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measurements were made from DC to 220 GHz. QP interconnects have demonstrated less than 0.1 dB insertion loss from DC to 100 GHz between silicon and silicon chips, and less than 0.8 dB insertion loss up to 220 GHz between
Silicon and Gallium Arsenide.
434:
Sparkman, Kevin; LaVeigne, Joe; McHugh, Steve; Kulick, Jason; Lannon, John; Goodwin, Scott (2014-05-29). Holst, Gerald C.; Krapels, Keith A.; Ballard, Gary H.; Buford, James A.; Murrer, R. Lee (eds.). "Scalable emitter array development for infrared scene projector systems".
355:
Ahmed, Tahsin; Butler, Thomas; Khan, Aamir A.; Kulick, Jason M.; Bernstein, Gary H.; Hoffman, Anthony J.; Howard, Scott S. (2013-09-10). Sasián, José; Youngworth, Richard N. (eds.). "FDTD modeling of chip-to-chip waveguide coupling via optical quilt packaging".
568:
Ahmed, Tahsin; Khan, Aamir A.; Vigil, Genevieve; Kulick, Jason M.; Bernstein, Gary H.; Hoffman, Anthony J.; Howard, Scott S. (2014). "Optical Quilt
Packaging: A New Chip-to-Chip Optical Coupling and Alignment Process for Modular Sensors".
256:
simulations and measurements indicate that inter-chip coupling loss is < 6 dB for a gap of less than 4 ÎĽm. Loss rapidly improves as the gap approaches zero, which is achievable with Quilt
Packaging assembly tolerances.
610:
Ahmed, Tahsin; Lu, Tian; Butler, Thomas P.; Kulick, Jason M.; Bernstein, Gary H.; Hoffman, Anthony J.; Hall, Douglas C.; Howard, Scott S. (2017-05-01). "Mid-Infrared
Waveguide Array Inter-Chip Coupling Using Optical Quilt Packaging".
527:
Lu, Tian; Ortega, Carlos; Kulick, Jason; Bernstein, G. H.; Ardisson, Scott; Engelhardt, Rob (2016). "Rapid SoC prototyping utilizing quilt packaging technology for modular functional IC partitioning".
274:
Zheng, Quanling; Kopp, David; Khan, Mohammad Ashraf; Fay, Patrick; Kriman, Alfred M.; Bernstein, Gary H. (March 2014). "Investigation of Quilt
Packaging Interchip Interconnect With Solder Paste".
320:
Ashraf Khan, M.; Zheng, Quanling; Kopp, David; Buckhanan, Wayne; Kulick, Jason M.; Fay, Patrick; Kriman, Alfred M.; Bernstein, Gary H. (2015-06-01). "Thermal
Cycling Study of Quilt Packaging".
32:
680:
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Khan, M. Ashraf; Kulick, Jason M.; Kriman, Alfred M.; Bernstein, Gary H. (January 2012). "Design and
Robustness of Quilt Packaging Superconnect".
47:
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on QP interconnects have been conducted on quilted chipsets with sets of homogeneous and heterogeneous semiconductor materials.
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Proceedings of the 27th
International Symposium on Rapid System Prototyping: Shortening the Path from Specification to Prototype
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It is relatively common to find packages that contain other components than their designated ones, such as diodes or
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throughput with no distortion with 10 ÎĽm nodules on a 10 ÎĽm pitch on the edge of the chip.
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on top of the nodules to enable the chip to chip interconnection with sub-micron alignment accuracy.
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480:"Ultra-wide Bandwidth Inter-Chip Interconnects for Heterogeneous Millimeter-Wave and THz Circuits"
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Quilt
Packaging Nodules have solder on top to enable chip to chip interconnection
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Fay, Patrick; Bernstein, Gary H.; Lu, Tian; Kulick, Jason M. (2016-04-29).
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QP nodules are created as an integral part of a microchip using standard
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IEEE Transactions on
Components, Packaging and Manufacturing Technology
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Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXV
241:
200:, etc.), can be “quilted” together to create larger multi-function
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and chip-to-chip interconnect packaging technology that utilizes “
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Quilt Packaging “nodules” extend out from the edge of microchips.
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with dissimilar technologies or substrate materials in planar,
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QP Chiplets can be quilted together in most any orientation.
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3x3 Chip Array Using Quilt Packaging Interconnect Technology
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Optical System Alignment, Tolerancing, and Verification VII
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QP interconnects have a achieved 12 gigabit/sec (Gbps)
531:. New York, New York, USA: ACM Press. pp. 79–85.
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Journal of Infrared, Millimeter, and Terahertz Waves
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50:, and by adding encyclopedic content written from a
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401:International Symposium on Microelectronics
1076:List of integrated circuit packaging types
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204:. Thus, QP technology can integrate
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70:Learn how and when to remove this message
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733:(SOD-123 / SOD-323 / SOD-523 / SOD-923)
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31:contains content that is written like
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573:. Washington, D.C.: OSA: JTu4A.56.
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613:IEEE Photonics Technology Letters
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167:semiconductor device fabrication
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715:(DO-7 / DO-26 / DO-35 / DO-41)
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1123:Packaging (microfabrication)
1105:in transistor packages, etc.
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1091:Through-hole technology
537:10.1145/2990299.2990313
721:(MELF / SOD-80 / LL34)
690:Semiconductor packages
169:. Solder is then
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1081:Printed circuit board
216:RF Analog Performance
176:Small high yielding “
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52:neutral point of view
1066:Electronic packaging
407:(1): 000524–000530.
252:Preliminary optical
163:back end of the line
625:2017IPTL...29..755A
496:2016JIMTW..37..874F
449:2014SPIE.9071E..1IS
370:2013SPIE.8844E..0CA
236:Digital Performance
44:promotional content
1103:voltage regulators
457:10.1117/12.2054360
378:10.1117/12.2024088
220:Multiple measured
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46:and inappropriate
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859:(Super-247) (SMT)
853:(Super-220) (SMT)
727:(SMA / SMB / SMC)
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546:978-1-4503-4535-4
334:10.1115/1.4029245
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60:February 2023
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29:This article
27:
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1050:WL-CSP / WLP
1039:
920:TSOP / HTSOP
829:(DPAK) (SMT)
823:(IPAK) (SMT)
817:(TH / Panel)
811:(TH / Panel)
805:(TH / Panel)
799:(TH / Panel)
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42:by removing
38:Please help
30:
968:QUIP / QUIL
229:S-parameter
210:2.5D and 3D
976:Grid array
915:SOP / SSOP
867:Single row
750:SOT / TSOT
571:Cleo: 2014
261:References
184:material (
40:improve it
1030:Flip Chip
949:QIP / QIL
910:SO / SOIC
900:Flat Pack
895:DIP / DIL
874:SIP / SIL
742:3...5-pin
641:1041-1135
514:1866-6892
421:2380-4505
386:120463545
342:1043-7398
296:2156-3950
202:meta-chip
1117:Category
939:Quad row
883:Dual row
597:14432676
465:53508849
304:36676516
242:bit-rate
178:chiplets
150:) is an
709:(DO-27)
697:Single
649:7455544
621:Bibcode
555:9121042
492:Bibcode
445:Bibcode
366:Bibcode
186:silicon
857:TO-274
851:TO-273
845:TO-268
839:TO-263
833:TO-262
827:TO-252
821:TO-251
815:TO-247
809:TO-220
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797:TO-126
725:DO-214
719:DO-213
713:DO-204
707:DO-201
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156:nodule
1008:Wafer
791:TO-92
785:TO-66
779:TO-39
773:TO-18
699:diode
645:S2CID
593:S2CID
551:S2CID
461:S2CID
382:S2CID
328:(2).
300:S2CID
1045:UICC
988:eWLB
954:PLCC
905:MSOP
793:(TH)
781:(TH)
775:(TH)
769:(TH)
767:TO-8
763:(TH)
761:TO-5
755:TO-3
637:ISSN
583:ISBN
541:ISBN
510:ISSN
441:9071
417:ISSN
405:2012
362:8844
338:ISSN
292:ISSN
1035:PoP
1025:CSP
1021:COG
1018:COF
1015:COB
998:PGA
993:LGA
983:BGA
964:QFP
959:QFN
945:LCC
930:ZIP
890:DFN
731:SOD
629:doi
575:doi
533:doi
500:doi
453:doi
409:doi
374:doi
330:doi
326:137
284:doi
1119::
1040:QP
643:.
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188:,
148:QP
682:e
675:t
668:v
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280:4
146:(
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58:(
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36:.
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