloride route and the isocyanate route.
1188:
167:
The earliest route to polyamide-imides is the condensation of an aromatic diamine, such as methylene dianiline (MDA) and
251:
1239:
1198:
76:
54:
47:
204:
234:
PAI is also used in decorative, corrosion resistant coatings for industrial uses, often in conjunction with
1126:
The mold temperature should be in the range of 325 °F to 425 °F (163 °C to 218 °C).
1167:
168:
203:
This is the primary route to polyamide-imides which are used as wire enamels. A diisocyanate, often
41:
1255:
58:
17:
208:
128:
8:
1223:
Patel, M.C. and Shah, A.D., Poly(amides-imides)based on amino end-capped polyoligomides,
1064:
check device should be used. The starting mold temperatures are specified as follows:
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Polyamide-imides are commercially used for coatings and molded articles.
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93:
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116:
Polyamide-imides display a combination of properties from both
159:
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127:
Other high-performance polymers in this same realm are
1186:
1247:
1187:Freeman, Benny; Yampolskii, Yuri (2011-06-20).
241:
754:
447:
250:
77:Learn how and when to remove this message
386:Coefficient of linear thermal expansion
205:4,4’-methylenediphenyldiisocyanate (MDI)
158:
150:
40:This article includes a list of general
996:Heat deflection temperature at 264 psi
14:
1248:
1190:Membrane Gas Separation - Google Books
655:Heat deflection temperature @ 264 psi
372:Heat deflection temperature @ 264 psi
146:
1129:
1022:Coefficient linear thermal expansion
675:Coefficient linear thermal Expansion
198:
1230:James M. Margolis, editor in chief,
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26:
24:
1217:
46:it lacks sufficient corresponding
25:
1267:
970:Izod impact strength, unnotched
635:Izod impact strength, unnotched
31:
1232:Engineering plastics handbook
1180:
944:Izod impact strength, notched
214:
13:
1:
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138:
7:
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274:Tensile strength, ultimate
242:Molded or machined articles
222:
10:
1272:
1168:Plastic automotive engine
755:Wear-resistant PAI grades
448:High-strength grades only
169:trimellitic acid chloride
155:Trimellitic acid chloride
733:Water absorption, 24 hr
432:Water absorption, 24 hr
252:Properties of molded PAI
364:J/m (ft-lb/in) average
61:more precise citations.
164:
156:
918:Compressive strength
615:Izod impact strength
575:Compressive strength
358:Izod impact strength
344:Compressive strength
209:trimellitic anhydride
162:
154:
129:polyetheretherketones
1242:, McGraw-Hill, c2006
1153:S and polarizable CO
840:Tensile elongation
695:Volume resistivity
515:Tensile elongation
400:Volume resistivity
302:Tensile elongation
294:GPa, average value
280:MPa, average value
163:Methylene dianiline
147:Acid chloride route
1130:Other applications
866:Flexural strength
535:Flexural strength
316:Flexural strength
207:, is reacted with
199:Diisocyanate route
165:
157:
1124:
1123:
1050:Injection molding
1047:
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892:Flexural modulus
788:Tensile strength
752:
751:
714:Specific gravity
555:Flexural modulus
475:Tensile strength
445:
444:
330:Flexural modulus
193:dimethylsulfoxide
189:dimethylformamide
185:dimethylacetamide
181:methylpyrrolidone
173:hydrochloric acid
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16:(Redirected from
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1028:ppm/°C (ppm/°F)
814:Tensile modulus
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681:ppm/°C (ppm/°F)
495:Tensile modulus
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406:ohm-cm, average
288:Tensile modulus
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90:Polyamide-imides
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67:September 2009
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1204:. Retrieved
1189:
1182:
1133:
1125:
1092:Middle zone
1062:
1053:
973:ASTM D 4812
904:6.9 (1,000)
901:7.3 (1.060)
832:7.4 (1,080)
823:8.8 (1,280)
765:Test method
638:ASTM D 4812
458:Test method
263:Test method
245:
233:
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218:
202:
176:
166:
142:
126:
115:
110:
106:
100:, amorphous
89:
88:
73:
64:
45:
1103:Front zone
1025:ASTM D 696
999:ASTM D 648
947:ASTM D 256
939:157 (22.8)
933:138 (20.0)
930:166 (24.1)
927:123 (17.8)
924:MPa (kpsi)
921:ASTM D 695
898:GPa (kpsi)
895:ASTM D 790
887:154 (22.4)
884:131 (19.0)
881:152 (22.0)
878:215 (31.2)
875:208 (30.2)
872:MPa (kpsi)
869:ASTM D 790
843:ASTM D 638
820:GPa (kpsi)
817:ASTM D 638
809:114 (16.6)
800:113 (16.4)
797:117 (16.9)
794:MPa (kpsi)
791:ASTM D 638
736:ASTM D 570
717:ASTM D 792
698:ASTM D 257
678:ASTM D 696
658:ASTM D 648
618:ASTM D 256
610:119 (17.3)
607:139 (20.1)
604:128 (18.5)
601:MPa (kpsi)
598:ASTM D 732
590:254 (36.9)
587:264 (38.3)
584:221 (32.1)
581:MPa (kpsi)
578:ASTM D 695
561:GPa (kpsi)
558:ASTM D 790
550:350 (50.7)
547:333 (48.3)
544:241 (34.9)
541:MPa (kpsi)
538:ASTM D 790
518:ASTM D 638
501:GPa (kpsi)
498:ASTM D 638
490:221 (32.0)
487:221 (32.1)
484:152 (22.0)
481:MPa (kpsi)
478:ASTM D 638
470:30% CF PAI
467:30% GF PAI
435:ASTM D 570
421:ASTM D 792
403:ASTM D 257
389:ASTM D 696
375:ASTM D 648
361:ASTM D 256
347:ASTM D 695
333:ASTM D 638
319:ASTM D 790
305:ASTM D 638
291:ASTM D 638
277:ASTM D 638
269:Molded PAI
215:Fabrication
92:are either
59:introducing
1206:2012-02-19
1174:References
1081:Feed zone
1017:281 (538)
1014:280 (536)
1011:278 (532)
1008:279 (534)
1005:280 (536)
936:99 (14.4)
910:6.8 (990)
826:6.8 (990)
806:81 (11.8)
803:94 (13.6)
670:282 (540)
667:282 (540)
664:278 (532)
644:1070 (20)
624:144 (2.7)
564:5.0 (730)
504:4.5 (650)
381:273 (523)
367:0.521 (1)
191:(DMF), or
133:polyimides
122:polyimides
118:polyamides
42:references
1076:Temp, °C
1073:Temp, °F
1057:desiccant
965:37 (0.7)
962:48 (0.9)
959:43 (0.8)
956:64 (1.2)
953:85 (1.6)
762:Property
647:530 (10)
630:48 (0.9)
627:80 (1.5)
464:Neat PAI
455:Property
260:Property
139:Chemistry
1250:Category
1162:See also
1034:25 (14)
1031:25 (14)
1002:°C (°F)
991:110 (2)
988:160 (3)
985:210 (4)
982:430 (8)
979:270 (5)
684:31 (17)
661:°C (°F)
650:320 (6)
418:Density
378:°C (°F)
223:Coatings
187:(DMAC),
102:polymers
1114:Nozzle
1040:16 (9)
1037:14 (8)
701:ohm-cm
687:16 (9)
392:ppm/°C
183:(NMP),
55:improve
1238:
1197:
1043:9 (3)
768:Units
690:9 (5)
461:Units
266:Units
111:Torlon
44:, but
18:Torlon
1070:Zone
783:4645
780:4630
777:4435
774:4301
771:4275
748:0.26
745:0.24
742:0.33
728:1.48
725:1.61
722:1.42
707:2e17
704:2e17
441:0.35
427:1.48
424:g/cm
395:37.7
339:4.58
311:3.15
297:3.97
283:91.6
1236:ISBN
1195:ISBN
1120:371
1117:700
1109:343
1106:650
1098:327
1095:620
1087:304
1084:580
861:0.8
858:1.9
855:1.0
852:3.3
849:2.6
530:1.5
527:2.3
524:7.6
409:8.10
353:132
336:GPa
325:133
322:MPa
131:and
120:and
413:10
96:or
1252::
1234:,
1193:.
1141:,
1136:CO
846:%
739:%
521:%
438:%
308:%
135:.
113:.
1209:.
1155:2
1151:2
1147:S
1145:2
1143:H
1138:2
411:×
179:-
177:N
107:N
80:)
74:(
69:)
65:(
51:.
20:)
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