Knowledge

Optical interconnect

Source 📝

176: 74: 33: 298:
refers to any system of transmitting signals from one part of an integrated circuit to another using light. Optical interconnects have been the topic of study due to the high latency and power consumption incurred by conventional metal
328:
which severely limits the rise time of signals when the dimension of the wires are scaled down. Optical solution are used to transmit signals through long distances to substitute interconnection between dies within the
435:
However, there are still many technical challenges in implementing dense optical interconnects to silicon CMOS chips. These challenges are listed as below:
310: 95: 88: 380:, limiting the rise time of signals. Bits of information will overlap with each other when the frequency of signal is increased to a certain level. 503:
David A. B. Miller, ‘Rationale and Challenges for Optical Interconnects to Electronic Chips’, Proceedings of the IEEE, Vol. 88, No. 6, June 2000
516:, "Analysis of Challenges for On-Chip Optical Interconnects", ACM Proceedings of Great Lakes Symposium on VLSI, May 10–12, 2009, Boston 240: 138: 212: 110: 193: 46: 219: 117: 300: 226: 124: 476: 277: 259: 157: 60: 208: 106: 197: 337: 532: 320:(e.g. digital signals) are transmitted by copper wires conventionally, and these electrical wires all have 52: 17: 233: 131: 186: 84: 373: 321: 303:
in transmitting electrical signals over long distances, such as in interconnects classed as
388:
Optical interconnections can provide benefits over conventional metal wires which include:
305: 8: 313:(ITRS) has highlighted interconnect scaling as a problem for the semiconductor industry. 291: 21: 16:
This article is about optical interconnects in integrated circuits. For other uses, see
330: 481: 341: 440: 408: 345: 336:
In order to control the optical signals inside the small IC package properly,
526: 349: 513: 377: 325: 340:(MEMS) technology can be used to integrate the optical components (i.e. 367: 357: 175: 73: 361: 353: 317: 398:
Distance independence of performance of optical interconnects
383: 448:
Absence of appropriate practical optomechanical technology
423:
Chips could be tested in a non-contact optical test set
430: 439:
Receiver circuits and low-capacitance integration of
364:
etc.) and the electronic parts together effectively.
368:
Problems of the current interconnect in the package
311:
International Technology Roadmap for Semiconductors
200:. Unsourced material may be challenged and removed. 445:Evolutionary improvement in optoelectronic devices 395:Reduction of power and area for clock distribution 524: 372:Conventional physical metal wires possess both 457:Temperature dependencies and process variation 61:Learn how and when to remove these messages 384:Benefits of using optical interconnection 278:Learn how and when to remove this message 260:Learn how and when to remove this message 158:Learn how and when to remove this message 316:In electrical interconnects, nonlinear 525: 499: 497: 94:Please improve this article by adding 198:adding citations to reliable sources 169: 67: 26: 494: 431:Challenges for optical interconnect 13: 14: 544: 477:Organic light-emitting transistor 401:No frequency-dependent Cross-talk 42:This article has multiple issues. 426:Benefits of short optical pulses 174: 72: 31: 185:needs additional citations for 50:or discuss these issues on the 506: 1: 487: 338:microelectromechanical system 96:secondary or tertiary sources 411:dissipation in interconnects 7: 470: 10: 549: 420:Reducing the wiring layers 15: 18:Fiber-optic communication 451:Integration technologies 417:Density of interconnects 404:Architectural advantages 392:More predictable timing 209:"Optical interconnect" 107:"Optical interconnect" 83:relies excessively on 296:optical interconnects 454:Polarization control 306:global interconnects 194:improve this article 533:Integrated circuits 292:integrated circuits 22:Optical fiber cable 342:optical waveguides 331:integrated circuit 512:R.K. Dokania and 482:Silicon photonics 460:Losses and errors 414:Voltage isolation 288: 287: 280: 270: 269: 262: 244: 168: 167: 160: 142: 65: 540: 517: 510: 504: 501: 283: 276: 265: 258: 254: 251: 245: 243: 202: 178: 170: 163: 156: 152: 149: 143: 141: 100: 76: 68: 57: 35: 34: 27: 548: 547: 543: 542: 541: 539: 538: 537: 523: 522: 521: 520: 511: 507: 502: 495: 490: 473: 433: 386: 370: 284: 273: 272: 271: 266: 255: 249: 246: 203: 201: 191: 179: 164: 153: 147: 144: 101: 99: 93: 89:primary sources 77: 36: 32: 25: 12: 11: 5: 546: 536: 535: 519: 518: 505: 492: 491: 489: 486: 485: 484: 479: 472: 469: 468: 467: 464: 461: 458: 455: 452: 449: 446: 443: 441:photodetectors 432: 429: 428: 427: 424: 421: 418: 415: 412: 405: 402: 399: 396: 393: 385: 382: 369: 366: 346:optical fibers 333:(IC) package. 286: 285: 268: 267: 182: 180: 173: 166: 165: 80: 78: 71: 66: 40: 39: 37: 30: 9: 6: 4: 3: 2: 545: 534: 531: 530: 528: 515: 509: 500: 498: 493: 483: 480: 478: 475: 474: 465: 462: 459: 456: 453: 450: 447: 444: 442: 438: 437: 436: 425: 422: 419: 416: 413: 410: 406: 403: 400: 397: 394: 391: 390: 389: 381: 379: 375: 365: 363: 359: 355: 351: 347: 343: 339: 334: 332: 327: 323: 319: 314: 312: 308: 307: 302: 301:interconnects 297: 293: 282: 279: 264: 261: 253: 242: 239: 235: 232: 228: 225: 221: 218: 214: 211: –  210: 206: 205:Find sources: 199: 195: 189: 188: 183:This article 181: 177: 172: 171: 162: 159: 151: 140: 137: 133: 130: 126: 123: 119: 116: 112: 109: –  108: 104: 103:Find sources: 97: 91: 90: 86: 81:This article 79: 75: 70: 69: 64: 62: 55: 54: 49: 48: 43: 38: 29: 28: 23: 19: 508: 434: 387: 371: 335: 315: 304: 295: 289: 274: 256: 247: 237: 230: 223: 216: 204: 192:Please help 187:verification 184: 154: 145: 135: 128: 121: 114: 102: 82: 58: 51: 45: 44:Please help 41: 463:Testability 378:capacitance 326:capacitance 514:A.B. Apsel 488:References 374:resistance 360:, optical 356:, optical 322:resistance 250:March 2019 220:newspapers 148:April 2009 118:newspapers 85:references 47:improve it 466:Packaging 407:Reducing 358:actuators 53:talk page 527:Category 471:See also 362:sensors 354:mirrors 318:signals 234:scholar 132:scholar 309:. The 236:  229:  222:  215:  207:  134:  127:  120:  113:  105:  409:power 241:JSTOR 227:books 139:JSTOR 125:books 376:and 350:lens 324:and 213:news 111:news 20:and 290:In 196:by 87:to 529:: 496:^ 352:, 348:, 344:, 294:, 98:. 56:. 281:) 275:( 263:) 257:( 252:) 248:( 238:· 231:· 224:· 217:· 190:. 161:) 155:( 150:) 146:( 136:· 129:· 122:· 115:· 92:. 63:) 59:( 24:.

Index

Fiber-optic communication
Optical fiber cable
improve it
talk page
Learn how and when to remove these messages

references
primary sources
secondary or tertiary sources
"Optical interconnect"
news
newspapers
books
scholar
JSTOR
Learn how and when to remove this message

verification
improve this article
adding citations to reliable sources
"Optical interconnect"
news
newspapers
books
scholar
JSTOR
Learn how and when to remove this message
Learn how and when to remove this message
integrated circuits
interconnects

Text is available under the Creative Commons Attribution-ShareAlike License. Additional terms may apply.