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or "spreads out" heat, so that the heat exchanger(s) may be more fully utilized. This has the potential to increase the heat capacity of the total assembly, but the additional thermal junctions limit total thermal capacity. The high conduction properties of the spreader will make it more effective to
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uses fluids inside a sealed case. The fluids circulate either passively, by spontaneous convection, triggered when a threshold temperature difference occurs; or actively, because of an impeller driven by an external source of work. Without sealed circulation, energy can be carried by transfer of
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devised a new solution that could cool modern electronics more efficiently than other existing strategies. Their proposed method is based on the use of heat spreaders consisting of an electrical insulating layer of poly (2-chloro-p-xylylene)
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fluid matter, for example externally supplied colder air, driven by an external source of work, from a hotter body to another external body, though this is not exactly heat transfer as defined in physics.
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The use of a heat spreader is an important part of an economically optimal design for transferring heat from high to low heat flux media. Examples include:
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matrix). Such materials are often used as substrates for chips, as their thermal expansion coefficient can be matched to ceramics and semiconductors.
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129:(CFD) analysis, and shows temperature-contoured heat sink surface and fluid flow trajectories, predicted using a CFD analysis package.
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This 120 mm-diameter vapor chamber (heat spreader) heat sink design thermal animation was created using high resolution
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Side-by-side comparison of AMD (center) and Intel (sides) integrated heatspreaders (IHS) common on their microprocessors
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to the heat spreader, causing the CPU to be destroyed during the removal or making removal more difficult.
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is matched by the higher surface area of the spreader, and heat is transferred more effectively.
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C) and a coating of copper. This solution would also require less expensive materials.
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A heat spreader is generally used when the heat source tends to have a high heat-
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6000+ (ADA6000IAA6CZ, Windsor), having its heat spreader removed (known as
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is used as submounts for high-power integrated circuits and laser diodes.
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according to the second law of thermodynamics, a passive heat spreader
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Adams, M.J.; Verosky, M.; Zebarjadi, M.; Heremans, J.P. (2019-05-03).
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431:"Active Peltier Coolers Based on Correlated and Magnon-Drag Metals"
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Device that tends to equalize temperature over its surface
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49:. Unsourced material may be challenged and removed.
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268:(diamond in copper-silver alloy matrix), and
248:Composite materials can be used, such as the
240:Diamond has a very high thermal conductivity.
332:or delidding). This particular CPU core is
348:University of Illinois at Urbana-Champaign
478:, Oxford University Press, London, p. 44.
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109:Learn how and when to remove this message
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475:Natural Philosophy of Cause and Chance
47:adding citations to reliable sources
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352:University of California, Berkeley
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141:from a hotter source to a colder
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346:In May 2022, researchers at the
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520:Computer hardware cooling
168:Exemplifying increase of
435:Physical Review Applied
250:metal matrix composites
264:in aluminium matrix),
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151:thermal conductivity
137:transfers energy as
43:improve this article
447:2019PhRvP..11e4008A
219:integrated circuits
377:Electronics portal
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41:Please help
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494:Tech Xplore
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416:References
270:E-Material
221:such as a
186:convection
153:, such as
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395:Heat sink
390:Heat pipe
330:decapping
278:beryllium
174:disperses
162:heat pipe
143:heat sink
472:(1949).
470:Born, M.
363:See also
357:Parylene
342:Research
334:soldered
298:aluminum
266:Dymalloy
443:Bibcode
252:(MMCs)
170:entropy
83:scholar
235:system
155:copper
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258:AlSiC
231:in a
208:steel
206:on a
90:JSTOR
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292:Two
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