301:, spring contacts that inherently press on contact areas of a PCB or by pure pressure contact where corrosion-proof surface areas are directly pressed together. Press-fit pins achieve a very high reliability and ease the mounting process without the need for soldering. Compared to press-fit connections, spring contacts have the benefit of allowing easy and non-destructive removal of the connection several times, as for inspection or replacement of a module, for instance. Both contact types have rather limited current-carrying capability due to their comparatively low cross-sectional area and small contact surface. Therefore, modules often contain multiple pins or springs for each of the electrical power connections.
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210:, classical power modules contain multiple semiconductor dies that are connected to form an electrical circuit of a certain structure, called topology. Modules also contain other components such as ceramic capacitors to minimize switching voltage overshoots and NTC thermistors to monitor the module's substrate temperature. Examples of broadly available topologies implemented in modules are:
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of the power semiconductors. Therefore, manufacturers work on minimizing the parasitic elements of their modules while keeping cost low and maintain a high degree of interchangeability of their modules with those of a second source (other manufacturer). A further aspect for optimization is the
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313:, increase of reliability and reduction of parasitic lumped elements. These parasitics are unwanted capacitances between circuit parts and inductances of circuit traces. Both can have negative effects on the electromagnetic radiation (
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Intelligent Power Module (IPM) - (consisting of the power stages with their dedicated gate drive protection circuits. May also be integrated with the input rectifier and power factor correction stages.)
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so-called thermal path between the heat source (the dies) and the heat-sink. The heat has to pass through different physical layers such as solder, DCB, baseplate, thermal interface material (
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Additional to the traditional screw contacts the electrical connection between the module and other parts of the power electronic system can also be achieved by pin contacts (soldered onto a
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Opened IGBT module; different semiconductor dies are connected via wire bonds while external connectors are connected to lead-frame structures
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https://www.semikron-danfoss.com/dl/service-support/downloads/download/semikron-application-manual-power-semiconductors-english-en-2015.pdf
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ANPFC (power factor correction leg with two switches and their corresponding antiparallel diodes and four high frequency rectifying diodes)
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Power
Interface Module (PIM) - (consisting of the input rectifier, power factor correction and inverter stages)
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boost or power factor correction (one (or two) switches with one (or two) high frequency rectifying diodes)
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three level H6.5 - (consisting of six switches (four fast IGBTs/two slower IGBTs) and five fast diodes)
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126:(here a 3300V, 1200A switch) are obtained by connecting tens of dies in parallel in a power module.
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in 1975. It is still in production, which gives an idea about the lifecycles of power modules.
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683:: Extensive information about power semiconductor application and power module technology
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where needed. Compared to discrete power semiconductors in plastic housings as TO-247 or
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http://www.power-mag.com/pdf/feature_pdf/1418228828_Vincotech_Feature_0714_Layout_1.pdf
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that carries the power semiconductors, provides electrical and thermal contact and
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three-phase inverter (six switches and the corresponding antiparallel diodes)
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The first potential-free power module was introduced into the market by
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leg with four switches and their corresponding antiparallel diodes)
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leg with four switches and their corresponding antiparallel diodes)
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leg, with two switches and their corresponding antiparallel diodes)
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leg with six switches and their corresponding antiparallel diodes)
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H-Bridge (four switches and the corresponding antiparallel diodes)
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Besides modules that contain a single power electronic switch (as
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DCB-based low-inductive SiC modules for high frequency operation
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The current focus in R&D is on cost reduction, increase of
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Power modules are used for power conversion equipment such as
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Semikron
Application Manual Power Semiconductors (2015)
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Power modules are also widely found in inverters for
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Example of Power module; a high efficiency rectifier
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http://www.infineon.com/pressfit-product-information
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46:. Unsourced material may be challenged and removed.
235:containing four (1-phase) or six (3-phase) diodes
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146:provides the physical containment for several
561:M. Meisser, D. Hamilton and P. Mawby (2014).
664:"Power Semiconductors | Fuji Electric"
158:) are typically soldered or sintered on a
548:"Power Modules Products | Vincotech"
523:"Power Modules Products | Vincotech"
106:Learn how and when to remove this message
154:. These power semiconductors (so-called
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297:), press-fit contacts pressed into PCB
289:Electrical Interconnection Technologies
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261:three level MNPC (T-Type) (multilevel
254:three level NPC (I-Type) (multilevel
174:and are in many cases more reliable.
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44:adding citations to reliable sources
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170:, power packages provide a higher
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305:Current Research and Development
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31:needs additional citations for
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160:power electronic substrate
343:industrial motor drives
144:power electronic module
687:Eltek Flatpack2 48V HE
493:Powerpack (drivetrain)
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359:welder power supplies
347:embedded motor drives
164:electrical insulation
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355:AC-DC power supplies
150:components, usually
40:improve this article
480:WeEn Semiconductors
460:Dynex Semiconductor
366:renewable energies
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703:Power electronics
567:. pp. 1–10.
378:electric vehicles
178:Module Topologies
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96:December 2009
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51:Find sources:
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29:This article
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579:ResearchGate
577:– via
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337:Applications
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224:antiparallel
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38:Please help
33:verification
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595:|work=
503:Prime mover
451: [
374:solar power
322: [
122:High power
509:References
433:Mitsubishi
66:newspapers
597:ignored (
587:cite book
498:Power-egg
448:Vincotech
423:StarPower
196:Thyristor
697:Category
487:See also
470:AT&S
438:Semikron
428:Infineon
390:Semikron
270:inverter
263:inverter
256:inverter
240:inverter
222:), with
214:switch (
418:Danfoss
384:History
380:(EVs).
357:and in
80:scholar
646:"Home"
571:
413:Vishay
216:MOSFET
184:MOSFET
168:TO-220
82:
75:
68:
61:
53:
455:]
408:Eltek
326:]
227:Diode
208:diode
206:) or
148:power
124:IGBTs
87:JSTOR
73:books
599:help
569:ISBN
465:CREE
443:ROHM
403:APEI
299:vias
220:IGBT
204:JFET
188:IGBT
156:dies
59:news
368:as
331:TIM
315:EMR
295:PCB
202:or
200:GTO
192:BJT
142:or
42:by
699::
648:.
591::
589:}}
585:{{
453:de
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103:(
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84:·
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