324:
1023:
38:
1054:
Due to the high hardness of the coating, it can be used to salvage worn parts. Coatings of 25 to 100 micrometers can be applied and machined back to the final dimensions. Its uniform deposition profile means it can be applied to complex components not readily suited to other hard-wearing coatings
632:
Because of the autocatalytic character of the reaction, the surface to be plated must be activated by making it hydrophilic, then ensuring that it consists of a metal with catalytic activity. If the substrate is not made of one of those metals, then a thin layer of one of them must be deposited
851:
consisting of minute solid particles embedded in the nickel-phosphorus coat. The general procedure is to suspend the particles in the plating bath, so that the growing metal layer will surround and cover them. This procedure was initially developed by
Odekerken in 1966 for electrodeposited
921:
A disadvantage is the higher cost of the chemicals, which are consumed in proportion to the mass of nickel deposited; whereas in electroplating the nickel ions are replenished by the metallic nickel anode. Automatic mechanisms may be needed to replenish those reagents during plating.
228:
greatly developed the process, determining the optimum parameters and concentrations of the bath, and introducing many important additives to speed up the deposition rate and prevent unwanted reactions, such as spontaneous deposition. They also studied the chemistry of the process.
904:
Compared to the electrolytic process, a major advantage of electroless nickel plating is that it creates an even coating of a desired thickness and volume, even in parts with complex shape, recesses, and blind holes. Because of this property, it may often be the only option.
1030:
Electroless nickel-phosphorus is used when wear resistance, hardness and corrosion protection are required. Applications include oilfield valves, rotors, drive shafts, paper handling equipment, fuel rails, optical surfaces for diamond turning,
1066:, as a way of providing an atomically smooth coating to the aluminium disks. The magnetic layers are then deposited on top of this film, usually by sputtering and finishing with protective carbon and lubrication layers.
998:
The melting point of the nickel-phosphorus alloy deposited by the EN process is significantly lower than that of pure nickel (1445 °C), and decreases as the phosphorus content increases, down to 890 °C at about 14% P.
952:
coatings, the most common type, are defined as those with 4 to 10% P, although the range depends on the application: up to 4–7% for decorative applications, 6–9% for industrial applications, and 4–10% for
819:, is applied, followed by rinsing with water and dried to prevent staining. Baking may be necessary to improve the hardness and adhesion of the plating, anneal any internal stresses, and expel trapped
297:
Before plating, the surface of the material must be thoroughly cleaned. Unwanted solids left on the surface cause poor plating. Cleaning is usually achieved by a series of chemical baths, including
1456:
M. Bouanani, F. Cherkaoui, R. Fratesi, G. Roventi, and G. Barucca (1999): "Microstructural characterization and corrosion resistance of Ni–Zn–P alloys electrolessly deposited from a sulphate bath".
312:
to remove oxides, insoluble organics, and other surface contaminants. After applying each bath, the surface must be thoroughly rinsed with water to remove any residue of the cleaning chemicals.
961:
coatings have 10–14% P. They are preferred for parts that will be exposed to highly corrosive acidic environments such as oil drilling and coal mining. Their hardness may score up to 600 on
211:
260:. The boron or phosphorus contents was claimed to be variable from 0.1 to 12%, and that of thallium from 0.5 to 6%. The coatings were claimed to be "an intimate dispersion of hard
623:
accelerators, such as certain sulfur compounds, to counteract the reduction of plating rate caused by complexing agents. They are usually co-deposited and may cause discoloration.
1298:
165:
214:(AES); a year later, at the same conference they proposed the term "electroless" for the process and described optimized bath formulations, that resulted in a patent.
883:
and PTFE particles was more difficult than that of aluminum oxide or silicon carbide. The feasibility to incorporate the second phase of fine particles, the size of a
776:, the initial layer can be created by briefly running an electric current through it and the bath, as in electroplating. If the substrate is not conductive, such as
161:
1094:
864:(PVC) resin, were distributed within a metallic matrix. By changing the baths, the procedure can create coatings with multiple layers of different composition.
245:
233:
273:
221:
180:
125:
reaction. This creates an even layer of metal regardless of the geometry of the surface – in contrast to electroplating which suffers from uneven
835:
for nickel, wholly or partially, with relatively little changes. Other nickel-phosphorus alloys can be created with suitable baths, such as nickel-
386:
169:
1390:
Abner
Brenner and Grace E. Riddel (1950): "Nickel plating by chemical reduction". US Patent 2532283. Granted on 1950-12-05, expired on 1967-12-05.
176:
1425:
Harold Edward Bellis (1969): "Nickel or cobalt wear-resistant compositions and coatings". US Patent 3674447. Granted on 1972-07-04, assigned to
1444:
982:
Electroless nickel-phosphorus coatings with less than 7% phosphorus are solid solutions with a microcrystalline structure, with each grain 2–6
908:
Another major advantage of EN plating is that it does not require electrical power, electrical apparatuses, or sophisticated jigs and racks.
1609:
225:
1002:
The magnetic properties of the coatings decrease with increasing phosphorus contents. Coatings with more than 11.2% P are non-magnetic.
1567:
ASTM B733-15 Standard Guide for
Autocatalytic (Electroless) Nickel-Phosphorus Deposition on Metals for Engineering Use (Withdrawn 2000)
925:
The specific characteristics vary depending on the type of EN plating and nickel alloy used, which are chosen to suit the application.
17:
1069:
Its use in the automotive industry for wear resistance has increased significantly. However, it is important to recognize that only
613:
salts or certain organic compounds, to improve the surface finish. They are mostly co-deposited with nickel (like the stabilizers).
175:
However, Roux's invention does not seem to have received much commercial use. In 1946 the process was accidentally rediscovered by
918:
Electroless nickel plating also can produce coatings that are free of built-in mechanical stress, or even have compressive stress.
1490:
1101:. The gold is typically applied by quick immersion in a solution containing gold salts. This process is known in the industry as
1222:
140:
It has many industrial applications, from merely decorative to the prevention of corrosion and wear. It can be used to apply
217:
A declassified US Army technical report in 1963 credits the discovery to Wurtz and Roux more than to
Brenner and Riddell.
1162:
1014:
decreases as the phosphorus contents increases, while hardness, wear resistance, and resistance to corrosion increase.
795:
Activation is done with a weak acid etch, nickel strike, or a proprietary solution, if the substrate is non-metallic.
90:
salt. It is the most common version of electroless nickel plating (EN plating) and is often referred by that name. A
1282:
1210:
1102:
256:
salts, thus producing a metal-thallium-boron or metal-thallium-phosphorus; where the metal could be either nickel or
204:
1294:
1167:
91:
31:
777:
1532:
ASTM B733 - 04(2009) Standard
Specification for Autocatalytic (Electroless) Nickel-Phosphorus Coatings on Metal
1070:
812:
327:
Molecular model of sodium hypophosphite, the usual reducing agent in electroless nickel-phosphorus plating.
184:
816:
911:
If properly formulated, EN plating may also provide a less porous coating, harder and more resistant to
758:, the initial nickel layer can be created by immersing a piece of a more electropositive metal, such as
1172:
133:
of the bath and therefore on the current distribution within it. Moreover, it can be applied to non-
126:
1239:
990:. Between these two limits, the coating is a mixture of amorphous and microcrystalline materials.
876:
1326:
1077:
compliant process types (free from heavy metal stabilizers) may be used for these applications.
599:
compounds, or various organic compounds, to slow the reduction by co-depositing with the nickel.
586:
to increase phosphate solubility and to prevent the white-out phenomena by slowing the reaction.
1614:
145:
46:
1314:
156:
The reduction of nickel salts to nickel metal by hypophosphite was accidentally discovered by
1152:
1090:
962:
618:
surfactants, to keep the deposited layer hydrophilic in order to reduce pitting and staining.
157:
1503:
315:
Internal stresses in the substrate created by machining or welding can affect the plating.
249:
196:
56:
1544:
8:
568:, and proceeds spontaneously once an initial layer of nickel has formed on the surface.
130:
831:
The processes for electroless nickel-phosphorus plating can be modified by substituting
331:
The main ingredients of an electroless nickel plating bath are source of nickel cations
861:
848:
785:
575:
241:
141:
1579:
323:
1322:
1278:
1206:
1098:
1026:
Electroless nickel coating is often used to smooth the platters of hard disk drives.
891:, within a metal-alloy matrix has initiated a new generation of composite coatings.
604:
buffers, to maintain the acidity of the bath. Many complexing agents act as buffers.
1461:
1346:
1338:
1254:
1040:
856:
coatings. In that study, in an intermediate layer, finely powdered particles, like
261:
110:
79:
78:. The process involves dipping the substrate in a water solution containing nickel
1258:
1093:(PCBs), to avoid oxidation and improving the solderability of copper contacts and
933:
The metallurgical properties of the alloy depend on the percentage of phosphorus.
1063:
1036:
987:
868:
637:
579:
30:
This article is about nickel-phosphorus coatings. For nickel-boron coatings, see
965:. Note that the Vickers hardness is not easily comparable to the Rockwell scale.
385:. With hypophosphite, the main reaction that produces the nickel plating yields
941:
857:
789:
649:
343:
188:
114:
106:
83:
1465:
1008:
of low-phosphorus coatings is good, but decreases with increasing P contents.
1603:
872:
772:
On substrates that are not metallic but are electrically conductive, such as
766:
763:
565:
347:
122:
87:
1240:"Electroless nickel, alloy, composite and nano coatings - A critical review"
974:
Electroless nickel plating can have a matte, semi-bright, or bright finish.
940:
coatings have up to 4% P contents. Their hardness reaches up to 60 on the
210:
Brenner and Riddel presented their discovery at the 1946 Convention of the
1566:
1531:
1350:
1056:
781:
371:
121:
in solution to metallic is achieved by purely chemical means, through an
95:
1022:
37:
1493:". Online article at the Thomasnet.com website. Accessed on 2020-07-11.
1447:". Online article at the Thomasnet.com website. Accessed on 2020-07-11.
1273:
1225:". Online article at the Thomasnet.com website. Accessed on 2020-07-11.
1157:
1044:
888:
134:
64:
867:
The first commercial application of their work was electroless nickel-
1106:
1032:
1005:
983:
912:
884:
804:
557:
549:
298:
1376:
Proc. 34th Annual
Convention of the American Electroplaters' Society
1363:
Proc. 33rd Annual
Convention of the American Electroplaters' Society
199:, they observed that the amount of nickel that was deposited at the
1105:(ENIG). A variant of this process adds a thin layer of electroless
1011:
853:
820:
773:
645:
421:
253:
1048:
880:
808:
610:
561:
301:
200:
75:
780:
and other plastics, one can use an activating bath containing a
191:
bath in order to prevent undesirable oxidation reactions at the
1426:
832:
755:
596:
553:
309:
257:
237:
118:
60:
754:
For metals that are less electropositive than nickel, such as
583:
564:, and nickel itself. Because of the latter, the reaction is
192:
99:
71:
67:
648:, an initial nickel film will be created spontaneously by a
1124:
1086:
1074:
836:
762:, electrically connected to the substrate, thus creating a
759:
641:
592:
305:
1277:. Translation by John E. Goodman. Accessed on 2018-09-08.
1109:
over the nickel, a process known by the acronym ENEPIG.
879:(nickel-phosphorus PTFE). However, the co-deposition of
1343:
Journal of
Research of the National Bureau of Standards
1085:
Electroless nickel plating, covered by a thin layer of
1297:". US Patent 1207218. Granted 1916-12-05, assigned to
240:
filed a patent for a general class of processes using
1445:
875:. Another commercial composite in 1981 incorporated
986:across. Coatings with more than 10% phosphorus are
187:. They tried adding various reducing agents to an
168:patented the process (using both hypophosphite and
1203:Electroless plating: fundamentals and applications
1062:It is also used extensively in the manufacture of
847:Electroless nickel-phosphorus plating can produce
109:, processes in general do not require passing an
1601:
1238:Sudagar, Jothi; Lian, Jianshe; Sha, Wei (2013).
1201:G. O. Mallory and J. B. Hajdu, editors (1990):
899:
1237:
41:Machine parts with electroless nickel plating.
1439:
1437:
1435:
1339:Nickel plating on steel by chemical reduction
842:
1526:
1524:
1485:
1483:
1481:
1479:
1477:
1475:
1473:
1315:Historical highlights of electroless plating
284:) in a soft matrix of nickel and thallium".
129:due to the effect of substrate shape on the
27:Chemical-induced nickel coating of a surface
1386:
1384:
1337:Abner Brenner and Grace E. Riddel (1946): "
1197:
1195:
1193:
1191:
1189:
1187:
226:General American Transportation Corporation
1432:
1361:Abner Brenner and Grace E. Riddel (1946):
1309:
1307:
1233:
1231:
1215:
798:
70:on the surface of a solid substrate, like
1559:
1537:
1521:
1470:
1406:
1393:
1374:Abner Brenner and Grace E. Riddel(1947):
1080:
636:If the substrate is a metal that is more
1450:
1419:
1381:
1355:
1331:
1265:
1184:
1163:Organic Solderability Preservative (OSP)
1021:
322:
113:through the bath and the substrate; the
36:
1545:"Surface Finishes in a Lead Free World"
1496:
1368:
1304:
1287:
1228:
346:and a suitable reducing agent, such as
304:to remove oils and greases, as well as
14:
1602:
1295:Process of producing metallic deposits
993:
571:The plating bath also often includes:
151:
1274:Chemical (Electroless) Nickel-Plating
627:
1491:How Electroless Nickel Plating Works
1610:Printed circuit board manufacturing
1580:"Electroless Nickel Specifications"
1547:. Uyemura International Corporation
1489:Thomas Publishing Company (2020): "
1458:Journal of Applied Electrochemistry
1443:Thomas Publishing Company (2020): "
1321:, volume 71, issue 6, pages 24-27.
1221:Thomas Publishing Company (2020): "
292:
24:
1223:The Electro Nickel Plating Process
894:
792:, and a suitable reducing agent.
203:exceeded the theoretical limit of
98:reducing agent, yielding a nickel-
25:
1626:
1103:electroless nickel immersion gold
969:
873:Wankel internal combustion engine
1416:, volume 52, issue 12, page 61.
1313:Charles R. Shipley Jr. (1984): "
1168:Electroless nickel-boron plating
1089:, is used in the manufacture of
409:, elemental phosphorus, protons
220:During 1954–1959, a team led by
212:American Electroplaters' Society
32:electroless nickel-boron plating
1572:
1403:, volume 52, issue 11, page 68.
1293:François Auguste Roux (1914): "
1247:Journal of Alloys and Compounds
1017:
318:
59:that deposits an even layer of
1071:End of Life Vehicles Directive
633:first, by some other process.
172:) for general metal plating.
148:suitable powders in the bath.
13:
1:
1319:Plating and Surface Finishing
1259:10.1016/j.jallcom.2013.03.107
1178:
1504:"Electroless Nickel Plating"
1460:, volume 29, pages 637–645.
1271:=Georgi G. Gavrilov (1979),
1112:
1051:tools and office equipment.
977:
900:Advantages and disadvantages
287:
185:National Bureau of Standards
82:and a phosphorus-containing
7:
1146:
826:
10:
1631:
1345:, volume 37, pages 31–34
1173:Electroless copper plating
843:Composites by codeposition
823:that may make it brittle.
811:chemical coating, such as
29:
18:Electroless nickel plating
915:and hydrogen absorption.
652:with the bath, such as:
552:by some metals including
49:nickel-phosphorus plating
1301:, expired on 1933-12-05.
928:
1466:10.1023/A:1026441403282
877:polytetrafluoroethylene
803:After plating, an anti-
799:After-plating treatment
1412:Abner Brenner (1954):
1399:Abner Brenner (1954):
1091:printed circuit boards
1081:Printed circuit boards
1027:
328:
51:, also referred to as
42:
1153:Nickel electroplating
1130:ASTM-B-656 (inactive)
1025:
640:than nickel, such as
609:brighteners, such as
591:stabilizers, such as
326:
252:, in the presence of
162:François Auguste Roux
158:Charles Adolphe Wurtz
40:
1429:, expired 1989-07-04
1351:10.6028/jres.037.019
1299:L'Aluminium Français
1095:plated through holes
250:sodium hypophosphite
246:dimethylamine borane
234:Harold Edward Bellis
197:sodium hypophosphite
166:L'Aluminium Français
1142:IPC-7095 (for ENIG)
1139:IPC-4552 (for ENIG)
994:Physical properties
849:composite materials
152:Historical overview
131:electric resistance
1028:
862:polyvinyl chloride
786:palladium chloride
628:Surface activation
329:
242:sodium borohydride
195:. When they added
160:in 1844. In 1911,
43:
1041:bathroom fixtures
950:Medium-phosphorus
576:complexing agents
548:This reaction is
102:coating instead.
16:(Redirected from
1622:
1595:
1594:
1592:
1590:
1584:Electro-Coatings
1576:
1570:
1563:
1557:
1556:
1554:
1552:
1541:
1535:
1528:
1519:
1518:
1516:
1514:
1500:
1494:
1487:
1468:
1454:
1448:
1441:
1430:
1423:
1417:
1410:
1404:
1397:
1391:
1388:
1379:
1372:
1366:
1359:
1353:
1335:
1329:
1311:
1302:
1291:
1285:
1269:
1263:
1262:
1244:
1235:
1226:
1219:
1213:
1199:
1064:hard disk drives
1037:kitchen utensils
942:Rockwell C scale
871:coatings on the
749:
748:
747:
738:
737:
736:
726:
725:
724:
715:
714:
713:
700:
699:
698:
689:
688:
687:
677:
676:
675:
666:
665:
664:
580:carboxylic acids
543:
542:
541:
531:
527:
526:
525:
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514:
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505:
495:
494:
493:
483:
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447:
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432:
419:
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417:
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406:
398:
397:
384:
383:
382:
369:
368:
367:
359:
358:
341:
340:
339:
293:Surface cleaning
283:
274:nickel phosphide
271:
262:trinickel boride
222:Gregorie Gutzeit
181:Grace E. Riddell
111:electric current
57:chemical process
21:
1630:
1629:
1625:
1624:
1623:
1621:
1620:
1619:
1600:
1599:
1598:
1588:
1586:
1578:
1577:
1573:
1564:
1560:
1550:
1548:
1543:
1542:
1538:
1529:
1522:
1512:
1510:
1508:Erie Plating Co
1502:
1501:
1497:
1488:
1471:
1455:
1451:
1442:
1433:
1424:
1420:
1414:Metal Finishing
1411:
1407:
1401:Metal Finishing
1398:
1394:
1389:
1382:
1373:
1369:
1360:
1356:
1336:
1332:
1312:
1305:
1292:
1288:
1270:
1266:
1242:
1236:
1229:
1220:
1216:
1200:
1185:
1181:
1149:
1115:
1083:
1020:
996:
980:
972:
959:High-phosphorus
931:
902:
897:
895:Characteristics
869:silicon carbide
845:
829:
801:
746:
744:
743:
742:
740:
735:
732:
731:
730:
728:
723:
721:
720:
719:
717:
712:
709:
708:
707:
705:
697:
695:
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691:
686:
683:
682:
681:
679:
674:
672:
671:
670:
668:
663:
660:
659:
658:
656:
638:electropositive
630:
540:
537:
536:
535:
533:
529:
524:
522:
521:
520:
518:
513:
510:
509:
508:
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499:
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366:
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350:
338:
336:
335:
334:
332:
321:
295:
290:
281:
277:
269:
265:
154:
127:current density
92:similar process
35:
28:
23:
22:
15:
12:
11:
5:
1628:
1618:
1617:
1612:
1597:
1596:
1571:
1558:
1536:
1530:ASTM (2009): "
1520:
1495:
1469:
1449:
1431:
1418:
1405:
1392:
1380:
1367:
1354:
1330:
1303:
1286:
1264:
1227:
1214:
1182:
1180:
1177:
1176:
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1165:
1160:
1155:
1148:
1145:
1144:
1143:
1140:
1137:
1134:
1131:
1128:
1122:
1119:
1114:
1111:
1082:
1079:
1019:
1016:
995:
992:
979:
976:
971:
970:Surface finish
968:
967:
966:
955:
954:
946:
945:
938:Low-phosphorus
930:
927:
901:
898:
896:
893:
858:aluminum oxide
844:
841:
828:
825:
800:
797:
790:silver nitrate
752:
751:
745:
733:
722:
710:
702:
696:
684:
673:
661:
650:redox reaction
629:
626:
625:
624:
620:
619:
615:
614:
606:
605:
601:
600:
588:
587:
566:auto-catalytic
546:
545:
538:
523:
511:
502:
490:
477:
465:
456:
445:
429:
420:and molecular
415:
403:
394:
387:orthophosphite
379:
364:
355:
344:nickel sulfate
337:
320:
317:
294:
291:
289:
286:
279:
267:
189:electroplating
170:orthophosphite
153:
150:
107:electroplating
84:reducing agent
26:
9:
6:
4:
3:
2:
1627:
1616:
1615:Metal plating
1613:
1611:
1608:
1607:
1605:
1585:
1581:
1575:
1568:
1562:
1546:
1540:
1533:
1527:
1525:
1509:
1505:
1499:
1492:
1486:
1484:
1482:
1480:
1478:
1476:
1474:
1467:
1463:
1459:
1453:
1446:
1440:
1438:
1436:
1428:
1422:
1415:
1409:
1402:
1396:
1387:
1385:
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1513:8 September
1378:, page 156.
1253:: 183–204.
1121:AMS-C-26074
784:salt, like
782:noble metal
372:borohydride
96:borohydride
47:Electroless
1604:Categories
1565:ASTM (): "
1179:References
1158:Nucleation
1049:mechanical
1045:electrical
1033:door knobs
889:micrometer
578:, such as
342:, usually
146:suspending
137:surfaces.
135:conductive
65:phosphorus
1327:0360-3164
1113:Standards
1107:palladium
988:amorphous
978:Structure
913:corrosion
885:nanometer
813:phosphate
805:oxidation
558:palladium
550:catalyzed
299:non-polar
288:Procedure
232:In 1969,
142:composite
115:reduction
1365:page 23.
1147:See also
1118:AMS-2404
1012:Porosity
854:chromium
827:Variants
821:hydrogen
817:chromate
807:or anti-
774:graphite
727:(aq) → 3
646:aluminum
422:hydrogen
302:solvents
254:thallium
53:E-nickel
1589:14 July
1551:6 March
881:diamond
852:nickel-
809:tarnish
764:shorted
739:(s) + 2
716:(s) + 3
678:(aq) →
611:cadmium
595:salts,
562:rhodium
532:(s) + 3
496:(s) + 6
310:alkalis
201:cathode
183:of the
119:cations
105:Unlike
94:uses a
76:plastic
55:, is a
1427:DuPont
1325:
1281:
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833:cobalt
756:copper
690:(s) +
667:(s) +
597:sulfur
584:amines
554:cobalt
258:cobalt
238:DuPont
61:nickel
1243:(PDF)
1127:B-733
1055:like
929:Types
306:acids
272:) or
248:, or
236:from
193:anode
100:boron
72:metal
68:alloy
1591:2020
1553:2019
1515:2018
1323:ISSN
1279:ISBN
1207:ISBN
1125:ASTM
1099:vias
1097:and
1087:gold
1075:RoHS
860:and
837:zinc
760:zinc
750:(aq)
701:(aq)
644:and
642:iron
593:lead
308:and
179:and
80:salt
1462:doi
1347:doi
1341:".
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1251:571
1073:or
887:to
815:or
788:or
778:ABS
582:or
544:(g)
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484:→ 2
471:+ 2
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164:of
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741:Al
729:Ni
718:Ni
706:Al
692:Fe
680:Ni
669:Ni
657:Fe
560:,
556:,
507:PO
486:Ni
461:PO
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